An integrated controller and vehicle

Abstract

This utility model discloses an integrated controller and a vehicle. The integrated controller includes a housing with a receiving cavity, and a first circuit board, a second circuit board, and a heat dissipation module housed within the receiving cavity. The heat dissipation module includes a heat dissipation shell, a partition, and a switching valve. The heat dissipation shell abuts against the first and second circuit boards on opposite sides and has a receiving cavity for containing cooling liquid. The partition is located within the receiving cavity and divides the receiving cavity into a first chamber and a second chamber. The partition has an opening for connecting the first and second chambers. The switching valve is located on the partition and blocks the opening, and is used to deform according to the temperature sensed in the second chamber to open the opening. Multiple circuit boards with different functions are integrated in the housing and dissipated through the heat dissipation module. When the temperature sensed by the switching valve in the second chamber exceeds a preset threshold, it deforms to open the opening, allowing liquid to flow into the second chamber through the opening to form a flow loop and improve the heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of control, and in particular to an integrated controller and a vehicle. Background Technology

[0002] With the increasing prevalence of intelligent driving technology, more and more vehicles are equipped with cameras, LiDAR, positioning sensors, and onboard computing devices to achieve intelligent driving functions such as computer-assisted driving. Most vehicles also feature a central control screen for user convenience. To implement assisted driving functions, an assisted driving controller is typically deployed in the vehicle to handle these computing functions. Furthermore, to integrate and centrally control in-cabin displays, interactions, entertainment, air conditioning, sensing, and networking functions, achieving multi-system collaboration and an intelligent experience, a cockpit controller is also typically deployed. Whether it's an assisted driving controller or a cockpit controller, the core component is the internal circuit board. During operation, pre-programmed circuits on the circuit board function to achieve the aforementioned functions and roles.

[0003] Currently, driver assistance controllers and cockpit controllers are installed independently within the vehicle. Both circuit boards generate significant heat during operation, which, if left uncontrolled, can disrupt normal function. Therefore, timely heat dissipation is crucial. Current methods involve separate cooling structures (e.g., separate cooling pipes and water supply sources), but this further complicates the vehicle's internal structure, impacting user experience and causing inconvenience. Utility Model Content To address the aforementioned technical problems, this utility model provides an integrated controller and vehicle that integrates multiple circuit boards and simultaneously dissipates heat from the multiple circuit boards using a heat dissipation module.

[0004] The technical problem solved by this utility model embodiment is addressed by the following technical solution: An integrated controller includes a housing, a first circuit board, a second circuit board, and a heat dissipation module. The housing has a receiving cavity. The first and second circuit boards are both housed within the receiving cavity. The second circuit board and the first circuit board are spaced apart along a first direction. The heat dissipation module includes a heat dissipation shell, a partition, and a switching valve. Along the first direction, opposite sides of the heat dissipation shell abut against the first and second circuit boards, respectively. The heat dissipation shell has a receiving cavity for containing cooling liquid. The partition is disposed within the receiving cavity and divides the receiving cavity into a first chamber and a second chamber. The partition has an opening for connecting the first chamber and the second chamber. The switching valve is disposed on the side of the partition facing the second circuit board and blocks the opening. The switching valve is configured to deform when the temperature in the second chamber exceeds a preset temperature threshold to open the opening.

[0005] In some embodiments, the switching valve includes a flow channel block, a valve body, a piston, and a deformable member. The flow channel block is connected to the valve body and has a through hole communicating with the opening. The piston is movably disposed on the valve body. The deformable member is mounted on the piston and connected to the valve body. The deformable member is configured to deform when the temperature in the second chamber exceeds a preset temperature threshold. When the deformable member senses that the temperature in the second chamber exceeds the preset temperature threshold, the deformable member will deform and drive the piston to move relative to the valve body to open the through hole, which is connected to the opening. Furthermore, when the deformable member senses that the temperature in the second chamber is lower than the preset temperature threshold, the deformable member will restore its deformation and drive the piston to move relative to the valve body to block the through hole.

[0006] In some embodiments, the deformable element includes at least two bimetallic strips, each of which is fitted onto the piston. The deformation directions of adjacent bimetallic strips are opposite, and the ends of each pair of bimetallic strips are welded together. The bimetallic strip closest to the through hole is connected to the valve body, and the bimetallic strip furthest from the through hole is welded to the piston. The bimetallic strips are configured to expand and deform when they sense that the temperature in the second chamber exceeds a preset temperature threshold, thereby driving the piston to move relative to the valve body to open the through hole. And when they sense that the temperature in the second chamber is lower than the preset temperature threshold, they recover their deformation, thereby driving the piston to move relative to the valve body to block the through hole.

