一种CSP灯珠设计结构

By using a multi-layer molded colloid design, the angle of light refraction and the direction of light transmission are changed, enhancing the side light emission of CSP lamp beads, solving the problem of fixed light emission angle of CSP lamp beads, and improving display effect and visual effect.

CN224521509UActive Publication Date: 2026-07-17JIANGXI MTC OPTOELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANGXI MTC OPTOELECTRONICS CO LTD
Filing Date
2025-07-31
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

CSP lamp beads processed by CSP molding technology have a fixed light emission angle, resulting in strong light intensity at the top and weak light intensity on the sides, leading to uneven display effects.

Method used

It adopts a multi-layer molded colloid design, including a first colloid layer, a second transparent colloid layer and a third light-shielding colloid layer. By changing the refraction angle and transmission direction of light, the side light emission intensity is enhanced, and an arc-shaped light-shielding layer is set on the top to reduce the light intensity at the top.

Benefits of technology

This improved the uniformity of side light emission intensity of CSP LEDs, enhanced the display effect, reduced brightness non-uniformity, and optimized the visual effect of the display panel.

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Abstract

本实用新型公开了一种CSP灯珠设计结构，发光芯片，依次层叠于所述发光芯片上的第一胶层，第二胶层和第三胶层；第一胶层，覆盖于所述发光芯片朝向胶层的表面，和所述发光芯片的侧面；其中，所述第二胶层为透明层，所述第三胶层为遮光层。本实用新型通过使用模压胶体分层技术来替代传统的CSP模压技术，通过多层模压，并在每层使用不同的物质以改变光的折射角度进而增大侧面的出光在CSP灯珠顶部增加用于遮光的圆弧状第三胶层，且第三胶层的中间区域厚，两侧薄，可使得遮光效果中间强、两边弱，以此来减少灯珠顶部光强较强的问题，能有效均匀电视面板显示效果；同时通过不同层的外观设计调整，以实现灯珠视效提升与降低亮度牺牲的最优解。
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Claims

1. A CSP lamp bead design structure, characterized in that, The CSP LED chip design structure includes a light-emitting chip, and a first adhesive layer, a second adhesive layer and a third adhesive layer sequentially stacked on the light-emitting chip; A first adhesive layer covers the surface of the light-emitting chip facing the adhesive layer and the side surface of the light-emitting chip; The second adhesive layer is a transparent layer, and the third adhesive layer is a light-shielding layer.

2. The CSP lamp bead design structure according to claim 1, wherein, The first adhesive layer has a recessed first receiving portion at the end away from the second adhesive layer for accommodating the light-emitting chip.

3. The CSP lamp bead design structure according to claim 2, wherein, The first receiving portion is configured to conform to the shape of the light-emitting chip, and the first receiving portion and the light-emitting chip are interference-fitted.

4. The CSP lamp bead design structure according to claim 1, wherein, The second adhesive layer includes a connecting edge that contacts the first adhesive layer, a light-emitting edge disposed at the edge of the connecting edge, and a light-shielding edge for contacting the third adhesive layer.

5. The CSP lamp bead design structure according to claim 4, wherein, The light-shielding edge is bent toward the light-emitting chip and has a recessed portion, and the third adhesive layer is disposed in the recessed portion.

6. The CSP lamp bead design structure according to claim 5, wherein, The side of the third adhesive layer is flush with the light-shielding edge.