An optical coupler and electronic device

Abstract

This application relates to the field of optocoupler technology, and more particularly to an optocoupler and electronic device. The optocoupler includes a first optocoupler and a second optocoupler stacked together. The first optocoupler includes a first connection port, and the second optocoupler includes a second connection port. At least one of the first and second connection ports is led out via an RDL line. The first and / or second connection ports of this application are led out via RDL lines, which is not limited by the size of the optocoupler and facilitates soldering.

Description

Technical Field

[0001] This application belongs to the field of optical coupler technology, and particularly relates to an optical coupler and electronic device. Background Technology

[0002] An optocoupler is a semiconductor coupler that can operate on both AC and DC power. The input and output sides of an optocoupler are electrically isolated, but signals can be transmitted through optical signals.

[0003] Existing optocouplers on the market employ a structure where a first optoelectronic device, a transparent insulating medium, and a second optoelectronic device are stacked. Both the first and second optoelectronic devices have pads. When the pads of the first and second optoelectronic devices are positioned opposite each other, the optocoupler needs to be flipped over for lead and pad soldering, resulting in a complex soldering process. To address this complexity, some optocouplers on the market use a process where the pads of the first and second optoelectronic devices are aligned in the same direction. This eliminates the need to flip the optocoupler when soldering leads, allowing for soldering of the pads of the first and second optoelectronic devices. However, due to the size limitations of the optocoupler, the pads of either the first or second optoelectronic device can easily be obscured by the transparent insulating medium, further increasing the soldering difficulty. Utility Model Content

[0004] This application provides an optical coupler designed to address the problem of existing optical couplers being limited by size and difficult to solder.

[0005] The embodiments of this application are implemented as follows: an optical coupler is provided, including a first optoelectronic device and a second optoelectronic device stacked together. The first optoelectronic device includes a first connection port, and the second optoelectronic device includes a second connection port. At least one of the first connection port and the second connection port is led out through an RDL line.

[0006] Furthermore, the optical coupler also includes:

[0007] A substrate, a first optoelectronic device is disposed on the substrate, the first optoelectronic device has a first surface, and a first connection port is disposed on the first surface;

[0008] The RDL circuit includes a first RDL layer disposed on a substrate, a first end of the first RDL layer being electrically connected to a first connection port, a second end of the first RDL layer being used for electrical connection to an external circuit, and a second optoelectronic device being stacked on the first surface of the first optoelectronic device.

[0009] Furthermore, the substrate has a first groove, the first optoelectronic device is disposed in the first groove, and the first RDL layer is formed on the surface of the substrate and extends to the first connection port of the first optoelectronic device for electrical connection with the first connection port.

[0010] Furthermore, the second optoelectronic device has a second surface opposite to the second connection port. The second optoelectronic device is stacked on the first surface of the first optoelectronic device through the second surface. The first connection port and the second connection port are arranged in the same direction. The second connection port is used for electrical connection with an external circuit.

[0011] Furthermore, it also includes a transparent isolation layer disposed between the second optoelectronic device and the first optoelectronic device, the transparent isolation layer being located between the first surface and the second surface.

[0012] Furthermore, the transparent insulating layer is provided with a second groove, and at least a portion of the second optoelectronic device is embedded in the second groove.

[0013] Furthermore, it also includes a transparent adhesive layer disposed between the transparent isolation layer, the first surface, and the first RDL layer.

[0014] Furthermore, the RDL line also includes a second RDL layer, the first end of which is electrically connected to the second connection port, and the second end of which is used for electrical connection to an external circuit.

[0015] Furthermore, the substrate is made of an opaque insulating material.

[0016] Secondly, this application also provides an electronic device, including the optical coupler as described above.

[0017] The beneficial effects of this application are as follows: The optical coupler provided by this application includes a first optoelectronic device and a second optoelectronic device stacked together. The first optoelectronic device includes a first connection port, and the second optoelectronic device includes a second connection port. At least one of the first and second connection ports is led out through an RDL line. The first and / or second connection ports of this application are led out through an RDL line, which is not limited by the size of the optical coupler and facilitates soldering. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of an embodiment of the optical coupler provided in this application;

[0019] Figure 2 This is a schematic diagram of another embodiment of the optical coupler provided in this application;

[0020] Figure 3 This is a schematic diagram of the overall mass production structure of one embodiment of the optical coupler provided in this application.