[0007] In some embodiments, the switching valve further includes a guide rod disposed on the inner wall surface of the valve body facing the through hole along the movement direction of the piston. The piston is provided with a guide hole, and the guide rod is inserted into the guide hole. The guide rod is used to guide the piston to move in a specific direction.

[0008] In some embodiments, the valve body is provided with at least one opening communicating with the second chamber, the opening being for allowing liquid contained in the second chamber to enter the valve body; and / or, the flow channel block is provided with a liquid inlet channel communicating with the through hole, and the central axis of the liquid inlet channel is perpendicular to the central axis of the through hole.

[0009] In some embodiments, the integrated controller further includes a first thermal conductive component, the opposite sides of which abut against the first circuit board and the heat dissipation module, the first thermal conductive component being used to transfer the heat dissipated by the first circuit board to the heat dissipation module.

[0010] In some embodiments, the first heat-conducting component includes a first heat-spreading plate and a first heat-conducting medium. The two opposite ends of the first heat-spreading plate abut against the first circuit board and the heat dissipation module, respectively. The two opposite ends of the first heat-conducting medium abut against the heat dissipation module and the first circuit board, respectively. The first heat-conducting medium is provided with a first clearance opening, and the first heat-spreading plate is disposed within the first clearance opening.

[0011] In some embodiments, the integrated controller further includes a second thermal conductive component, the two opposite sides of which abut against the second circuit board and the heat dissipation module, respectively, and the second thermal conductive component is used to transfer the heat dissipated by the second circuit board to the heat dissipation module.

[0012] In some embodiments, the second heat-conducting component includes a second heat-spreading plate and a second heat-conducting medium. The two opposite ends of the second heat-spreading plate abut against the second circuit board and the heat dissipation module, respectively. The two opposite ends of the second heat-conducting medium abut against the heat dissipation module and the second circuit board, respectively. The second heat-conducting medium is provided with a second clearance opening, and the second heat-spreading plate is disposed within the second clearance opening.

[0013] The technical problem solved by this utility model embodiment also adopts the following technical solution: A vehicle includes a vehicle body and the aforementioned integrated controller, the integrated controller being installed within the vehicle body.

[0014] The beneficial effects of this utility model embodiment are as follows: The integrated controller provided in this application embodiment includes a housing, a first circuit board, a second circuit board, and a heat dissipation module. The housing is provided with a receiving cavity; the first circuit board is housed in the receiving cavity; the second circuit board is housed in the receiving cavity, and the second circuit board and the first circuit board are spaced apart along a first direction; the heat dissipation module includes a heat dissipation shell, a partition, and a switching valve. Along the first direction, the opposite sides of the heat dissipation shell abut against the first circuit board and the second circuit board, respectively. The heat dissipation shell is provided with a receiving cavity for containing cooling liquid. The partition is provided in the receiving cavity and divides the receiving cavity into a first chamber and a second chamber. The partition is provided with an opening for connecting the first chamber and the second chamber. The switching valve is provided on the side of the partition facing the second circuit board, and the switching valve blocks the opening. The switching valve is configured to deform when the temperature in the sensed second chamber exceeds a preset temperature threshold to open the opening. The integrated controller using the above structure can integrate multiple circuit boards with different functions in the housing and dissipate heat from multiple circuit boards through the heat dissipation module. Furthermore, the switching valve of the heat dissipation module can deform to open the opening based on whether the temperature in the second chamber exceeds a preset threshold, thereby allowing the coolant to flow into the second chamber when the temperature is high, forming a flow loop to improve the heat dissipation effect, which is quite convenient to use. Attached Figure Description

[0015] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0016] Figure 1 This is a schematic diagram of the structure of an integrated controller according to one embodiment of this application; Figure 2 yes Figure 1 A sectional view; Figure 3 yes Figure 1 Exploded view of the structure; Figure 4 This is a cross-sectional view of a heat dissipation module according to one embodiment of this application; Figure 5 This is an exploded view of a heat dissipation module according to one embodiment of this application; Figure 6 This is a schematic diagram of the structure of a switching valve according to one embodiment of this application; Figure 7 yes Figure 6 A sectional view; Figure 8 yes Figure 6 Exploded view of the switching valve; In the diagram: 1. Integrated controller; 2. Housing; 3. First circuit board; 4. Second circuit board; 5. Heat dissipation module; 6. First heat-conducting component; 7. Second heat-conducting component; 201. Storage cavity; 202. First notch; 203. Second notch; 21. First shell; 22. Second shell; 23. Middle frame; 211. First protruding edge; 212. First fixing protrusion; 213. First heat dissipation fin; 221. Second protruding edge; 222. Second fixing protrusion; 223. Second heat dissipation fin; 231. Connecting column; 2121, First connecting hole; 2221, Second connecting hole; 31. Intelligent Driving Low-Speed ​​Connector Port; 32. Intelligent Driving Ethernet Connector Port; 33. Intelligent Driving Video Connector Port; 41. Cockpit low-speed connector port; 42. Cockpit Ethernet connector port; 43. Cockpit video connector port; 51. Heat sink; 52. Partition plate; 53. Switch valve; 511. Shell body; 512. Shell cover; 501. Receptacle; 502. Liquid inlet; 503. First outlet; 504. Second outlet; 505. Baffle bar; 5011, First chamber; 5012, Second chamber; 521, Opening; 5111, First connecting pipe; 5112, Second connecting pipe; 531. Flow channel block; 532. Valve body; 533. Piston; 534. Deformable part; 535. Guide rod; 5311. Through hole; 5312. Liquid inlet channel; 5313. Lateral insertion hole; 5321, Opening; 5331, Guide hole; 5341, Bimetallic strip; 61. First heat spreader; 62. First heat transfer medium; 621. First clearance opening; 71. Second heat spreader; 72. Second heat transfer medium; 721. Second clearance opening. Detailed Implementation

