硅片清洗用摆动装置

What is AI technical title?
AI technical title is built by Patsnap AI team. It summarizes the technical point description of the patent document.
By designing a swing device for silicon wafer cleaning consisting of a support plate, support frame, drive motor, and turntable, the problems of poor silicon wafer cleaning effect and low efficiency in the existing technology are solved, and a more efficient cleaning effect is achieved.

CN224521536UActive Publication Date: 2026-07-17SHENGDA SEMICON EQUIP (JIANGSU) CO LTD

Patent Information

Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner: SHENGDA SEMICON EQUIP (JIANGSU) CO LTD
Filing Date: 2025-06-18
Publication Date: 2026-07-17

AI Technical Summary

Technical Problem

Existing technologies for cleaning silicon wafers are ineffective and inefficient, and traditional cleaning methods cannot meet the demand for high-efficiency cleaning.

Method used

A swinging device for silicon wafer cleaning was designed, comprising a support plate, a support frame, a drive motor, and a turntable. The motor drives the rotation of the turntable and the swing arm, enabling the basket to swing up and down inside the cleaning tank, thereby enhancing the cleaning effect.

Benefits of technology

The design of the oscillating device improves the cleaning effect and efficiency of silicon wafers, achieving better cleaning results.

✦ Generated by Eureka AI based on patent content.

Smart Images

Figure CN224521536U_ABST

Patent Text Reader

Abstract

本申请公开了一种硅片清洗用摆动装置，包括支撑板、支撑架、驱动电机和转盘，支撑板上固定有竖架，支撑架内前后对称设有一对竖板，支撑架上设有配合一对竖板插入的插槽，插槽内设有竖轨，竖板与竖轨配合上下滑动连接，一对竖板之间固定有连接板，驱动电机固定在支撑架内，转盘固定套设置驱动电机的输出端，转盘的端面铰接有摆臂，摆臂未于转盘铰接的一端与连接板铰接，一对竖板通过连接架与竖架固定连接。电机带动转盘从而带动摆臂摆动，当摆臂在转盘旋转过程中处于转盘端面不同位置时，带动连接板及与之相连的架体一并上下移动，从而达到摆动效果，使花篮在清洗箱内上下摆动，清洗效果更佳。

Need to check novelty before this filing date? Find Prior Art

Claims

1. A swinging device for cleaning silicon wafers, characterized in that: The device includes a support plate, a support frame, a drive motor, and a turntable. A vertical frame is fixed on the support plate. A pair of vertical plates are symmetrically arranged front and back inside the support frame. The support frame has slots for inserting the pair of vertical plates. A vertical rail is provided in the slot. The vertical plates and the vertical rail are slidably connected up and down. A connecting plate is fixed between the pair of vertical plates. The drive motor is fixed inside the support frame. The output end of the drive motor is fixedly sleeved on the turntable. A swing arm is hinged to the end face of the turntable. The end of the swing arm that is not hinged to the turntable is hinged to the connecting plate. The pair of vertical plates are fixedly connected to the vertical frame through the connecting frame.

2. The swing device for cleaning a silicon wafer according to claim 1, wherein: The connecting plate is provided with a plurality of first through holes, which are arranged sequentially along the length of the connecting plate. A bolt is inserted into the first through hole, and the end of the bolt passes through the first through hole and is connected to a nut. The end of the connecting plate is rotatably sleeved on the bolt.

3. The swing device for cleaning a silicon wafer according to claim 2, wherein: Multiple first through holes are equally spaced.

4. The oscillating device for cleaning a silicon wafer according to claim 2, wherein: There are two first through holes.

5. The oscillating device for cleaning a silicon wafer according to claim 1, wherein: The support plate is provided with several second through holes.

6. The oscillating device for cleaning a silicon wafer according to claim 5, wherein: Several second through holes are evenly distributed.