[0021] Figure 4 This is a schematic diagram of the overall mass production structure of another part of an embodiment of the optical coupler provided in this application.

[0022] Explanation of reference numerals in the attached figures:

[0023] 100 - Substrate, 110 - First optoelectronic device, 111 - First surface, 120 - Second optoelectronic device, 121 - Second surface, 130 - Transparent adhesive layer, 140 - Transparent isolation layer, 150 - First RDL layer, 160 - First bonding wire, 170 - Second bonding wire, 180 - Second RDL layer. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. Examples of embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. Furthermore, it should be understood that the specific embodiments described herein are merely for explaining this application and are not intended to limit this application.

[0025] In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0027] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference values ​​and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0030] The optocoupler provided in this application includes a first optocoupler and a second optocoupler stacked together. The first optocoupler includes a first connection port, and the second optocoupler includes a second connection port. At least one of the first and second connection ports is led out via an RDL line. The first and / or second connection ports of this application are led out via an RDL line, which is not limited by the size of the optocoupler and facilitates soldering.

[0031] like Figures 1 to 4 As shown, this application provides an optical coupler, including a first optoelectronic device 110 and a second optoelectronic device 120 stacked together. The first optoelectronic device 110 includes a first connection port, and the second optoelectronic device 120 includes a second connection port. At least one of the first connection port and the second connection port is led out through an RDL line.

[0032] The first optoelectronic device 110 and the second optoelectronic device 120 are the core of the optical coupler. The first optoelectronic device 110 and the second optoelectronic device 120 are optically coupled to each other. For example, the first optoelectronic device 110 and the second optoelectronic device 120 are light-emitting elements and light-receiving elements, respectively. For example, when the first optoelectronic device 110 is a light-emitting element, the second optoelectronic device 120 is a light-receiving element, and when the first optoelectronic device 110 is a light-receiving element, the second optoelectronic device 120 is a light-emitting element.

[0033] In some possible embodiments, the light-emitting element can be a light-emitting diode or other light-emitting device, and the light-receiving element can be a photoresistor, a photodiode, or a phototransistor, etc., without specific limitations.

[0034] RDL (Redistribution Layer) refers to the core process technology in chip packaging. RDL redistributes the original pad positions of the chip through metal wiring and dielectric layers, usually extending from the center of the chip to the edge or peripheral area, to achieve a more flexible pin layout.

[0035] The optocoupler provided in this application is provided with an RDL line, which is manufactured using the aforementioned RDL process. In implementation, the first connection port of the first optoelectronic device 110 can be led out through the RDL line, or the second connection port of the second optoelectronic device 120 can be led out through the RDL line, or both the first connection port of the first optoelectronic device 110 and the second connection port of the second optoelectronic device 120 can be led out through the RDL line simultaneously, facilitating the soldering connection of the connection ports to the corresponding components or lines.

[0036] The optocoupler provided in this application includes a first optoelectronic device 110 and a second optoelectronic device 120 stacked together. The first optoelectronic device 110 includes a first connection port, and the second optoelectronic device 120 includes a second connection port. At least one of the first and second connection ports is led out through an RDL line. The first and / or second connection ports of this application are led out through an RDL line, which is not limited by the size of the optocoupler and facilitates soldering.

[0037] In some optional embodiments, the optical coupler provided in this application further includes:

[0038] A substrate 100, a first optoelectronic device 110 is disposed on the substrate 100, the first optoelectronic device 110 has a first surface 111, and a first connection port is disposed on the first surface 111;

[0039] The RDL circuit includes a first RDL layer 150 disposed on a substrate 100. A first end of the first RDL layer 150 is electrically connected to a first connection port, and a second end of the first RDL layer 150 is used for electrical connection to an external circuit. A second optoelectronic device 120 is stacked on the first surface 111 of the first optoelectronic device 110.

[0040] In practice, substrate 100 refers to the base used to support the first optoelectronic device 110 and the second optoelectronic device 120. Generally, substrate 100 can be made of opaque materials, including but not limited to plastic, rubber, silicone and metal materials, without limitation.