[0017] To facilitate understanding of this utility model, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0018] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0019] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0020] like Figures 1-3 As shown, an integrated controller 1 provided in one embodiment of this application includes a housing 2, a first circuit board 3, a second circuit board 4, and a heat dissipation module 5. The housing 2 is provided with a receiving cavity 201. The first circuit board 3, the second circuit board 4, and the heat dissipation module 5 are all housed in the receiving cavity 201. The first circuit board 3 and the second circuit board 4 are spaced apart along a first direction X. The heat dissipation module 5 is located between the first circuit board 3 and the second circuit board 4. The heat dissipation module 5 is used to dissipate heat from the first circuit board 3 and the second circuit board 4.

[0021] Specifically, such as Figure 4As shown, the heat dissipation module 5 includes a heat dissipation shell 51, a partition 52, and a switching valve 53. Along the first direction X, the opposite sides of the heat dissipation shell 51 abut against the first circuit board 3 and the second circuit board 4, respectively. The heat dissipation shell 51 is provided with a accommodating cavity 501 for accommodating coolant. The partition 52 is disposed in the accommodating cavity 501 and divides the accommodating cavity 501 into a first chamber 5011 and a second chamber 5012. The partition 52 is provided with an opening 521 for connecting the first chamber 5011 and the second chamber 5012. The switching valve 53 is disposed on the side of the partition 52 facing the second circuit board 4 and blocks the opening 521. The switching valve 53 is configured to deform when the temperature in the second chamber 5012 exceeds a preset temperature threshold to open the opening 521.

[0022] The integrated controller 1 of this application embodiment can integrate multiple circuit boards with different functions within the housing 2, and dissipate heat from these circuit boards through the heat dissipation module 5. Furthermore, the switching valve 53 of the heat dissipation module 5 can deform according to whether the temperature in the second chamber 5012 exceeds a preset threshold, thereby opening the opening 521. This allows the high-pressure cooling liquid in the first chamber 5011 to flow into the second chamber 5012 through the opening 521, forming a flow loop. This accelerates the absorption of heat from the second circuit board 4 near the second chamber 5012, improving heat dissipation efficiency and making it more convenient to use.

[0023] Understandably, the specific functions of the first circuit board 3 and the second circuit board 4 can be set according to actual needs. For example, the first circuit board 3 can be a circuit board for implementing the function of an assisted driving controller, and the second circuit board 4 can be a circuit board for implementing the function of a cockpit controller. Alternatively, the first circuit board 3 can also be a circuit board for implementing the function of a cockpit controller, and the second circuit board 4 can also be a circuit board for implementing the function of an assisted driving controller. It should be noted that the first circuit board 3 and the second circuit board 4 are not limited to the functions mentioned here; they can also have other functions.

[0024] In some embodiments, the first circuit board 3 is a circuit board for implementing a driver assistance controller, which includes multiple connector ports, namely a smart driving low-speed connector port 31, a smart driving Ethernet connector port 32, and a smart driving video connector port 33, with the smart driving Ethernet connector port 32 located between the smart driving video connector port 33 and the smart driving low-speed connector port 31. Components on the first circuit board 3 that generate significant heat (such as computing chips) are arranged facing the side where the heat dissipation module 5 is located, so that the heat dissipation module 5 can dissipate heat from the first circuit board 3.

[0025] The second circuit board 4 is a circuit board used to implement the functions of the cockpit controller. It also includes multiple connector ports, namely cockpit low-speed connector port 41, cockpit Ethernet connector port 42 and cockpit video connector port 43. Cockpit Ethernet connector port 42 is located between cockpit low-speed connector port 41 and cockpit video connector port 43.

