一种兼容多类型功率开关器件的模组化散热IPM装置
The modular design of the IPM device, employing a high thermal conductivity metal alloy heat dissipation module and an adaptive clamping structure, solves the heat dissipation and environmental adaptability problems of traditional IPM devices under high power density, enabling rapid installation, disassembly, and efficient heat dissipation, thus improving the device's versatility and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU WEIHENG INTELLIGENT TECH CO LTD
- Filing Date
- 2025-08-21
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional IPM devices suffer from poor heat dissipation efficiency when facing high power density and stringent thermal management requirements. They are also incompatible with different power levels and device types, leading to extended development cycles and increased costs for customized designs. Furthermore, they are inconvenient to install and maintain and lack flexible heat dissipation strategies.
Design a modular heat dissipation IPM device compatible with multiple types of power switching devices. It adopts a high thermal conductivity metal alloy heat dissipation module, combined with fin array and active heat dissipation equipment. It achieves rapid installation and disassembly through an adaptive clamping structure, is equipped with independent heat dissipation space and electrical isolation circuit, and has environmental protection function.
It improves the versatility and adaptability of the device, reduces production costs, enhances on-site maintenance convenience and electrical safety, ensures stable operation of the device under high-temperature conditions, and solves the heat dissipation and environmental adaptability problems of traditional IPM devices.
Smart Images
Figure CN224521450U_ABST
Abstract
Claims
1. A modular heat dissipation IPM device compatible with multiple types of power switching devices, characterized in that, It includes a heat dissipation module and an integrated structure disposed within the heat dissipation module; The heat dissipation module has a recessed mounting groove on its side opening for placing the integrated structure. The integrated structure includes a power switching device, a PCB board, and an insulating plate that closes the opening of the mounting slot on the side of the heat dissipation module; the power switching device is connected to the PCB board via pins, and the PCB board is provided with adapter pins corresponding to the pins. The adapter pins pass through the insulating plate to realize the connection between the power switching device and the outside. The mounting slot is provided with a heat dissipation insulating sheet and a connector that are connected to the mounting side wall, and the two sides of the power switching device abut against the heat dissipation insulating sheet and the connector.
2. The modular heat dissipation IPM device compatible with multiple types of power switching devices according to claim 1, characterized in that, The mounting slot includes a mounting bottom and mounting sidewalls extending from both sides of the mounting bottom toward the side openings of the heat dissipation module; the heat dissipation insulating sheet is disposed on the mounting sidewalls on both sides.
3. The modular heat dissipation IPM device compatible with multiple types of power switching devices according to claim 2, characterized in that, The connector includes a connecting bottom and an extension arm. The connecting bottom is connected to the mounting bottom, and the extension arm extends from the connecting bottom toward the side opening of the heat dissipation module to form the extension arm. The extension arm and the adjacent mounting sidewall respectively abut against both sides of the power switching device.
4. The modular heat dissipation IPM device compatible with multiple types of power switching devices according to claim 1, characterized in that, The mounting slot extends through both ends of the heat dissipation module, and the openings at the top and bottom ends of the heat dissipation module are covered with sealing plates.
5. The modular heat dissipation IPM device compatible with multiple types of power switching devices according to claim 1, wherein, An active cooling device is connected to the outside of the heat dissipation module.
6. The modular heat dissipation IPM device compatible with multiple types of power switching devices according to claim 3, wherein, The bottom of the connection is fitted and connected to the bottom of the mounting.
7. The modular heat dissipation IPM device compatible with multiple types of power switching devices according to claim 3, characterized in that, The extension arm is inclined from the bottom of the connection toward the mounting sidewall, and the extension arm presses the power switching device toward the mounting sidewall.
8. The modular heat dissipation IPM device compatible with multiple types of power switching devices according to claim 1, wherein, The insulating plate is provided with a connection hole corresponding to the adapter pin for the adapter pin to pass through. The adapter pin passes through the connection hole. The insulating plate connects to the heat dissipation module, closes the side opening of the heat dissipation module, and clamps the PCB board.
9. The modular heat dissipation IPM device compatible with multiple types of power switching devices according to claim 1, wherein, The surface of the heat dissipation module is provided with mounting holes for fixing and installing the insulating plate.
10. The modular heat dissipating IPM device compatible with multiple types of power switching devices according to claim 4, wherein, The sealing plate and the heat dissipation module are coated with sealant and connected by screws.