[0041] The first RDL layer 150 is manufactured using the above-mentioned RDL process. The first end of the first RDL layer 150 is electrically connected to the first connection port 112 of the first optoelectronic device 110, and the second end of the first RDL layer 150 extends away from the first optoelectronic device 110. In other words, the connection port of the first optoelectronic device 110 is led out through the first RDL layer 150 to be electrically connected to an external circuit.

[0042] The second optoelectronic device 120 is stacked on the first optoelectronic device 110. For example, the second optoelectronic device 120 is stacked on the first surface 111 of the first optoelectronic device 110, that is, the first surface 111 of the first optoelectronic device 110 is a transparent surface, so that the first optoelectronic device 110 and the second optoelectronic device 120 are optically coupled through the first surface 111.

[0043] In implementation, the electrical connection between the connection port and the external circuit can be any one of the following, including but not limited to wire bonding, conductive adhesive / anisotropic conductive film (ACF) connection, press-fit connection, bump bonding and solder ball connection, and flip-chip bonding, without limitation.

[0044] Optionally, wire bonding utilizes metal leads (such as gold, aluminum, or copper wires) as a bridge to achieve metal-to-metal connection between the connection port and the external circuit through thermo-pressing, ultrasonic waves, or thermo-ultrasonic energy, thereby completing the transmission of electrical signals. For example, the connection port is electrically connected to the first end of the first bonding lead 160, and the second end of the first bonding lead 160 is electrically connected to the port or pad of the external circuit.

[0045] Alternatively, flip chip technology allows connection ports to be directly soldered to the pads of external circuitry via solder bumps (such as solder balls or gold bumps) without the need for lead transitions.

[0046] Optionally, conductive adhesive / anisotropic conductive film (ACF) bonding uses an adhesive containing metal particles such as silver and copper. After curing, the particles conduct electricity through contact, which is used for flexible circuits or low-temperature connections.

[0047] Alternatively, a press-fit connection uses mechanical pressure to press metal pins (such as spring pins or probes) into pads or sockets on a circuit board. The metal pins are soldered to the connection port, thereby forming an elastic electrical contact between the connection port and the external circuitry.

[0048] Alternatively, bumping and solder ball connection involves preparing metal bumps (such as gold bumps or tin-lead solder balls) on the connection port and soldering them to the pads of an external circuit via reflow soldering.

[0049] Optionally, flip chip is a key technology in the field of microelectronic packaging. By directly contacting the pads of external circuits with the chip's connection ports and establishing electrical connections, it significantly shortens the interconnection path and optimizes high-frequency performance and heat dissipation efficiency.

[0050] It should be noted that the external circuits connected to each connection port via any of the above connection methods are different. For example, the light-emitting device end is used to connect to the external circuit that provides the input signal, while the light-receiving device end is used to connect to the external circuit that outputs the signal.

[0051] In some embodiments, the light-emitting device can be a light-emitting diode (LED), a laser diode (LD), an infrared emitting diode (IRED), etc., used to convert electrical signals into light signals; the light-receiving device can be a photodiode, a phototransistor, a photosensitive silicon controlled rectifier, a photosensitive bidirectional silicon controlled rectifier, and an integrated circuit output device, etc., used to restore the light signals to electrical signals.

[0052] In some alternative embodiments, the substrate 100 is provided with a first groove, the first optoelectronic device 110 is disposed in the first groove, and the first RDL layer 150 is formed on the surface of the substrate 100 and extends to the first connection port of the first optoelectronic device 110 for electrical connection with the first connection port.

[0053] At least a portion of the first optoelectronic device 110 is covered by the first groove of the substrate 100, making the first optoelectronic device 110 and the substrate 100 more firmly bonded.

[0054] Optionally, the first optoelectronic device 110 may protrude partially from the substrate 100 or be substantially flush with the substrate 100. Preferably, the first optoelectronic device 110 is substantially flush with the substrate 100 to facilitate the subsequent fabrication of the first RDL layer 150.

[0055] In some embodiments, the second optoelectronic device 120 has a second surface 121 opposite to the second connection port. The second optoelectronic device 120 is stacked on the first surface 111 of the first optoelectronic device 110 through the second surface 121. The first connection port and the second connection port are arranged in the same direction. The second connection port is used for electrical connection with an external circuit.

