一种半导体兆声清洗设备

Abstract

本实用新型公开了一种半导体兆声清洗设备，包括兆声清洗机，所述兆声清洗机包括清洗箱，所述清洗箱的内部设置有内网箱体，所述内网箱体的内部通过轴承转动有转轴，所述清洗箱的内部两端均通过轴承安装有驱动轴，所述驱动轴的端部位于清洗箱的侧面固定有驱动电机；通过设计分布卡合安装机构，可以将半导体分布卡合在放置槽的内部通过橡胶防滑夹板挤压加固，半导体处于放置槽的内部单个插固安装，将驱动电机带动驱动轴与转轴转动，转轴转动时带动半导体处于内网箱体的内部转动均匀接触底端的清洗液并超声清洗处理，便利清洗，提高兆声清洗机对半导体分布均匀清洗的便利性与清洗效果。

Claims

1. A semiconductor megasonic cleaning device, comprising a megasonic cleaning machine (100), the megasonic cleaning machine (100) comprising a cleaning chamber (101), an inner mesh box (106) being provided inside the cleaning chamber (101), a rotating shaft (105) being rotatably mounted inside the inner mesh box (106) via bearings, and drive shafts (107) being mounted at both ends of the cleaning chamber (101) via bearings, the end of the drive shaft (107) being fixed to the side of the cleaning chamber (101) with a drive motor (104), characterized in that: The mega-sound cleaning machine (100) is also equipped with: The distributed locking and mounting mechanism includes a distributed locking and mounting component disposed on the outer surface of the rotating shaft (105), and a stable support component is provided at the connection between the two sides of the inner mesh box (106) and the inner side of the cleaning box (101). The convenient disassembly and assembly mechanism includes limiting connection components disposed at both ends of the rotating shaft (105). The end of the limiting connection component is provided with a locking component at the internal connection of the drive shaft (107). A fixing component is provided at the connection between one side of the locking component and the end surface of the rotating shaft (105).

2. The apparatus of claim 1 wherein: The upper surface of the cleaning box (101) is covered by a cover plate (102), and both bottom ends of the cleaning box (101) are fixed with megohm generators (103) by screws.

3. The apparatus of claim 1 wherein: the ultrasonic transducer is a piezoelectric transducer. The distributed snap-fit ​​mounting assembly includes a mounting box (1051) that is fixedly mounted on the outer surface of the rotating shaft (105) by fixing bolts. The mounting box (1051) has placement grooves (1052) equidistantly opened on its surface. Rubber anti-slip clamps (1053) are snap-fitted onto both sides of the interior of the placement grooves (1052).

4. The apparatus of claim 1 wherein: the ultrasonic transducer is a piezoelectric transducer. The stabilizing support assembly includes support rods (1054) fixedly installed at both ends of the inner mesh box (106) by screws. The ends of the support rods (1054) are equipped with control rollers (1055) via connecting shafts, and the surface of the control rollers (1055) is in contact with the inner surface of the cleaning box (101).

5. The apparatus of claim 1 wherein: the ultrasonic transducer is a piezoelectric transducer. The limiting connection assembly includes limiting grooves (1065) opened at both ends of the rotating shaft (105). The limiting grooves (1065) are internally limited by limiting plates (1064). Limiting slide rods (1066) are fixed on both sides of the inside of the limiting grooves (1065), and the limiting slide rods (1066) pass through the inside of the limiting plates (1064) and are slidably connected to each other.

6. A semiconductor megasonics cleaning apparatus as claimed in claim 5, wherein: The engaging assembly includes an integrally mounted mounting head (1062) on the surface of the limiting plate (1064). The mounting head (1062) has protrusions (1063) equidistantly arranged at the end edge. The drive shaft (107) has an internal hexagonal locking hole (1061) that engages with the mounting head (1062).

7. A semiconductor megasonics cleaning apparatus as claimed in claim 6, wherein: The fixing component includes a mounting bolt (1067) disposed at the end of the rotating shaft (105), and the surface of the mounting clip (1062) is provided with an internal thread hole (1068) that is threadedly connected to the mounting bolt (1067).

Images