A multi-station high-speed die bonder suitable for LED displays

Abstract

This utility model relates to the field of LED wafer processing technology, specifically a multi-station high-speed die bonding machine suitable for LED displays. It includes a base, with a first baffle and a second baffle fixedly connected to the upper end of the base. A first connecting plate is fixedly connected to one side of the first baffle, and a first motor is fixedly connected to the upper end of the first connecting plate. The output end of the first motor is connected to a first rotating shaft, and one end of the first rotating shaft is fixedly connected to a transmission shaft. A conveyor belt is sleeved on the outer wall of the transmission shaft. In this device, the first motor drives the first rotating shaft, which in turn drives the transmission shaft, thereby driving the conveyor belt to move and achieving automatic LED wafer conveying. A locking block on the second connecting plate cooperates with a placement plate to ensure accurate positioning of the wafer during the gripping process, improving feeding efficiency. The second motor drives a threaded rod to rotate, causing a threaded plate to move along a slide rail, suitable for switching between multiple stations, enhancing the adaptability and flexibility of the equipment.

Description

Technical Field

[0001] This utility model relates to the field of LED chip processing technology, and more specifically, to a multi-station high-speed die bonding machine suitable for LED displays. Background Technology

[0002] In the manufacturing process of LED displays, die bonding is a critical step that directly affects product yield and production efficiency. Traditional die bonding equipment typically employs semi-automatic or manual operation, which suffers from problems such as unstable wafer transport, low positioning accuracy, excessive manual intervention, and low production efficiency. Furthermore, existing equipment often struggles to achieve a balance between high speed and high precision when performing wafer pick-up and placement operations, and its adaptability to complex paths or multi-station switching is poor, limiting its application in large-scale, high-density LED display device production. Utility Model Content

[0003] The purpose of this invention is to provide a multi-station high-speed die bonder suitable for LED displays, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a multi-station high-speed die bonding machine suitable for LED displays, comprising a base, a first baffle and a second baffle fixedly connected to the upper end of the base, a first connecting plate fixedly connected to one side of the first baffle, a first motor fixedly connected to the upper end of the first connecting plate, an output end of the first motor connected to a first rotating shaft, a drive shaft fixedly connected to one end of the first rotating shaft, and a conveyor belt sleeved on the outer wall of the drive shaft.

[0005] As a preferred embodiment of this utility model, a second connecting plate is fixedly connected to one side of the second baffle, and a locking block is fixedly connected to the upper end of the second connecting plate. The locking block is fastened to the placement plate and is used to carry the LED chip to be processed.

[0006] As a preferred embodiment of this utility model, the lower end of the base is fixedly connected to a second support plate, the lower end of the second support plate is fixedly connected to a base plate, and the upper end of the base plate is fixedly connected to a first support plate.

[0007] As a preferred embodiment of this utility model, the upper end of the first support plate is fixedly connected to the top plate, the upper end of the top plate is fixedly connected to the second motor, the output end of the second motor is connected to a threaded rod, and one end of the threaded rod is rotatably connected to the end plate through a sliding bearing.

[0008] As a preferred embodiment of this utility model, the threaded rod is rotatably connected to a threaded plate at its middle end, a third connecting plate is fixedly connected to one side of the threaded plate, a slider is fixedly connected to one side of the third connecting plate, and the slider is slidably connected to a slide rail.

[0009] As a preferred technical solution of this utility model, the lower end of the threaded plate is fixedly connected to a pneumatic cylinder, and the output end of the pneumatic cylinder is connected to a pneumatic rod to realize the picking, handling and placement of the wafer, which has the characteristics of fast response speed and high control precision. The lower end of the pneumatic rod is rotatably connected to a connecting seat.

[0010] As a preferred technical solution of this utility model, the lower end of the connecting seat is connected to the connecting ring by a screw, the lower end of the connecting ring is fixedly connected to the ejector pin, and the lower end of the ejector pin is provided with an adsorption hole. The ejector pin realizes vacuum adsorption and release operation of the wafer through the adsorption hole.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] (1) In this device, the first motor drives the first rotating shaft to drive the transmission shaft to rotate, thereby driving the conveyor belt to move and realize the automatic delivery of LED chips. At the same time, the card block on the second connecting plate cooperates with the placement plate to ensure the accurate positioning of the chip during the gripping process, effectively improving the automation and stability of chip delivery and reducing manual intervention.