[0026] In some embodiments, such as Figure 1 and Figure 3 As shown, the housing 2 includes a first housing 21, a second housing 22, and a middle frame 23. The first housing 21 and the second housing 22 are spaced apart along a first direction X. The middle frame 23 is disposed between the first housing 21 and the second housing 22. The first housing 21, the second housing 22, and the middle frame 23 are joined together to form a storage cavity 201. The first housing 21 has multiple first notches 202 for multiple connector ports of the first circuit board 3 to extend out. The second housing 22 has multiple second notches 203 for multiple connector ports of the second circuit board 4 to extend out. In this embodiment, please refer to... Figure 1 and Figure 3 The first housing 21 is provided with a first protruding edge 211 protruding from the outer wall of the first housing 21. The first protruding edge 211 and the first notch 202 are located on the same side of the first housing 21, and the protrusion of the first protruding edge 211 relative to the outer wall of the first housing 21 is greater than the protrusion of the multiple connector ports of the first circuit board 3 from the first notch 202. The second housing 22 is provided with a second protruding edge 221 protruding from the outer wall of the second housing 22. The second protruding edge 221 and the second notch 203 are located on the same side of the second housing 22. The protrusion of the second protruding edge 221 relative to the outer wall of the second housing 22 is greater than the protrusion of the multiple connector ports of the second circuit board 4 from the second notch 203. The first protruding edge 211 is used to reduce the risk of the connector ports of the first circuit board 3 being damaged by impact, and the second protruding edge 221 is used to reduce the risk of the connector ports of the second circuit board 4 being damaged by bumps.

[0027] Understandably, since the first protruding edge 211 and the second protruding edge 221 come into contact with the outside world first, they can act as a barrier, reducing the risk of direct collision between the connector port of the first circuit board 3 and the connector port of the second circuit board 4, which is beneficial to improving the user experience of the integrated controller 1. The connection method between the first housing 21, the second housing 22, and the middle frame 23 is not limited. The required connection method can be selected as needed, such as by bolts, clips, or adhesive, as long as it achieves the interconnection and fixation of the first housing 21, the second housing 22, and the middle frame 23 to form the storage cavity 201. Furthermore, the contact surfaces between the first housing 21 and the second housing 22 and the middle frame 23 need to be sealed to prevent external liquids, dust, or other foreign objects from entering the storage cavity 201.

[0028] In some embodiments, such as Figure 3 As shown, the first housing 21 is provided with a plurality of first fixing protrusions 212, each of which is provided with a first connecting hole 2121. The second housing 22 is provided with a plurality of second fixing protrusions 222, each of which is provided with a second connecting hole 2221. The middle frame 23 is provided with a plurality of hollow connecting posts 231. A first connecting hole 2121 and a second connecting hole 2221 are aligned with the connecting post 231 and are connected by bolts.

[0029] It is worth noting that in some embodiments, the middle frame 23 of the housing 2 can be omitted. In this case, the housing 2 includes a first housing 21 and a second housing 22. The first housing 21 and the second housing 22 together form a storage cavity 201. Both the first housing 21 and the second housing 22 need to have recessed spaces.

[0030] In some embodiments, such as Figure 3 As shown, the first housing 21 is provided with a plurality of first heat dissipation fins 213, which are located on the side of the first housing 21 opposite to the second housing 22. The plurality of first heat dissipation fins 213 are used to increase the contact area between the first housing 21 and the air, thereby improving heat dissipation efficiency. Similarly, the second housing 22 is provided with a plurality of second heat dissipation fins 223, which are located on the side of the second housing 22 opposite to the first housing 21. The plurality of second heat dissipation fins 223 are used to increase the contact area with the air, thereby improving heat dissipation efficiency.

[0031] In some embodiments, please combine Figure 3 , Figure 4 and Figure 5 The aforementioned heat sink 51 includes a main body 511 and a cover 512 connected together. The main body 511 and the cover 512 together form a cavity 501 for containing coolant. The connection between the main body 511 and the cover 512 needs to be sealed to prevent coolant leakage. Various sealing methods can be used, such as using a sealing ring or filling with sealant, as long as it prevents coolant leakage from the connection between the main body 511 and the cover 512.

[0032] In some embodiments, such as Figure 5 As shown, the shell body 511 is provided with a liquid inlet 502, a first outlet 503, and a second outlet 504. Both the liquid inlet 502 and the first outlet 503 are connected to the first chamber 5011, and the second outlet 504 is connected to the second chamber 5012. The liquid inlet 502 is used to introduce high-pressure cooling liquid into the first chamber 5011, the first outlet 503 is used to discharge the cooling liquid from the first chamber 5011 to the shell body 511, and the second outlet 504 is used to discharge the cooling liquid from the second chamber 5012. In this embodiment, the liquid inlet 502, the first outlet 503, and the second outlet 504 are all located on the same side of the shell body 511 and are spaced apart.

