一种超薄LED器件结构
By using composite copper foil substrates and packaging technology, we have achieved the design of ultra-thin LED devices, solving the problem that existing technologies cannot produce thinner products, and providing a lightweight, stable, and highly compatible solution.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU LEITING OPTOELECTRONICS TECH CO LTD
- Filing Date
- 2025-07-03
- Publication Date
- 2026-07-17
AI Technical Summary
Existing LED products cannot be made thinner, failing to meet market demand for ultra-thin LED devices.
The composite copper foil substrate design includes a first copper foil layer, a plastic film layer, and a second copper foil layer, forming independently spaced pads. LED chips are flip-chip connected and encapsulated using conductive adhesive and encapsulating adhesive layers, reducing the substrate thickness to 0.05-0.15mm.
It enables ultra-thin LED products with good compatibility, low cost, and stable quality, and can directly replace existing products to meet the requirements of lightweight and thin design.
Smart Images
Figure CN224521507U_ABST
Abstract
Claims
1. An ultra-thin LED device structure, characterized in that: The package includes a substrate (1) and an LED package (2) disposed on the substrate (1). The substrate (1) includes a first copper foil layer (11), a plastic film layer (12) and a second copper foil layer (13) disposed sequentially from bottom to top. The second copper foil layer (13) forms two independently spaced pads. The LED package (2) includes an LED chip (21) that is electrically connected to the two pads and an encapsulating adhesive layer (22) covering the outer periphery of the LED chip (21).
2. The ultra-thin LED device structure of claim 1, wherein: The thickness of the substrate (1) is 0.05-0.15 mm, and the surface of the substrate (1) is plated with copper or tin.
3. The ultra-thin LED device structure of claim 1, wherein: The plastic film layer (12) is made of PET, PP or PI.
4. The ultra-thin LED device structure of claim 1, wherein: The LED chip (21) is flip-chip mounted on two pads, and conductive adhesive layers (23) connected to the positive and negative electrodes of the LED chip (21) are respectively provided on the two pads.
5. The ultra-thin LED device structure according to claim 4, characterized in that: The conductive adhesive layer (23) is made of solder paste or silver paste and is printed on the pads by a brushing process.
6. The ultra-thin LED device structure of claim 1, wherein: The encapsulating adhesive layer (22) is made of silicone or epoxy resin and is encapsulated on top of and around the LED chip (21) by molding or injection molding process.