[0013] (2) In this device, the second motor drives the threaded rod to rotate, which drives the threaded plate to move along the slide rail to achieve precise lateral positioning of the actuator. The pneumatic cylinder drives the ejector pin to move up and down through the pneumatic rod to complete the wafer picking and mounting action. The ejector pin is equipped with an adsorption hole at the lower end, which picks up or releases the wafer through vacuum adsorption to ensure stable and reliable operation. The system has multi-degree-of-freedom adjustment capability, can adapt to die bonding operations under complex paths, and achieve high-precision and high-speed wafer assembly. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the front of a multi-station high-speed die bonder for LED displays, according to an embodiment of the present invention.

[0016] Figure 2 This is a schematic diagram of the side structure of a multi-station high-speed die bonder for LED displays, according to an embodiment of the present invention.

[0017] Figure 3 This is a structural schematic diagram of an enlarged view of point A on the side of a multi-station high-speed die bonder suitable for LED displays, according to an embodiment of the present invention.

[0018] Figure 4 This is a schematic diagram of the structure of a positioning device for a multi-station high-speed die bonder for LED displays, according to an embodiment of the present invention.

[0019] Figure 5 This is a structural schematic diagram of the enlarged view of the positioning device B of a multi-station high-speed die bonder for LED displays, according to an embodiment of the present utility model.

[0020] Figure 6 This is a front view of a gripping device for a multi-station high-speed die bonder for LED displays, according to an embodiment of the present invention.

[0021] Figure 7 This is a side view of a gripping device for a multi-station high-speed die bonder for LED displays, according to an embodiment of the present invention.

[0022] Figure 8 This is a schematic diagram of the lower structure of a gripping device for a multi-station high-speed die bonder for LED displays, according to an embodiment of the present invention.

[0023] Figure label:

[0024] 1. First support plate; 2. Conveyor belt; 3. Base; 4. First baffle; 5. Second support plate; 6. Base plate; 7. First motor; 8. First connecting plate; 9. Placement plate; 10. Locking block; 11. Second connecting plate; 12. Drive shaft; 13. First rotating shaft; 14. Second motor; 15. Threaded rod; 16. Threaded plate; 17. End plate; 18. Slide rail; 19. Slider; 20. Third connecting plate; 21. Pneumatic cylinder; 22. Pneumatic rod; 23. Connecting seat; 24. Connecting ring; 25. Ejector pin; 26. Adsorption hole; 27. Top plate; 28. Second baffle. Detailed Implementation

[0025] The utility model will now be further described with reference to the accompanying drawings and specific embodiments: Example

[0026] refer to Figures 1 to 8The first embodiment includes a base 3, with a first baffle 4 and a second baffle 28 fixedly connected to the upper end of the base 3. A first connecting plate 8 is fixedly connected to one side of the first baffle 4. A first motor 7 is fixedly connected to the upper end of the first connecting plate 8. The output end of the first motor 7 is connected to a first rotating shaft 13. A transmission shaft 12 is fixedly connected to one end of the first rotating shaft 13. A conveyor belt 2 is sleeved on the outer wall of the transmission shaft 12. A second connecting plate 11 is fixedly connected to one side of the second baffle 28. A locking block 10 is fixedly connected to the upper end of the second connecting plate 11. The locking block 10 fastens to a placement plate 9. A second support plate 5 is fixedly connected to the lower end of the base 3. A base plate 6 is fixedly connected to the lower end of the second support plate 5. A first support plate 1 is fixedly connected to the upper end of the base plate 6.

[0027] In this embodiment, the first motor 7 drives the first rotating shaft 13 to drive the transmission shaft 12 to rotate, thereby driving the conveyor belt 2 to move and realize the automatic delivery of LED chips. At the same time, the locking block 10 on the second connecting plate 11 cooperates with the placement plate 9 to ensure accurate positioning of the chip during the gripping process, effectively improving the automation and stability of chip delivery and reducing manual intervention. Example

[0028] refer to Figures 1 to 8 Example 2 is a further description of Example 1. It includes a first support plate 1, a top plate 27 fixedly connected to the upper end of the first support plate 1, a second motor 14 fixedly connected to the upper end of the top plate 27, a threaded rod 15 connected to the output end of the second motor 14, a threaded rod 15 rotatably connected to an end plate 17 via a sliding bearing at one end of the threaded rod 15, a threaded plate 16 rotatably connected to the middle end of the threaded rod 15, a third connecting plate 20 fixedly connected to one side of the threaded plate 16, a slider 19 fixedly connected to one side of the third connecting plate 20, a slider 19 slidably connected to a slide rail 18, a pneumatic cylinder 21 fixedly connected to the lower end of the threaded plate 16, a pneumatic rod 22 connected to the output end of the pneumatic cylinder 21, a connecting seat 23 rotatably connected to the lower end of the pneumatic rod 22, a connecting ring 24 connected to the lower end of the connecting seat 23 via a screw, a pin 25 fixedly connected to the lower end of the connecting ring 24, and an adsorption hole 26 provided at the lower end of the pin 25.