[0033] In some embodiments, such as Figure 4 and Figure 5 As shown, a blocking strip 505 is provided on the side of the shell body 511 facing the shell cover 512. The liquid inlet 502 is located on one side of the blocking strip 505, and the first outlet 503 and the second outlet 504 are both located on the other side of the blocking strip 505. The blocking strip 505 is used to block the cooling liquid, preventing the liquid from flowing directly out of the first outlet 503 after entering through the liquid inlet 502. In this embodiment, in order to facilitate connection with the outside, the shell body 511 is provided with a first connecting pipe 5111 and a second connecting pipe 5112. The first connecting pipe 5111 and the second connecting pipe 5112 are spaced apart. The first connecting pipe 5111 is connected to the liquid inlet 502, and the second connecting pipe 5112 is connected to the first outlet 503 and the second outlet 504.

[0034] In some embodiments, such as Figure 4 As shown, the partition 52 is connected to the shell body 511 and abuts against the blocking strip 505. The partition 52 is located between the shell cover 512 and the bottom surface of the shell body 511, and the four edges of the partition 52 are fixedly connected to the inner sidewall of the shell body 511, so that the partition 52 divides the space of the shell body 511 into a first chamber 5011 and a second chamber 5012, and the opening 521 of the partition 52 connects the first chamber 5011 and the second chamber 5012. That is, the first chamber 5011 and the second chamber 5012 are only connected through the opening 521, and the cooling liquid can only flow from the first chamber 5011 into the second chamber 5012 through the opening 521. In this embodiment, the first chamber 5011 is connected to the first outlet 503, and the second chamber 5012 is connected to the second outlet 504, and each drains independently.

[0035] In some embodiments, such as Figures 6-8As shown, the switching valve 53 includes a flow channel block 531, a valve body 532, a piston 533, and a deformable member 534. The flow channel block 531 is connected to the valve body 532 and has a through hole 5311 communicating with the opening 521. The piston 533 is movably disposed on the valve body 532 and inserted into the through hole 5311. The deformable member 534 is installed on the piston 533 and connected to the valve body 532. The deformable member 534 is configured to deform when the external temperature exceeds a preset temperature threshold. In this embodiment, the flow channel block 531 has a lateral insertion hole 5313 on the side facing the valve body 532, and the piston 533 is movably inserted into the lateral insertion hole 5313.

[0036] When the deformable component 534 senses that the temperature inside the second chamber 5012 exceeds a preset temperature threshold, the deformable component 534 will deform and drive the piston 533 to move relative to the valve body 532 to open the through hole 5311, which is connected to the opening 521. Conversely, when the deformable component 534 senses that the temperature inside the second chamber 5012 is lower than the preset temperature threshold, the deformable component 534 will return to its original shape and drive the piston 533 to move in the opposite direction relative to the valve body 532 to block the through hole 5311. In other words, the deformable component 534 determines whether to deform based on the temperature change inside the second chamber 5012, thereby controlling whether the cooling liquid needs to enter the second chamber 5012 to remove heat and accelerate heat dissipation.

[0037] In use, the integrated controller 1 is installed in the vehicle's high-pressure cooling circulation system. The vehicle's high-pressure cooling circulation system continuously delivers high-pressure cooling liquid to the first chamber 5011 through the liquid inlet 502. The liquid in the first chamber 5011 absorbs the heat transferred from the first circuit board 3 through the heat sink 51 and flows out from the first outlet 503, thus forming a liquid flow loop to carry away the heat of the first circuit board 3, thereby ensuring that the temperature of the first circuit board 3 does not become too high. When the second circuit board 4 is working and generating heat, the heat emitted by the second circuit board 4 is transferred to the surface of the heat sink 51 to heat the cooling liquid in the second chamber 5012. Since the deformable part 534 is immersed in the cooling liquid in the second chamber 5012, the temperature of the cooling liquid in the second chamber 5012 in the heat sink 51 rises. When the temperature of the cooling liquid in the second chamber 5012 rises to exceed the preset temperature threshold, the deformable part 534 deforms and drives the piston 533 to move to open the through hole 5311, so that the through hole 5311 is connected with the opening 521. The high-pressure cooling liquid in the first chamber 5011 enters the second chamber 5012. The cooling liquid flowing into the second chamber 5012 indirectly absorbs the heat emitted by the second circuit board 4 through the heat sink 51 and flows out from the second output port 504, that is, a liquid flow circuit is formed in the second chamber 5012, thereby playing the role of heat dissipation for the second circuit board 4.

