单向瞬态电压抑制器件
By using a multi-pin structure and recessed design on the leadboard, the heat dissipation performance and packaging strength of the unidirectional transient voltage suppression device are improved, solving the problems of insufficient heat dissipation performance and local hot spots, and achieving higher current carrying capacity and extended service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU DEYO ELECTRONICS
- Filing Date
- 2025-08-04
- Publication Date
- 2026-07-17
AI Technical Summary
The heat dissipation performance of existing transient voltage suppression devices needs improvement, and they are prone to local hot spots, making it difficult to withstand high peak surge currents.
Design a unidirectional transient voltage suppression device, adopting a multi-pin structure and a pin plate recess to increase the heat dissipation path, and connecting the pin plate to the chip via solder paste to improve heat conduction and package strength.
It achieves faster and more uniform heat conduction, reduces local hot spots, improves the heat dissipation capacity and peak surge current withstand capability of the device, expands the application scenarios and extends the service life.
Smart Images
Figure CN224521486U_ABST
Abstract
Claims
1. A unidirectional transient voltage suppression device, comprising: At least two stacked transient diode chips (2) are located within an epoxy encapsulation (1), and the positive terminal of one transient diode chip (2) and the negative terminal of another transient diode chip (2) are connected by a first solder paste layer (3); characterized in that: it further includes a lead plate (4) and a lead plate (5), the lead plate (5) being connected to the positive terminal of the transient diode chip (2) by a second solder paste layer (7), and the other surface of the lead plate (5) being exposed from the bottom of the epoxy encapsulation (1); The lead plate (4) further includes a left lead area (41), a soldering area (42) and a right lead area (43). The soldering area (42) is connected to the negative electrode of the transient diode chip (2) located above it through a third solder paste layer (8). A left bend area (9) is provided between the left lead area (41) and the soldering area (42). A right bend area (10) is provided between the right lead area (43) and the soldering area (42). The left lead area (41) and the right lead area (43) are exposed from the bottom of both ends of the epoxy encapsulation body (1).
2. The unidirectional transient voltage suppression device of claim 1, wherein: The side surface of the pinboard (5) is provided with a recess (11) in the circumferential direction.
3. The unidirectional transient voltage suppression device of claim 2, wherein: The recess (11) is semi-circular in shape.
4. The unidirectional transient voltage suppression device according to claim 2, characterized in that: The recess (11) is located in the middle of the pin plate (5).
5. The unidirectional transient voltage suppression device according to claim 1 or 1, characterized in that: The included angle between the welding area (42) and the right bend area (10) is 100°~130°.
6. The unidirectional transient voltage suppression device of claim 1 or 1, wherein: The included angle between the welding area (42) and the left bending area (9) is 100°~130°.