多层屏蔽抗干扰的集成式功放设备
Through multi-layer shielding structure and internal circuit isolation design, the electromagnetic interference and internal interference problems of integrated power amplifier equipment in complex electromagnetic environments are solved, achieving high-quality audio output and stable operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HENGDA ZHITONG TECH CO LTD
- Filing Date
- 2025-08-08
- Publication Date
- 2026-07-17
AI Technical Summary
Existing integrated power amplifiers are susceptible to external electromagnetic interference when facing complex electromagnetic environments, resulting in noise and distortion in the audio output. Furthermore, there is mutual interference between internal electronic components, affecting the performance of the equipment.
The device employs a multi-layer shielding structure, consisting of an outer shell composed of an aluminum alloy layer, a permalloy layer, and a copper foil anti-interference layer. Combined with a metal shielding partition, a power supply shield, and honeycomb heat dissipation holes, it achieves the blocking of electromagnetic interference of different frequencies and the isolation of internal circuits. The heat dissipation structure ensures stable operation of the equipment.
It effectively blocks external electromagnetic interference, reduces mutual interference between internal components, enhances the anti-interference capability of the equipment, ensures high-quality processing and amplification of audio signals, reduces noise and distortion, and ensures stable operation of the equipment in complex electromagnetic environments.
Smart Images
Figure CN224521467U_ABST
Abstract
Claims
1. A multi-layer shielded anti-interference integrated power amplifier device, comprising a power amplifier device housing (1), characterized in that: The power amplifier housing (1) is composed of an outermost aluminum alloy layer (10) and an innermost copper foil anti-interference layer (12). A permalloy layer (11) is provided between the aluminum alloy layer (10) and the copper foil anti-interference layer (12). Multiple metal shielding partitions (13) for separating different internal functional circuits are fixedly installed on the side walls and bottom walls of the power amplifier housing (1). A honeycomb heat dissipation hole (18) is provided on the side of the power amplifier housing (1). A metal mesh cover (181) fitted on the honeycomb heat dissipation hole (18) is fixedly installed on the inner wall of the power amplifier housing (1). A speaker assembly chamber (3) is provided inside the front side of the power amplifier housing (1). A speaker (30) is installed in the speaker assembly chamber (3). A mesh protective net (33) is detachably installed on the front side of the power amplifier housing (1). The mesh protective net (33) covers the front side of the speaker (30).
2. The multi-layer shielded anti-interference integrated power amplifier device according to claim 1, characterized in that: The metal shielding plate (13) is provided with wiring holes (131), and the wiring holes (131) are sealed to the cable with insulating glue.
3. The multi-layer shielded anti-jamming integrated power amplifier device of claim 1, wherein: The metal shielding partition (13) has a partition chamber (14) on both the left and right sides, and the partition chamber (14) is used for the installation of internal functional circuits.
4. The multi-layer shielded anti-jamming integrated power amplifier device of claim 1, wherein: A power shield (17) can also be detachably installed on the bottom wall of the power amplifier housing (1), and the power shield (17) encloses the power module of the power amplifier inside.
5. The multi-layer shielded anti-jamming integrated power amplifier device of claim 4, wherein: Multiple heat sinks (171) are fixedly installed on the top plate of the power shield (17), and the bottom end of the heat sinks (171) extends into the interior of the power shield (17).
6. The multi-layer shielded anti-interference integrated power amplifier device according to claim 5, characterized in that: A cooling fan (16) is provided above the power shield (17), and a guide plate (15) is fixedly installed on the front side wall of the power amplifier housing (1), with the end of the guide plate (15) extending directly below the cooling fan (16).
7. The multi-layer shielded anti-jamming integrated power amplifier device of claim 1, wherein: The rear side of the power amplifier housing (1) is connected to the outside, and a rear cover plate (19) is detachably installed on the rear side of the power amplifier housing (1) by means of multiple fastening screws.
8. The multi-layer shielded anti-jamming integrated power amplifier device of claim 1, wherein: The front wall of the speaker assembly chamber (3) is provided with a through hole (31) that communicates with the outside. A fixing ring (32) is fixedly installed on the annular side of the mesh protective mesh (33). The fixing ring (32) is detachably installed on the front side of the power amplifier housing (1) by multiple fastening screws.
9. The multi-layer shielded anti-jamming integrated power amplifier device of claim 1, wherein: The bottom of the power amplifier housing (1) is fixedly equipped with multiple support legs (2), and the bottom rod of the support legs (2) is fitted with a rubber sleeve (20).