[0038] In some embodiments, such as Figure 7 and Figure 8 As shown, the flow channel block 531 is provided with a liquid inlet channel 5312 that communicates with the through hole 5311, and the central axis of the liquid inlet channel 5312 is perpendicular to the central axis of the through hole 5311. The liquid inlet channel 5312 is used to allow the cooling liquid to flow into the second chamber 5012 more quickly, so as to avoid the liquid from being blocked due to the contact between the shell cover 512 and the surface of the flow channel block 531.

[0039] In some embodiments, such as Figure 7 and Figure 8 As shown, the valve body 532 is provided with at least one opening 5321 communicating with the second chamber 5012. The opening 5321 is used to allow cooling liquid contained in the second chamber 5012 to enter the valve body 532, thereby immersing the deformable part 534 in the cooling liquid. This allows the deformable part 534 to determine whether the through hole 5311 needs to be opened based on the temperature of the cooling liquid. In this embodiment, the valve body 532 is a hollow frame, and openings 5321 are provided on both opposite sides of the valve body 532. In some embodiments, such as Figures 6-8 As shown, the deformable component 534 includes at least two bimetallic strips 5341, each bimetallic strip 5341 being sleeved on the piston 533. The deformation directions of two adjacent bimetallic strips are opposite, and the ends of each pair of bimetallic strips 5341 are welded together. The bimetallic strip 5341 closest to the through hole 5311 is connected to the valve body 532, and the bimetallic strip 5341 furthest from the through hole 5311 is welded to the piston 533. The bimetallic strip 5341 is configured to expand and deform when it senses that the temperature of the cooling liquid in the second chamber 5012 exceeds a preset temperature threshold, so as to drive the piston 533 to move relative to the valve body 532 to open the through hole 5311, and to restore its deformation when it senses that the temperature in the second chamber 5012 is lower than the preset temperature threshold, so as to drive the piston 533 to move relative to the valve body 532 to block the through hole 5311.

[0040] Understandably, the number of bimetallic strips 5341 can be determined as needed, such as two, four, or six, as long as they can deform to change the position of piston 533 based on whether the temperature of the cooling liquid in the second chamber 5012 exceeds the preset temperature threshold.

[0041] In some embodiments, such as Figure 7 and Figure 8As shown, there are six bimetallic strips 5341, all of which are fitted onto the piston 533. The ends of every two bimetallic strips 5341 are welded together, and the deformation directions of adjacent bimetallic strips 5341 are opposite. In the direction of the central axis of the piston 533, the bimetallic strip 5341 closest to the through hole 5311 is welded to the valve body 532 but not to the piston 533, while the bimetallic strip furthest from the through hole 5311 is welded to the piston 533. The four middle bimetallic strips 5341 are welded together and can all move relative to the piston 533. Thus, when the temperature of the cooling liquid in the second chamber 5012 exceeds a preset temperature threshold, the bimetallic strip 5341 closest to the through hole 5311 bends and deforms in a direction away from the through hole 5311, thereby driving the piston 533 to move away from the through hole 5311 to open the through hole 5311. And when the temperature of the cooling liquid in the second chamber 5012 is lower than the preset temperature threshold, the bimetallic strip 5341 furthest from the through hole 5311 restores its deformation, thereby driving the piston 533 to move closer to the through hole 5311 to block the through hole 5311.

[0042] In some embodiments, there are two bimetallic strips 5341, both of which are sleeved on the piston 533. The ends of the two bimetallic strips 5341 are welded to each other, and the deformation directions of the two bimetallic strips 5341 are opposite. In the direction of the central axis of the piston 533, the bimetallic strip 5341 closest to the through hole 5311 is welded to the valve body 532 but not to the piston 533, while the bimetallic strip furthest from the through hole 5311 is welded to the piston 533. It is worth noting that, in addition to the bimetallic strip 5341, the deformable part 534 can also be any other part that deforms due to thermal expansion, as long as it can deform when the temperature reaches a preset threshold to drive the piston 533 to move. For example, the deformable part 534 can be made of a shape memory alloy (such as a nickel-titanium alloy). Springs made of this type of alloy can have a length memory function, which can also achieve displacement control when the temperature changes.

[0043] In some embodiments, such as Figure 7 and Figure 8 As shown, the switching valve 53 also includes a guide rod 535. Along the movement direction of the piston 533, the guide rod 535 is disposed on the inner wall surface of the valve body 532 facing the through hole 5311. The piston 533 is provided with a guide hole 5331, and the guide rod 535 is inserted into the guide hole 5331. The guide rod 535 is used to guide the piston 533 to move in a specific direction. Thus, guided by the guide rod 535, the piston 533 will move in a specific direction along the central axis of the guide rod 535 to open or block the through hole 5311.

