发光二极管封装单元、封装结构、显示模组及显示屏

Abstract

本实用新型提供一种发光二极管封装单元、发光二极管封装结构、发光二极管显示模组以及发光二极管显示屏，发光二极管封装单元包括：支架；至少一个发光二极管，固定于所述支架顶面；封装胶层，覆盖所述发光二极管和未被所述发光二极管覆盖的部分所述支架顶面；菲涅尔透镜，设置于所述封装胶层上。本实用新型使得发光二极管封装单元的亮度得到提高，且使得发光二极管封装单元的整体厚度减小。

Claims

1. A light-emitting diode packaging unit, characterized in that, include: support; At least one light-emitting diode is fixed to the top surface of the bracket; An encapsulating adhesive layer covers the light-emitting diode and the portion of the top surface of the bracket not covered by the light-emitting diode; A Fresnel lens is disposed on the encapsulating adhesive layer.

2. The light emitting diode package unit of claim 1, wherein the first and second electrodes are formed of a material selected from the group consisting of silver (Ag), gold (Au), platinum (Pt), aluminum (Al), copper (Cu), and alloys thereof. The Fresnel lens has a cross-section comprising a first convex portion and n second convex portions. The arcs containing the first convex portion and the n second convex portions share the same center. The radius of the arcs containing the n second convex portions gradually increases in the direction away from the first convex portion. The n second convex portions are connected sequentially and form a centrally symmetrical sawtooth shape around the first convex portion. n is a positive integer greater than or equal to 2.

3. The light emitting diode package unit of claim 2, wherein the first and second electrodes are formed of a material having a work function of 3.5 eV or more. The first protrusion and each of the second protrusions are independent lenses.

4. The light emitting diode package unit of claim 1, wherein the first and second electrodes are formed of a material selected from the group consisting of silver (Ag), gold (Au), platinum (Pt), aluminum (Al), copper (Cu), and alloys thereof. The encapsulating adhesive layer and the Fresnel lens are an integral structure.

5. The light-emitting diode packaging unit as described in claim 1, characterized in that, The encapsulating adhesive layer and the Fresnel lens are separate structures.

6. The light emitting diode package unit of claim 1, wherein the first and second electrodes are formed of a material selected from the group consisting of silver (Ag), gold (Au), platinum (Pt), aluminum (Al), copper (Cu), and alloys thereof. The encapsulating adhesive layer is at least one of epoxy resin encapsulating adhesive layer, silicone encapsulating adhesive layer, and silicone resin encapsulating adhesive layer.

7. The light emitting diode package unit of claim 1, wherein the first and second electrodes are formed of a material selected from the group consisting of silver (Ag), gold (Au), platinum (Pt), aluminum (Al), copper (Cu), and alloys thereof. The Fresnel lens is at least one of epoxy resin Fresnel lens, silicone Fresnel lens, and silicone resin Fresnel lens.

8. The light-emitting diode packaging unit as described in claim 1, characterized in that, The encapsulating adhesive layer and the Fresnel lens are transparent.

9. The light-emitting diode packaging unit as described in claim 1, characterized in that, The half-intensity angle of the light beam emitted through the Fresnel lens is less than 100°.

10. The light emitting diode package unit of claim 9, wherein the first and second electrodes are formed of a material selected from the group consisting of silver (Ag), gold (Au), platinum (Pt), aluminum (Al), copper (Cu), and alloys thereof. Part of the light beam emitted through the Fresnel lens is perpendicular to the top surface of the light-emitting diode.

11. The light emitting diode package unit of claim 1, wherein the first and second electrodes are formed of a material selected from the group consisting of silver (Ag), gold (Au), platinum (Pt), aluminum (Al), copper (Cu), and alloys thereof. The Fresnel lens projects onto the bracket, covering the light-emitting diode.

12. The light emitting diode package unit of claim 1, wherein the light emitting diode package unit is a light emitting diode chip. The encapsulating adhesive layer has a groove, and the Fresnel lens is disposed in the groove.

13. The light emitting diode package unit of claim 1, wherein the light emitting diode package unit is mounted on a printed circuit board. The light-emitting diode packaging unit also includes: A bowl-shaped cup is disposed around the top surface of the support, the bowl-shaped cup surrounding the at least one light-emitting diode, the encapsulating adhesive layer, and the Fresnel lens.

14. The light-emitting diode packaging unit as described in claim 1, characterized in that, The at least one light-emitting diode includes at least one of red light-emitting diodes, green light-emitting diodes, and blue light-emitting diodes.

15. A light-emitting diode (LED) packaging structure, characterized in that, It includes a plurality of light-emitting diode (LED) packaging units as described in any one of claims 1 to 14, wherein the plurality of LED packaging units are arranged in i rows × j columns; wherein i is greater than or equal to 2 and j is greater than or equal to 1; or j is greater than or equal to 2 and i is greater than or equal to 1.

16. The light emitting diode package structure of claim 15, wherein the phosphor layer is disposed on the top surface of the substrate. The brackets in adjacent LED packaging units are connected by a connecting part.

17. A light emitting diode display module, characterized by It includes a substrate and a light-emitting diode (LED) package structure as described in claim 15 or 16, wherein the LED package structure is disposed on the substrate.

18. A light emitting diode display screen, characterized by It includes multiple light-emitting diode display modules as described in claim 17, arranged in an array.

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