荧光膜结构、LED封装结构、LED灯和显示器
By setting a protrusion structure on the fluorescent film body, the problems of air bubbles and thermal expansion force differences during the bonding of the fluorescent film to the chip surface are solved, achieving more reliable bonding and LED stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN FURIYUANLEI TECH CO LTD
- Filing Date
- 2025-08-11
- Publication Date
- 2026-07-17
AI Technical Summary
In the prior art, when the fluorescent film is bonded to the chip surface with adhesive, small air bubbles are easily generated, and due to the difference in thermal expansion coefficients, the fluorescent film is subjected to stress and breaks at high temperatures.
A protrusion structure is set on the fluorescent film body to adhere to the chip surface, thereby reducing the formation of air bubbles in the fixative and balancing the difference in thermal expansion forces between the center and the periphery.
It effectively reduces the formation of air bubbles in the adhesive, reduces the difference in thermal expansion force between the center and the periphery of the fluorescent film, avoids the fluorescent film from cracking, and improves the reliability of bonding and the stability of the LED.
Smart Images
Figure CN224521508U_ABST