[0056] In implementation, the first surface 111 of the first optoelectronic device 110 and the second surface 121 of the second optoelectronic device 120 face each other. Both the first surface 111 and the second surface 121 are light-transmitting surfaces. For example, when the first optoelectronic device 110 is a light-emitting element and the second optoelectronic device 120 is a light-receiving element, the first surface 111 is the light-emitting surface of the first optoelectronic device 110, and the second surface 121 is the light-incident surface of the second optoelectronic device 120. Similarly, when the first optoelectronic device 110 is a light-receiving element and the second optoelectronic device 120 is a light-emitting element, the first surface 111 is the light-incident surface of the first optoelectronic device 110, and the second surface 121 is the light-emitting surface of the second optoelectronic device 120.

[0057] The first connection port and the second connection port are configured to face the same direction. For example, if the first connection port faces upward, the second connection port also faces upward. When the first connection port faces downward, the second connection port also faces downward. This will not be elaborated further.

[0058] Optionally, the way the second connection port is electrically connected to the external circuit can be the same as the way the first connection port is electrically connected to the external circuit, and will not be described in detail.

[0059] For example, taking the connection between the second connection port and the second bonding lead 170 as an example, the first bonding lead 160 is soldered to the first connection port and the second bonding lead 170 is soldered to the second connection port. Since the first connection port and the second connection port are arranged in the same direction, the first bonding lead 160 and the second bonding lead 170 are located on the same side of the optocoupler. It is not necessary to flip the optocoupler to solder each bonding lead, which facilitates wire bonding and makes soldering more convenient.

[0060] In some possible embodiments, a plurality of first optoelectronic devices 110 are disposed on the substrate 100 provided in this application. These first optoelectronic devices 110 are arranged in an array, that is, a plurality of first optoelectronic devices 110 can be disposed on the substrate 100 in batches at one time.

[0061] In implementation, the substrate 100 can be a large-area base to accommodate at least two first optoelectronic devices 110. For example, the substrate 100 can support two, three, four, five, six, or more than or equal to seven first optoelectronic devices 110. These first optoelectronic devices 110 are arranged in an array, for example, multiple first optoelectronic devices 110 can be arranged in one row, two rows, three rows, multiple rows, circular or irregular pattern arrays, without limitation.

[0062] Optionally, after the first optoelectronic device 110 and the first RDL layer 150 are disposed on the substrate 100, the second optoelectronic device 120 can be stacked according to the position of the first optoelectronic device 110, and then cut to obtain multiple optical couplers. In some possible embodiments, after the first optoelectronic device 110 and the first RDL layer 150 are disposed on the substrate 100, multiple bases can be obtained by cutting, each base including the first optoelectronic device 110 and the first RDL layer 150, and then the second optoelectronic device 120 is stacked on each base to obtain multiple optical couplers, thereby improving production efficiency.

[0063] In some alternative embodiments, a transparent isolation layer 140 is also included, which is disposed between the second optoelectronic device 120 and the first optoelectronic device 110, and the transparent isolation layer 140 is located between the first surface 111 and the second surface 121.

[0064] The transparent isolation layer 140 is used to isolate the first optoelectronic device 110 and the second optoelectronic device 120. At the same time, the transparent isolation layer 140 is also transparent, so that optical coupling can be achieved between the first optoelectronic device 110 and the second optoelectronic device 120.

[0065] Optionally, the transparent isolation layer 140 may be made of at least one of glass, acrylic, silicone, epoxy resin and sapphire, without limitation.

[0066] Optionally, the transparent isolation layer 140, the first surface 111, and the first RDL layer 150 are bonded together by a transparent adhesive layer 130. Similarly, the transparent isolation layer 140 and the second surface 121 can also be bonded together by a transparent adhesive layer 130. The structure is stable and reliable, easy to install, and can effectively improve production efficiency.

[0067] Optionally, the transparent isolation layer 140 can also be provided with a second groove, and at least a portion of the second optoelectronic device 120 is embedded in the second groove. That is, the transparent isolation layer 140 and the second optoelectronic device 120 can be mass-produced together, and the substrate 100, the first optoelectronic device 110 and the first RDL layer 150 can also be mass-produced, and then the transparent adhesive layer 130 is bonded, further improving production efficiency.