[0044] In the integrated controller 1 of this application embodiment, the switching valve 53 of the heat dissipation module 5 deforms to open the opening 521 according to whether the liquid temperature in the second chamber 5012 exceeds a preset threshold. Thus, when the liquid temperature is high, the opening 521 is automatically opened to allow the cooling liquid in the first chamber 5011 to flow into the second chamber 5012, thereby improving the heat dissipation efficiency.

[0045] In some embodiments, please refer again Figure 2 and Figure 3 The integrated controller 1 also includes a first heat-conducting component 6. The opposite sides of the first heat-conducting component 6 abut against the first circuit board 3 and the heat dissipation module 5, respectively. The first heat-conducting component 6 is used to transfer the heat dissipated by the first circuit board 3 to the heat dissipation module 5. In this embodiment, the first heat-conducting component 6 includes a first heat-spreading plate 61 and a first heat-conducting medium 62. The opposite end faces of the first heat-spreading plate 61 abut against the first circuit board 3 and the heat dissipation module 5, respectively. The first heat-conducting medium 62 is provided with a first clearance opening 621, and the first heat-spreading plate 61 is disposed within the first clearance opening 621. Thus, compared to the method of direct contact between the first circuit board 3 and the heat dissipation module 5 for heat dissipation, this embodiment uses the first heat-spreading plate 61 and the first heat-conducting medium 62 to indirectly conduct the heat generated by the first circuit board 3 during operation to the heat dissipation module 5, which can improve heat dissipation efficiency.

[0046] In some embodiments, such as Figure 2 and Figure 3 As shown, the integrated controller 1 also includes a second heat-conducting component 7. The two opposite sides of the second heat-conducting component 7 abut against the second circuit board 4 and the heat dissipation module 5, respectively. The second heat-conducting component 7 is used to transfer the heat dissipated by the second circuit board 4 to the heat dissipation module 5. In this embodiment, the second heat-conducting component 7 includes a second heat-spreading plate 71 and a second heat-conducting medium 72. The two opposite end faces of the second heat-spreading plate 71 abut against the second circuit board 4 and the heat dissipation module 5, respectively. The second heat-conducting medium 72 is provided with a second clearance opening 721, and the second heat-spreading plate 71 is disposed within the second clearance opening 721. Thus, compared to the method of direct contact between the second circuit board 4 and the heat dissipation module 5 for heat dissipation, this embodiment uses the second heat-spreading plate 71 and the second heat-conducting medium 72 to indirectly conduct the heat generated by the second circuit board 4 during operation to the heat dissipation module 5, which can improve heat dissipation efficiency.

[0047] The first heat spreader 61 and the second heat spreader 71 are efficient two-dimensional homogeneous heat dissipation elements based on phase change heat transfer. The core principle is to achieve rapid and uniform heat diffusion by utilizing the evaporation and condensation cycle of the working fluid. The structure of the first heat spreader 61 and the second heat spreader 71 adopts the existing heat spreader structure, and its specific internal structure will not be described in detail here. The specific engineering process is as follows: The bottom (evaporation zone) of the first heat spreader 61 or the second heat spreader 71 is affected by the heat generated by the circuit board (including the first circuit board 3 or the second circuit board 4) during operation. The liquid working fluid in its capillary structure absorbs heat and quickly turns into vapor. Driven by the pressure difference, the vapor quickly diffuses to the lower temperature area (condensation zone) and releases heat upon contact with the cold wall, condensing into liquid. At this time, the heat is conducted to the heat dissipation module 5 through the outer surface of the first heat spreader 61 or the second heat spreader 71. The condensed liquid flows along the capillary structure to the evaporation zone under the action of capillary force. This cycle is repeated, and the heat is continuously conducted out. Finally, the heat is conducted away through the coolant in the heat dissipation module 5 to achieve the effect of cooling the integrated controller 1.

[0048] Both the first thermally conductive medium 62 and the second thermally conductive medium 72 are made of materials that can conduct heat efficiently and form a solid shape, avoiding significant softening, deformation, or even liquefaction at high temperatures. For example, the first thermally conductive medium 62 or the second thermally conductive medium 72 can be thermally conductive silicone, thermally conductive gel, or thermally conductive putty.

[0049] The partition 52 is made of a material with low thermal conductivity and a certain degree of hardness. This helps to prevent the heat of the cooling liquid in the first chamber 5011 from being directly transferred to the second chamber 5012 through the partition 52, and can reduce the risk of deformation caused by high pressure impact of the cooling liquid.

[0050] In some embodiments, the integrated controller 1 further includes a cooling fan (not shown), which is detachably mounted on the housing 2 and has its exhaust end facing the housing 2. The cooling fan is used to increase the airflow rate to improve heat dissipation efficiency.

[0051] Another embodiment of this application provides a vehicle including a vehicle body and an integrated controller 1 as described in the above embodiments, wherein the integrated controller 1 is installed inside the vehicle body.