[0029] In this embodiment, the second motor 14 drives the threaded rod 15 to rotate, which in turn drives the threaded plate 16 to move along the slide rail 18, thereby achieving precise lateral positioning of the actuator. The pneumatic cylinder 21 drives the ejector pin 25 to move up and down through the pneumatic rod 22, thereby completing the wafer picking and mounting actions. The lower end of the ejector pin 25 is provided with an adsorption hole 26, which picks up or releases the wafer through vacuum adsorption, ensuring stable and reliable operation. The system has multi-degree-of-freedom adjustment capability, which can adapt to die bonding operations under complex paths and achieve high-precision and high-speed wafer assembly.

[0030] In practical applications, the first motor 7 drives the first rotating shaft 13 to rotate the transmission shaft 12, thereby driving the conveyor belt 2 to move and realize the automatic conveying function of LED chips. The clamping block 10 on the second connecting plate 11 cooperates with the placement plate 9 to ensure accurate positioning of the chip during the gripping process, improving the feeding efficiency. The second motor 14 drives the threaded rod 15 to rotate, driving the threaded plate 16 to move along the slide rail 18, realizing the lateral precise positioning function of the actuator, which is suitable for switching operations between multiple workstations and enhances the adaptability and flexibility of the equipment. The pneumatic cylinder 21 drives the ejector pin 25 to move up and down through the pneumatic rod 22 to complete the chip picking and placement action, with the characteristics of fast response and stable control. The ejector pin 25 is provided with an adsorption hole 26 at the lower end, which grips or releases the chip by vacuum adsorption, ensuring that the chip does not shift or get damaged during the operation, thus improving the die bonding yield. The system has multi-degree-of-freedom adjustment capability, can adapt to die bonding operations under complex paths, realize high-precision and high-speed chip assembly, and is widely applicable to the automated assembly needs of high-density and small-size chips in LED display manufacturing.

[0031] In the description of this utility model, it should be noted that the terms "top," "bottom," "one side," "the other side," "front," "back," "middle part," "inner," "top," and "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "joined" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0032] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A multi-station high-speed die bonder suitable for LED display screen, characterized in that, Includes a base (3), the upper end of which is fixedly connected to a first baffle (4) and a second baffle (28), one side of which is fixedly connected to a first connecting plate (8), the upper end of which is fixedly connected to a first motor (7), the output end of which is connected to a first rotating shaft (13), one end of which is fixedly connected to a transmission shaft (12), and the outer wall of which is fitted with a conveyor belt (2). 2.The multi-station high-speed die bonder for LED display screen of claim 1, wherein, The second baffle (28) is fixedly connected to the second connecting plate (11) on one side, and the upper end of the second connecting plate (11) is fixedly connected to the card block (10), and the card block (10) is fastened to the placement plate (9). 3.The multi-station high-speed die bonder for LED display screen of claim 1, wherein, The lower end of the base (3) is fixedly connected to the second support plate (5), the lower end of the second support plate (5) is fixedly connected to the bottom plate (6), and the upper end of the bottom plate (6) is fixedly connected to the first support plate (1). 4.The multi-station high-speed die bonder for LED display screen of claim 3, wherein, The top plate (27) is fixedly connected to the upper end of the first support plate (1), and the second motor (14) is fixedly connected to the upper end of the top plate (27). The output end of the second motor (14) is connected to the threaded rod (15), and one end of the threaded rod (15) is rotatably connected to the end plate (17) through a sliding bearing.

5. A multi-station high-speed die bonder for LED displays according to claim 4, characterized in that, The threaded rod (15) is rotatably connected to the threaded plate (16) at its middle end. The threaded plate (16) is fixedly connected to the third connecting plate (20) on one side. The third connecting plate (20) is fixedly connected to the slider (19) on one side. The slider (19) is slidably connected to the slide rail (18). 6.The multi-station high-speed die bonder for LED display screen of claim 5, wherein, The lower end of the threaded plate (16) is fixedly connected to the pneumatic cylinder (21), the output end of the pneumatic cylinder (21) is connected to the pneumatic rod (22), and the lower end of the pneumatic rod (22) is rotatably connected to the connecting seat (23). 7.The multi-station high-speed die bonder for LED display screen of claim 6, wherein, The lower end of the connecting seat (23) is connected to the connecting ring (24) by screws, and the lower end of the connecting ring (24) is fixedly connected to the ejector pin (25). The lower end of the ejector pin (25) is provided with an adsorption hole (26).

Images