[0068] In some alternative embodiments, the RDL line further includes a second RDL layer 180, with a first end of the second RDL layer 180 electrically connected to a second connection port and a second end of the second RDL layer 180 for electrical connection to an external circuit. By setting the second RDL layer 180 to extend the interface of the second optoelectronic device 120 outward, wiring is facilitated and production efficiency is improved.

[0069] Optionally, the first RDL layer is provided with a first pad for electrical connection to the first bonding lead 160. Similarly, the second RDL layer is provided with a second pad for electrical connection to the second bonding lead 170. By providing pads for bonding leads, the soldering process is more convenient and reliable.

[0070] It should be noted that the transparent isolation layer 140, the second RDL layer 180, and the second optoelectronic device 120 can be mass-produced into a single integral part, and the substrate 100, the first optoelectronic device 110, and the first RDL layer 150 can be mass-produced into another integral part. The two parts can be bonded together first and then cut, or they can be cut first and then bonded together, which can effectively improve production efficiency.

[0071] In some alternative embodiments, a first pin header and a second pin header are also included. A transparent isolation layer 140 is disposed on at least one of the first pin header and the second pin header. A first bonding lead 160 is electrically connected to the first pin header, and a second bonding lead 170 is electrically connected to the second pin header. The first pin header and the second pin header are the pin terminals of the optocoupler, used for electrical connection to external circuitry.

[0072] Secondly, this application also provides an electronic device, including the optical coupler as described above.

[0073] In practice, electronic devices include, but are not limited to, communication devices, smart devices, power supplies, or related components used in automotive electrical equipment, medical equipment, and household appliances, without specific limitations.

[0074] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the structure and implementation principle of the electronic device described above can be referred to the corresponding structure and implementation principle in the foregoing embodiments, and will not be repeated here.

[0075] The optocoupler provided in this application includes a first optoelectronic device 110 and a second optoelectronic device 120 stacked together. The first optoelectronic device 110 includes a first connection port, and the second optoelectronic device 120 includes a second connection port. At least one of the first and second connection ports is led out through an RDL line. The first and / or second connection ports of this application are led out through an RDL line, which is not limited by the size of the optocoupler and facilitates soldering.

[0076] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An optical coupler, characterized by, The device includes a first optoelectronic device and a second optoelectronic device stacked together. The first optoelectronic device includes a first connection port, and the second optoelectronic device includes a second connection port. At least one of the first connection port and the second connection port is led out through an RDL line.

2. The optical coupler of claim 1, wherein, The optical coupler also includes: A substrate, wherein the first optoelectronic device is disposed on the substrate, the first optoelectronic device having a first surface, and a first connection port being disposed on the first surface; The RDL line includes a first RDL layer disposed on the substrate, a first end of the first RDL layer being electrically connected to the first connection port, a second end of the first RDL layer being used for electrical connection to an external circuit, and the second optoelectronic device being stacked on the first surface of the first optoelectronic device.

3. The optical coupler of claim 2, wherein, The substrate has a first groove, the first optoelectronic device is disposed in the first groove, and the first RDL layer is formed on the surface of the substrate and extends to the first connection port of the first optoelectronic device for electrical connection with the first connection port.

4. The optical coupler of claim 2, wherein, The second optoelectronic device has a second surface opposite to the second connection port. The second optoelectronic device is stacked on the first surface of the first optoelectronic device through the second surface. The first connection port and the second connection port are arranged in the same direction. The second connection port is used for electrical connection with an external circuit.

5. The optical coupler of claim 4, wherein, It also includes a transparent isolation layer disposed between the second optoelectronic device and the first optoelectronic device, the transparent isolation layer being located between the first surface and the second surface.

6. The optical coupler of claim 5, wherein, The transparent isolation layer is provided with a second groove, and at least a portion of the second optoelectronic device is embedded in the groove.

7. The optical coupler of claim 5, wherein, It also includes a transparent adhesive layer disposed between the transparent isolation layer, the first surface and the first RDL layer.

8. The optical coupler of claim 4, wherein, The RDL line also includes a second RDL layer, the first end of which is electrically connected to the second connection port, and the second end of which is used for electrical connection to an external circuit.

9. The optical coupler of any one of claims 2 to 4, wherein, The substrate is made of an opaque insulating material.

10. An electronic device, comprising: Includes the optical coupler as described in any one of claims 1 to 9.

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