A high-efficiency heat dissipation UVLED light-emitting integrated module

Abstract

This utility model relates to a high-efficiency heat dissipation UVLED integrated light-emitting module in the field of integrated light-emitting module devices. It includes a ceramic substrate, on which a UVLED chip is mounted. A graphene thermally conductive layer surrounds the UVLED chip on the outer side of the ceramic substrate. An annular temperature-equalizing groove is formed at one end of the ceramic substrate near the graphene thermally conductive layer, and the groove is filled with a thermally conductive material. A metal mesh buffer layer is embedded at the inner end of the ceramic substrate away from the UVLED chip. Columnar heat sinks are arranged alternately on the outer side of the metal mesh buffer layer, and spiral flow channels are formed inside each columnar heat sink. This utility model achieves efficient heat dissipation and temperature uniformity through the synergistic effect of its internal and external structures, improving structural stability and solving problems such as heat accumulation, large temperature differences, easy cracking, and insufficient heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of integrated light-emitting module devices, specifically to a UVLED integrated light-emitting module with high heat dissipation. Background Technology

[0002] In existing UV LED integrated modules, the UV LED chip continuously generates a large amount of heat during operation. Its heat dissipation performance directly affects the chip's luminous efficiency, lifespan, and operational stability. Therefore, the industry commonly uses ceramic substrates as the core carrier material. This is because ceramic materials have excellent thermal conductivity, insulation properties, and high-temperature resistance, providing a stable operating environment for the UV LED chip. Furthermore, to further improve heat dissipation, some existing modules incorporate a metal heat sink or simple flat heat sink fins on the outside of the ceramic substrate, and enhance air convection cooling through ventilation holes.

[0003] However, existing technologies still have many shortcomings: First, the heat dissipation path design is simple, relying mainly on the thermal conductivity of the ceramic substrate itself or a simple external heat dissipation structure. Heat is prone to local accumulation around the UVLED chip, resulting in excessively high chip operating temperature, which not only reduces luminous efficiency but also significantly shortens the chip's lifespan. Second, the structural compatibility is poor. There is a significant difference in the thermal expansion coefficient between the ceramic substrate and the metal heat dissipation components. During long-term use, stress is easily generated due to temperature changes, leading to problems such as cracking and detachment of the substrate or heat dissipation components, reducing the reliability of the module. Utility Model Content

[0004] The purpose of this invention is to address the above-mentioned shortcomings and provide a high-efficiency heat dissipation UVLED integrated module. It has an internal graphene thermal conductive layer, a temperature equalization groove, a metal mesh buffer layer, and a columnar heat sink, and is externally equipped with a metal-ceramic composite shell, honeycomb ventilation holes, wave-shaped heat dissipation fins, and convex strips, forming a multi-layered collaborative heat dissipation system. This solves the technical problems of existing technologies, such as single heat dissipation path, poor temperature uniformity, poor structural compatibility, and limited external heat dissipation efficiency.

[0005] The objective of this utility model is achieved through the following means:

[0006] A high-efficiency heat dissipation UVLED light-emitting integrated module includes a ceramic substrate. A UVLED chip is mounted on the chip mounting area of ​​the ceramic substrate, providing a stable mounting base for the UVLED chip and ensuring structural stability during chip operation. A graphene thermally conductive layer surrounds the UVLED chip on the outer side of the ceramic substrate, which can quickly absorb the heat generated by the UVLED chip and diffuse it to the surrounding area, improving local heat dissipation efficiency. An annular temperature distribution groove is formed at one end of the ceramic substrate near the graphene thermally conductive layer. The groove is filled with a thermally conductive material, allowing heat to be evenly distributed on the surface of the ceramic substrate and preventing localized high-temperature accumulation. A metal mesh buffer layer is embedded at the inner end of the ceramic substrate away from the UVLED chip, which can alleviate stress caused by the difference in thermal expansion coefficients between the ceramic substrate and other components, improving the long-term stability of the structure. The outer surface of the metal mesh buffer layer is staggered. The substrate features columnar heat sinks, which increase the heat transfer path and accelerate the heat conduction from the inside of the substrate to the outside. The columnar heat sinks have spiral flow channels inside, guiding airflow and enhancing the heat exchange efficiency between the air and the heat sinks. A metal-ceramic composite shell is provided on the outside of the ceramic substrate, combining the high thermal conductivity of metal with the high temperature resistance of ceramic. This provides protection for the internal structure while accelerating heat conduction. Honeycomb-shaped ventilation holes are provided on the outside of the metal-ceramic composite shell, promoting airflow between the inside and outside of the shell and accelerating heat dissipation through air convection. Wavy heat sink fins are provided on the outside of the metal-ceramic composite shell near the UVLED chip, increasing the contact area with air and enhancing heat dissipation. Raised strips are provided on the outside of the wavy heat sink fins, disrupting the airflow boundary layer, increasing airflow velocity, and further enhancing heat dissipation efficiency.

