一种快速散热的功能放大器
By using a three-stage heat dissipation structure combining graphite blocks and graphite fins with heat-conducting copper pipes and heat-conducting fluid in the amplifier, the problem of low heat transfer efficiency inside the closed amplifier is solved, achieving rapid heat dissipation and stable operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SICHUAN SHENTAI MICROWAVE CO LTD
- Filing Date
- 2025-08-27
- Publication Date
- 2026-07-17
AI Technical Summary
In existing amplifier designs, the heat dissipation efficiency of the core heat source inside enclosed equipment is low. This is mainly due to the redundancy of the airflow conduction path, the thermal resistance effect of the wall, and the local turbulence dead zone, which causes the heat to attenuate layer by layer during the migration process, making it impossible to efficiently and directionally dissipate the heat.
The graphite blocks are tightly attached to the surface of the heating element for zero-gap heat conduction. Combined with graphite fins and heat-conducting copper pipes, a three-stage linkage heat dissipation structure is formed. By utilizing the high thermal conductivity and natural convection of graphite material, and in coordination with the circulation of heat-conducting fluid, rapid heat transfer and even distribution are achieved.
It significantly improves the amplifier's heat dissipation speed and overall efficiency, reduces the risk of local overheating, and ensures the stability and reliability of the equipment under various operating conditions.
Smart Images
Figure CN224521453U_ABST
Abstract
Claims
1. A functional amplifier of fast heat dissipation, comprising an amplifier body (101), characterized in that: A sealing plate (102) is embedded in the middle of the bottom of the amplifier body (101) by bolts. An amplifier circuit board (103) is installed on the top of the sealing plate (102) and inside the amplifier body (101) by bolts. Graphite blocks (104) are attached to the heating elements of the amplifier circuit board (103) by thermal grease. Graphite fins (105) are installed on the top surface inside the amplifier body (101) by bolts.
2. A functional amplifier with fast heat dissipation as claimed in claim 1, characterized in that: The amplifier body (101) has connecting plates (106) fixedly installed on both sides of its bottom. The connecting plates (106) have connecting holes (107) respectively. Bolts pass through the connecting holes (107) to form an integral fixation.
3. A functional amplifier with fast heat dissipation as claimed in claim 2, characterized in that: The graphite fins (105) are perforated by several heat-conducting copper tubes (108) at intervals, and the two ends of the heat-conducting copper tubes (108) extend to the outside of the amplifier body (101).
4. The fast heat dissipation functional amplifier as described in claim 3, characterized in that: The heat-conducting copper tube (108) is filled with heat-conducting liquid, and one end of the heat-conducting copper tube (108) is coiled inside the aluminum alloy fin (110) and then welded to the other end to form a closed loop.
5. A functional amplifier with fast heat dissipation as claimed in claim 4, characterized in that: The aluminum alloy fins (110) are bolted to one side of the top of the base plate (111), and the base plate (111) is bolted to the top of the amplifier body (101).
6. A functional amplifier with fast heat dissipation as claimed in claim 5, characterized in that: A fan bracket (112) is bolted to a point on the top of the base plate (111) adjacent to the aluminum alloy fins (110). A cooling fan (113) is fixedly installed inside the fan bracket (112), and the airflow channel of the fan bracket (112) is connected to the airflow channel of the aluminum alloy fins (110).