一种半导体硅片清洗设备
By employing a loading device consisting of a drive unit, a push component, and a positioning detection unit in the semiconductor silicon wafer cleaning equipment, the problems of complex structure and water leakage risk of the loading device are solved, achieving low-cost and high-efficiency silicon wafer cleaning operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TIANJIN ZHONGHUAN ADVANCED MATERIAL TECH
- Filing Date
- 2025-06-25
- Publication Date
- 2026-07-17
AI Technical Summary
Existing semiconductor silicon wafer cleaning equipment has a complex structure, high manufacturing cost, and cumbersome operation. Furthermore, the installation requires drilling holes in multiple places in the loading water tank, which can lead to potential water leakage.
The loading device employs a drive unit, a push assembly, and a basket moving guide rail assembly. Combined with a multi-stage stepped structure and a positioning detection unit, it avoids opening holes in the loading water tank and ensures accurate positioning and safe loading through cylinder drive and sensor detection.
It reduces the risk of water leakage in the loading tank, lowers preparation costs, improves equipment lifespan and cleaning quality, simplifies the operation process, and reduces the risk of abnormal operation by personnel.
Smart Images
Figure CN224521542U_ABST
Abstract
Claims
1. A semiconductor silicon wafer cleaning device, comprising a loading substrate and a loading device, characterized in that: The loading device includes a drive unit, a push assembly, and at least one set of tray moving guide rail assemblies. Each set of tray moving guide rail assemblies includes two tray slide rails arranged opposite each other to support the tray. The tray slide rails are mounted on the loading base. The push assembly can contact the tray to push the tray. The drive unit includes a power mechanism for providing driving force. The power mechanism is connected to the push assembly to control the push assembly to move along the length direction of the tray slide rail.
2. The semiconductor silicon wafer cleaning apparatus of claim 1, wherein: The tray slide rail has a multi-step structure to accommodate trays of different sizes.
3. The semiconductor silicon wafer cleaning apparatus of claim 1, wherein: The loading device further includes a positioning detection unit, which includes a start sensor and a PLC controller. The start sensor is connected to the loading base to detect the position of the basket at the starting position. The power mechanism and the start sensor are respectively connected to the PLC controller.
4. The semiconductor silicon wafer cleaning apparatus of claim 3, wherein: The positioning detection unit further includes a starting positioning element, which is connected to the upper substrate and can contact the tray set at the starting position for positioning.
5. The semiconductor silicon wafer cleaning apparatus of claim 3, wherein: The positioning detection unit also includes a terminal sensor, which is connected to the upper substrate to detect the positioning of the tray at the terminal position.
6. The semiconductor silicon wafer cleaning apparatus of claim 1, wherein: The pushing component includes a movable base and a tray pusher. The movable base is slidably disposed below the tray slide rail and connected to the power mechanism. The tray pusher is connected to the movable base to push the corresponding tray.
7. The semiconductor silicon wafer cleaning apparatus of claim 1, wherein: The drive unit further includes a first connecting component, a first guide rail arranged parallel to the slide rail of the basket, and a first slider slidably connected to the first guide rail. The power mechanism is connected to the push component through the first connecting component, and the first slider is connected to the first connecting component.
8. The semiconductor silicon wafer cleaning apparatus of any one of claims 1-7, wherein: The loading device further includes a driven guide unit. The power mechanism is located on one side of the tray slide rail. The driven guide unit includes a second connecting component, a second guide rail, and a second slider that is slidably connected to the second guide rail. The second guide rail is located on the opposite side of the power mechanism. The second slider and the pushing component are respectively connected to the second connecting component.
9. The semiconductor silicon wafer cleaning equipment according to any one of claims 1-7, characterized in that: The power mechanism includes a cylinder connected to the upper substrate, and the output end of the cylinder is connected to the push assembly.
10. The apparatus according to any one of claims 1-7, wherein: The loading substrate is a loading water tank.