[0007] Furthermore, the corrugated heat dissipation fins are fixedly connected to the metal-ceramic composite shell, and the convex strips are fixedly connected to the corrugated heat dissipation fins. The convex strips disrupt the air boundary layer to enhance heat transfer.

[0008] Furthermore, a through hole is provided on the outer side of the metal-ceramic composite shell near the UVLED chip, and the through hole is integrally formed with the metal-ceramic composite shell.

[0009] Furthermore, the honeycomb ventilation holes are integrally formed with the metal-ceramic composite shell, and the spiral guide groove is integrally formed with the columnar heat sink. The honeycomb ventilation holes are used for ventilation and heat dissipation.

[0010] Furthermore, the graphene thermal conductive layer is fixedly connected to the ceramic substrate, and the inner side of the graphene thermal conductive layer is tightly bonded to the outer periphery of the UVLED chip.

[0011] Furthermore, the columnar heat sink is fixedly connected to the metal mesh buffer layer, and the metal mesh buffer layer is fixedly connected to the ceramic substrate.

[0012] The beneficial effects of this utility model are:

[0013] This invention utilizes a graphene thermally conductive layer surrounding the UVLED chip to achieve rapid absorption and conduction of heat around the chip, enhancing local heat dissipation and solving the problem of heat accumulation around the chip. A heat-conducting material-filled temperature distribution groove ensures uniform heat distribution on the ceramic substrate surface, reducing local temperature differences and resolving the issue of unstable chip operation caused by uneven heat distribution. The metal mesh buffer layer, combined with the columnar heat sink, efficiently transfers heat to the substrate while buffering thermal stress between different materials, improving structural stability and solving the problem of stress cracking due to thermal expansion differences during long-term use.

[0014] The metal-ceramic composite shell, combined with honeycomb ventilation holes, enables efficient airflow from the outside, enhancing convective heat dissipation and solving the problem of insufficient external air exchange. The wavy heat dissipation fins, in conjunction with the raised strips, effectively increase the heat dissipation area and optimize the airflow path, improving heat dissipation efficiency and solving the problem of low heat dissipation area utilization of traditional heat dissipation fins. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a high-efficiency heat dissipation UVLED light-emitting integrated module according to the present invention.

[0016] Figure 2 This is a cross-sectional view of a high-efficiency heat dissipation UVLED light-emitting integrated module according to the present invention;

[0017] Figure 3 for Figure 2 A magnified view of part A in the diagram;

[0018] Figure 4 A three-dimensional view of a columnar heat sink structure for a high-efficiency heat dissipation UVLED integrated module;

[0019] In the figure, 1. Ceramic substrate; 2. UVLED chip; 3. Graphene thermal conductive layer; 4. Metal-ceramic composite shell; 5. Honeycomb ventilation holes; 6. Wave-shaped heat dissipation fins; 7. Raised strips; 8. Temperature distribution groove; 9. Thermal conductive material; 10. Metal mesh buffer layer; 11. Columnar heat sink; 12. Spiral guide groove. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. This embodiment refers to... Figures 1-4The present invention relates to a high-efficiency heat dissipation UVLED integrated module, comprising a ceramic substrate 1, a UVLED chip 2 mounted on the chip mounting area of ​​the ceramic substrate 1, a graphene thermal conductive layer 3 surrounding the UVLED chip 2 on the outside of the ceramic substrate 1, an annular temperature distribution groove 8 at one end of the ceramic substrate 1 near the graphene thermal conductive layer 3, the temperature distribution groove 8 being filled with thermally conductive material 9, a metal mesh buffer layer 10 embedded at one end of the ceramic substrate 1 away from the UVLED chip 2, columnar heat sinks 11 arranged alternately on the outside of the metal mesh buffer layer 10, spiral flow channels 12 being formed inside the columnar heat sinks 11, a metal-ceramic composite shell 4 disposed on the outside of the ceramic substrate 1, honeycomb ventilation holes 5 being formed on the outside of the metal-ceramic composite shell 4 near the UVLED chip 2, and corrugated heat dissipation fins 6 being formed on the outside of the corrugated heat dissipation fins 6; the temperature distribution groove 8 balances the temperature distribution of the module, and the spiral flow channels 12 can form directional airflow circulation.

[0021] like Figure 1 , Figure 2 and Figure 3 As shown, the wavy heat dissipation fins 6 are fixedly connected to the metal-ceramic composite shell 4, and the convex strips 7 are fixedly connected to the wavy heat dissipation fins 6. The convex strips 7 disrupt the air boundary layer to enhance heat transfer.