[0052] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. An integrated controller characterized by, include: The casing has a storage cavity; The first circuit board is housed within the receiving cavity; The second circuit board is housed within the receiving cavity, and the second circuit board and the first circuit board are spaced apart along a first direction; A heat dissipation module includes a heat sink, a partition, and a switching valve. Along the first direction, the heat sink abuts against the first circuit board and the second circuit board on opposite sides, respectively. The heat sink has a accommodating cavity for containing cooling liquid. The partition is disposed within the accommodating cavity and divides the accommodating cavity into a first chamber and a second chamber. The partition has an opening for connecting the first chamber and the second chamber. The switching valve is disposed on the side of the partition facing the second circuit board and blocks the opening. The switching valve is configured to deform when the temperature in the second chamber exceeds a preset temperature threshold to open the opening.

2. The integrated controller of claim 1, wherein, The switching valve includes a flow channel block, a valve body, a piston, and a deformable component. The flow channel block is connected to the valve body and has a through hole communicating with the opening. The piston is movably disposed on the valve body. The deformable component is installed on the piston and connected to the valve body. The deformable component is configured to deform when the temperature in the second chamber exceeds a preset temperature threshold. When the deformable component senses that the temperature inside the second chamber exceeds a preset temperature threshold, the deformable component will deform and drive the piston to move relative to the valve body to open the through hole, which is connected to the opening; and when the deformable component senses that the temperature inside the second chamber is lower than the preset temperature threshold, the deformable component will restore its deformation and drive the piston to move relative to the valve body to block the through hole.

3. The integrated controller of claim 2, wherein, The deformable component includes at least two bimetallic strips, each of which is fitted onto the piston. The deformation directions of adjacent bimetallic strips are opposite, and the ends of each pair of bimetallic strips are welded together. The bimetallic strip closest to the through hole is connected to the valve body, and the bimetallic strip furthest from the through hole is welded to the piston. The bimetallic strips are configured to expand and deform when they sense that the temperature in the second chamber exceeds a preset temperature threshold, thereby driving the piston to move relative to the valve body to open the through hole. When they sense that the temperature in the second chamber is lower than the preset temperature threshold, they return to their original shape, thereby driving the piston to move relative to the valve body to block the through hole.

4. The integrated controller of claim 2, wherein, The switching valve further includes a guide rod, which is disposed on the inner wall surface of the valve body facing the through hole along the movement direction of the piston. The piston is provided with a guide hole, and the guide rod is inserted into the guide hole. The guide rod is used to guide the piston to move in a specific direction. Alternatively, the heat sink may be provided with a liquid inlet, a first outlet, and a second outlet, wherein the liquid inlet and the first outlet are both connected to the first chamber, and the second outlet is connected to the second chamber.

5. The integrated controller of claim 2, wherein, The valve body is provided with at least one opening communicating with the second chamber, the opening being used to allow liquid contained in the second chamber to enter the valve body; And / or, the flow channel block is provided with a liquid inlet channel communicating with the through hole, and the central axis of the liquid inlet channel is perpendicular to the central axis of the through hole.

6. The integrated controller of claim 1, wherein, The integrated controller further includes a first heat-conducting component, with its opposite sides abutting against the first circuit board and the heat dissipation module, respectively. The first heat-conducting component is used to transfer the heat dissipated by the first circuit board to the heat dissipation module.

7. The integrated controller of claim 6, wherein, The first heat-conducting component includes a first heat-spreading plate and a first heat-conducting medium. The two opposite ends of the first heat-spreading plate abut against the first circuit board and the heat dissipation module, respectively. The two opposite ends of the first heat-conducting medium abut against the heat dissipation module and the first circuit board, respectively. The first heat-conducting medium is provided with a first clearance opening, and the first heat-spreading plate is disposed in the first clearance opening.

8. The integrated controller of claim 1, wherein, The integrated controller further includes a second heat-conducting component, with its opposite sides abutting against the second circuit board and the heat dissipation module, respectively. The second heat-conducting component is used to transfer the heat dissipated by the second circuit board to the heat dissipation module.

9. The integrated controller of claim 8, wherein, The second heat-conducting component includes a second heat-spreading plate and a second heat-conducting medium. The two opposite ends of the second heat-spreading plate abut against the second circuit board and the heat dissipation module, respectively. The two opposite ends of the second heat-conducting medium abut against the heat dissipation module and the second circuit board, respectively. The second heat-conducting medium is provided with a second clearance opening, and the second heat-spreading plate is disposed in the second clearance opening.

10. A vehicle characterized by comprising: It includes a vehicle body and an integrated controller as described in any one of claims 1-9, wherein the integrated controller is installed within the vehicle body.

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