电磁屏蔽模块及光电装置
By using a snap-fit design for the cover and frame and a metal material, the problem of electromagnetic shielding structures in electronic products becoming loose in vibration environments is solved, improving structural strength and electromagnetic interference suppression capabilities, and meeting market standards.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- EXCELLENCE OPTO INC
- Filing Date
- 2025-06-09
- Publication Date
- 2026-07-17
AI Technical Summary
Existing electronic products have difficulty simultaneously improving the strength of electromagnetic shielding structures and the ability to prevent electromagnetic interference in their structural design, making them prone to loosening or falling apart, especially in environments with vibration or shaking.
The design employs a snap-fit structure for the cover and frame. By combining the first and second snap-fit structures and utilizing the overlapping and snap-fit of the first and second spring arms, the structural strength of the electromagnetic shielding module is enhanced. Metal or alloy materials are used to improve the stability of the connection.
The structural strength of the electromagnetic shielding module has been improved, ensuring that it is not easily loosened in vibration or shaking environments. It conforms to the radiation characteristics, conduction characteristics, spectrum distribution, interference suppression and anti-interference capabilities of electromagnetic interference, and meets market standards.
Smart Images
Figure CN224521458U_ABST
Abstract
Claims
1. An electromagnetic shielding module, characterized by The electromagnetic shielding module includes: A cover body, including a first sidewall and a first snap-fit structure, the first snap-fit structure being located on the first sidewall, the first snap-fit structure including a first slot and a first spring arm, the first spring arm being connected to the edge of the first slot and extending protruding beyond the first inner wall surface of the first sidewall; and The frame can be combined with the cover. The frame includes a second sidewall and a second snap-fit structure. The second snap-fit structure is located on the second sidewall. The second snap-fit structure includes a second slot and a second spring arm. The second spring arm is connected to the periphery of the second slot and extends out of the second inner wall surface of the second sidewall. When the cover and the frame are brought close to each other by a force until the first snap-fit structure and the second snap-fit structure are combined, the first spring arm and the second spring arm overlap and engage with each other.
2. The electromagnetic shielding module of claim 1, wherein, The first spring arm extends upward in a vertical direction, and the second spring arm extends upward in the same vertical direction.
3. The electromagnetic shielding module of claim 1, wherein, The frame also includes at least one protrusion located on the outer wall surface of the second side wall, and when the first buckle structure and the second buckle structure are engaged, the at least one protrusion abuts against the first inner wall surface.
4. The electromagnetic shielding module of claim 1, wherein, The cover also includes a top plate, which has at least one through hole.
5. The electromagnetic shielding module of claim 1, wherein, The frame also includes a top wall connected to the second side wall, and the top wall has at least one opening.
6. The electromagnetic shielding module of claim 1, wherein, The cover and the frame are made of metal or alloy.
7. The electromagnetic shielding module of claim 1, wherein, The cover and the frame are made of tinplate, white copper, or galvanized steel.
8. An optoelectronic device, characterized by The optoelectronic device includes: A circuit board containing multiple electronic components; and The electromagnetic shielding module as described in any one of claims 1 to 7 is disposed on the circuit board and covers at least one of the plurality of electronic components.