[0022] like Figure 2 and Figure 3 As shown, a through hole is provided on the outer side of the metal-ceramic composite housing 4 near the UVLED chip 2, and the through hole is integrally formed with the metal-ceramic composite housing 4.

[0023] like Figure 2 and Figure 3 As shown, the honeycomb ventilation holes 5 are integrally formed with the metal-ceramic composite shell 4, and the spiral guide groove 12 is integrally formed with the columnar heat sink 11. The honeycomb ventilation holes 5 are used for ventilation and heat dissipation.

[0024] like Figure 2 and Figure 2 As shown, the graphene thermal conductive layer 3 is fixedly connected to the ceramic substrate 1, and the inner side of the graphene thermal conductive layer 3 is tightly bonded to the outer periphery of the UVLED chip 2.

[0025] like Figure 1 , Figure 2 and Figure 4 As shown, the columnar heat sink 11 is fixedly connected to the metal mesh buffer layer 10, and the metal mesh buffer layer 10 is fixedly connected to the ceramic substrate 1.

[0026] The working principle of a high-efficiency heat dissipation UVLED light-emitting integrated module in this embodiment is as follows: The heat generated by the UVLED chip 2 on the ceramic substrate 1 during operation is first rapidly conducted and diffused through the surrounding graphene thermal conductive layer 3. The inner side of the graphene thermal conductive layer 3 is tightly attached to the outer edge of the chip to enhance heat transfer. The thermal conductive material 9 in the annular temperature distribution groove 8 balances the temperature distribution of the module and avoids local overheating. After the heat is conducted to the metal mesh buffer layer 10 inside the ceramic substrate 1, it is transferred to the staggered columnar heat sink 11 outside. The spiral guide groove 12 in the columnar heat sink 11 forms a directional airflow circulation to accelerate heat dissipation. The honeycomb ventilation holes 5 on the outside of the metal-ceramic composite shell 4 ensure ventilation and heat dissipation. The wave-shaped heat dissipation fins 6 on the side close to the chip increase the heat dissipation area. The convex strips 7 on the outside of the fins break the air boundary layer to enhance heat exchange and further improve heat dissipation efficiency. The through holes on the metal-ceramic composite shell 4 also help dissipate heat. Multiple structures work together to build a high-efficiency heat dissipation system.

[0027] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A high-efficiency heat-dissipating UVLED light-emitting integrated module, comprising a ceramic substrate, wherein a UVLED chip is mounted on a chip mounting area of ​​the ceramic substrate, characterized in that: The ceramic substrate is surrounded by a graphene thermally conductive layer around the UVLED chip. An annular temperature distribution groove is formed at one end of the ceramic substrate near the graphene thermally conductive layer. The temperature distribution groove is filled with thermally conductive material. A metal mesh buffer layer is embedded at the end of the ceramic substrate away from the UVLED chip. Columnar heat sinks are arranged alternately on the outside of the metal mesh buffer layer. Spiral flow channels are formed inside the columnar heat sinks. A metal-ceramic composite shell is provided on the outside of the ceramic substrate. Honeycomb ventilation holes are formed on the outside of the metal-ceramic composite shell. Wavy heat dissipation fins are provided on the outside of the metal-ceramic composite shell near the UVLED chip. Raised strips are formed on the outside of the wavy heat dissipation fins.

2. The high-efficiency heat dissipation UVLED light-emitting integrated module according to claim 1, characterized in that: The wavy heat dissipation fins are fixedly connected to the metal-ceramic composite shell, and the convex strips are fixedly connected to the wavy heat dissipation fins.

3. The high-efficiency heat dissipation UVLED light-emitting integrated module according to claim 1, characterized in that: The metal-ceramic composite shell has a through hole on the side of its exterior closest to the UVLED chip, and the through hole is integrally formed with the metal-ceramic composite shell. 4.The UVLED light-emitting integrated module with high heat dissipation efficiency of claim 1, wherein: The honeycomb-shaped ventilation holes are integrally formed with the metal-ceramic composite shell, and the spiral guide groove is integrally formed with the columnar heat sink.

5. The high-efficiency heat dissipation UVLED light-emitting integrated module according to claim 1, characterized in that: The graphene thermal conductive layer is fixedly connected to the ceramic substrate, and the inner side of the graphene thermal conductive layer is tightly bonded to the outer periphery of the UVLED chip.

6. The high-efficiency heat dissipation UVLED light-emitting integrated module according to claim 1, characterized in that: The columnar heat sink is fixedly connected to the metal mesh buffer layer, and the metal mesh buffer layer is fixedly connected to the ceramic substrate.

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