一种适用于电源模块高压器件的散热结构
By creating mounting slots on the heat sink and setting protruding edge retaining platforms on the thermally conductive insulating plate, the problem of thermal grease leakage was solved, improving the heat dissipation efficiency and safety of high-voltage devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU XIZ TECH CO LTD
- Filing Date
- 2025-08-26
- Publication Date
- 2026-07-17
AI Technical Summary
In existing high-voltage device heat dissipation structures, thermally conductive silicone is prone to leaking from the thermally conductive insulating plate, leading to a decrease in heat transfer performance.
An installation groove is made on the surface of the heat sink, a thermally conductive insulating plate is embedded in the installation groove, and thermally conductive grease is applied to its surface. By setting a protruding edge to engage the recessed platform at the edge of the thermally conductive insulating plate, the thermally conductive grease is ensured to maintain a fixed thickness. The circuit board and the heat sink are connected by bolts to reduce grease leakage.
It improves heat dissipation efficiency, reduces the chance of thermal grease leakage, enhances the contact area and heat exchange effect between the thermally conductive insulation plate and the heat sink, and reduces the risk of damage to low-voltage components when high-voltage components are energized.
Smart Images
Figure CN224521452U_ABST
Abstract
Claims
1. A heat dissipating structure suitable for high voltage devices of a power module, characterized by: The device includes a circuit board (1), a heat sink (2), a thermally conductive insulating plate (3), and a high-voltage component (4). The high-voltage component (4) is mounted on the circuit board (1). The heat sink (2) is connected to the circuit board (1). The heat sink (2) has an installation groove (21). The thermally conductive insulating plate (3) is placed in the installation groove (21). There is a gap between the thermally conductive insulating plate (3) and the inner wall of the installation groove (21). Thermally conductive silicone grease (5) is placed in the gap. The thermally conductive silicone grease (5) is used to fill the gap between the installation groove (21) and the thermally conductive insulating plate (3).
2. The heat dissipation structure for high voltage devices of power modules according to claim 1, characterized in that: The thermally conductive insulating plate (3) has a raised edge (31) on its edge, and a recessed platform (22) is provided in the mounting groove (21). The raised edge (31) is used to be snapped into the recessed platform (22).
3. The heat dissipation structure for high voltage devices of power modules according to claim 2, characterized in that: The circuit board (1) is provided with multiple bolts (11), which pass through the circuit board (1) and are threadedly connected to the heat sink (2).
4. The heat dissipation structure for high voltage devices of power modules according to claim 3, characterized in that: The circuit board (1) and the thermally conductive insulating plate (3) are bonded together.
5. The heat dissipation structure for high voltage devices of power modules according to claim 4, characterized in that: A base (12) is provided on the side of the circuit board (1) away from the high voltage component (4). A groove (32) is provided on the surface of the thermally conductive insulating plate (3) near the circuit board (1). The base (12) is inserted into the groove (32). There is a gap between the base (12) and the inner wall of the groove (32). Thermally conductive grease (5) is provided in the gap.
6. The heat dissipation structure for high voltage devices of power modules according to claim 1, characterized in that: The radiator (2) is equipped with a control circuit board (6), and the control circuit board (6) is equipped with a plurality of low-voltage components (61).
7. The heat dissipation structure for high voltage devices of power modules according to claim 6, characterized in that: The control circuit board (6) is arranged in parallel with the circuit board (1), and there is a gap between the control circuit board (6) and the circuit board (1).
8. The heat dissipation structure for high voltage devices of power modules according to claim 1, characterized in that: The circuit board (1) is bonded and fixed to the thermally conductive insulating plate (3).