An external protection structure for an RTC chip

By using a multi-layered composite material protective structure, including a metal shielding layer, an insulating layer, a moisture-proof layer, and a shock-absorbing structure, the problem of a single protective structure for RTC chips is solved, achieving all-round protection for RTC chips and improving their reliability and service life.

CN224521460UActive Publication Date: 2026-07-17NANJING XINGDINGSHENG ELECTRICAL CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
NANJING XINGDINGSHENG ELECTRICAL CO LTD
Filing Date
2025-07-15
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing RTC chip protection structures typically only provide a single protection function and lack multiple protection effects, resulting in a high risk of failure during chip use.

Method used

The protective structure employs a multi-layered composite material, including a metal shielding layer, an insulation layer, a moisture-proof layer, and a shock-absorbing cushioning structure, combined with a sealing structure to form a comprehensive protection mechanism. The metal shielding layer is made of aluminum alloy, the insulation layer is made of polytetrafluoroethylene (PTFE), the moisture-proof layer is made of silicone, the shock-absorbing cushioning structure uses rubber cushioning pads, and the sealing structure uses epoxy resin sealant.

Benefits of technology

It effectively resists the effects of static electricity, electromagnetic interference, physical shock and humid environment, improves the reliability and lifespan of RTC chip and reduces the risk of failure.

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Abstract

This utility model belongs to the field of RTC chip protection technology, specifically an external protection structure for an RTC chip, including a mounting base on which the chip body is fixedly mounted. The key feature is that the mounting base is equipped with a protective mechanism, which includes: a protective shell comprising an outer metal shielding layer, a middle insulating layer, and an inner moisture-proof layer; a shock-absorbing and buffering structure disposed inside the moisture-proof layer; and a sealing structure disposed at the connection between the protective shell and the mounting base. This addresses the problem that RTC chip protection structures typically only provide a single protective function, such as a simple plastic shell or metal shield, and that the lack of multi-layered protective structures for RTC chips leads to a higher risk of failure during use.
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