半导体加工系统
By arranging semiconductor processing equipment horizontally and combining it with automated conveying and inspection modules, the problem of low overall processing efficiency of semiconductor equipment is solved, achieving efficient material conveying and quality inspection, and improving overall processing quality and efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG JINGRUI ELECTRONIC MATERIALS CO LTD
- Filing Date
- 2025-05-27
- Publication Date
- 2026-07-17
AI Technical Summary
The overall processing efficiency of existing semiconductor equipment is low, and the independent arrangement of each piece of equipment leads to low material conveying efficiency, which affects the efficiency of the overall processing system.
Design a semiconductor processing system that arranges and connects crystal thinning equipment, crystal slicing equipment, wafer thinning equipment, and wafer chamfering equipment in a horizontal direction, and realizes automated material transportation through conveying devices such as AGV conveyors and tracks, and combines resistance detection and vision inspection modules for timely detection and sorting.
It improves the overall processing efficiency and space utilization of semiconductor equipment, reduces secondary damage during material transportation, and optimizes processing quality and efficiency.
Smart Images
Figure CN224521534U_ABST
Abstract
Claims
1. A semiconductor processing system, characterized by, include: A crystal thinning apparatus (100), the crystal thinning apparatus (100) comprising: The first thinning stage (110) is used to support the crystal; The first thinning component (120) acts above the first thinning stage (110) to thin the crystal; A crystal slicing apparatus (200), the crystal slicing apparatus (200) comprising: A slicing stage (210) is used to hold crystals; A laser assembly (220) is positioned above the slicing stage (210) to laser-remove wafers. A wafer thinning apparatus (300), the wafer thinning apparatus (300) comprising: The second thinning stage (310) is used to carry the wafer; A second thinning component (320) acts above the second thinning stage (310) to thin the wafer; and A wafer chamfering apparatus (400), the wafer chamfering apparatus (400) comprising: A chamfering table (410) is used to hold wafers; A chamfering assembly (420) acts above the chamfering stage (410) to chamfer the wafer; The crystal thinning device (100), crystal slicing device (200), wafer thinning device (300), and wafer chamfering device (400) are arranged sequentially and connected along a first direction, which is a straight line on a horizontal plane. The crystal thinning device (100), crystal slicing device (200), wafer thinning device (300), and wafer chamfering device (400) are projected sequentially along the first direction to form a first projection surface with area S1, a second projection surface with area S2, a third projection surface with area S3, and a fourth projection surface with area S4. The first projection surface, the second projection surface, the third projection surface, and the fourth projection surface have an area of S1 along the first direction. c The common overlapping surface, the 2. The semiconductor processing system of claim 1, wherein, The crystal thinning device (100) has a first panel (130) located between the first thinning stage (110) and the slicing stage (210), and the first panel (130) is projected along a first direction to form the first projection surface; The crystal slicing device (200) has a second panel (230) located between the slicing stage (210) and the second thinning stage (310), and the second panel (230) is projected along a first direction to form a second projection surface; The wafer thinning apparatus (300) has a third panel (330) located between the second thinning stage (310) and the chamfering stage (410), and the third panel (330) is projected along a first direction to form the third projection surface; The chamfering device has a fourth panel (430) located on the side opposite to the wafer thinning device (300), and the fourth panel (430) is projected along a first direction to form the fourth projection surface.
3. The semiconductor processing system of claim 1, wherein, It also includes a conveying device (500), which comprises: A track (510) is disposed on one side of the crystal thinning device (100), the crystal slicing device (200), the wafer thinning device (300), and the wafer chamfering device (400); An AGV transport vehicle (520), the AGV transport vehicle (520) comprising: A sliding body (521) is slidably connected to the track (510); A robotic arm (522) is disposed on the sliding body (521) and has at least three degrees of freedom to actively grip materials; The communication module (523) is connected to the robotic arm (522), the crystal thinning device (100), the crystal slicing device (200), the wafer thinning device (300), and the wafer chamfering device (400) respectively.
4. The semiconductor processing system of claim 2, wherein, The laser assembly (220) includes: A laser (221) having an emitting end for emitting laser light; A first reflecting mirror (222) is located in the oriented direction of the emitting end and is used to receive the laser emitted by the emitting end; A second reflector (223), which is arranged parallel to the first reflector (222), is used to receive the laser light reflected from the first reflector (222); and Objective lens (224), which is disposed below the second reflecting mirror (223) and faces the slicing stage (210).
5. The semiconductor processing system of claim 1, wherein, It also includes a camera (600) with its lens facing the slicing platform (210). The slicing platform (210) is connected to a slicing moving mechanism (240), which acts on the slicing platform (210) to move the slicing platform (210). The slicing moving mechanism (240) is communicatively connected to the camera (600).
6. The semiconductor processing system of claim 1, wherein, The slicing platform (210) is provided with a vacuum adsorption port (211), and a vacuum pumping component (212) is connected below the vacuum adsorption port (211). The vacuum pumping component (212) is used for vacuuming.
7. The semiconductor processing system of claim 1, wherein, The first thinning stage (110) has a loading station (140) on one side, and a first resistance detector (150) is provided on one side of the loading station (140). The first resistance detector (150) acts on the loading station (140) to detect the resistance of the crystal.
8. The semiconductor processing system of claim 1, wherein, It also includes a sorting device (700), which is adjacent to the wafer chamfering device (400) and disposed away from the wafer thinning device (300). The sorting device (700) has a detection station (710), which is provided with a second resistance detector (720) for detecting the resistivity of the wafer.
9. The semiconductor processing system of claim 8, wherein, The sorting device (700) includes: The conveying channel (730) has at least two channels; The sorting component (740) is disposed between the inspection station (710) and the transport channel (730), and the transport sorting component (740) has multiple degrees of freedom to receive and transport wafers. The sorting component (740) is communicatively connected to the second resistance detector (720).
10. The semiconductor processing system of claim 9, wherein, The detection station (710) is provided with a visual detection module (750) on one side, the visual detection module (750) faces the detection station (710) to detect the appearance of the wafer, and the visual detection module (750) is connected in communication with the sorting element (740).