流道装置
By incorporating multiple layers of air curtains and wind curtains in the flow channel device, the problem of reduced inert gas concentration at the die bonding window is solved, thereby improving the yield of semiconductor products and the reliability of the substrate.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN LIANDE SEMICON TECH CO LTD
- Filing Date
- 2025-06-27
- Publication Date
- 2026-07-17
AI Technical Summary
In the high-temperature die bonding process of semiconductors, the die bonding window of the die bonding channel is connected to the outside world, which leads to a decrease in the concentration of inert gas, causing air to leak into the die bonding channel, affecting the reliability and yield of the substrate.
Design a flow channel device comprising a base, a cover plate, and first and second air inlets. The first air inlet blows airflow along a first direction to the die bonding window to form an air curtain, and the second air inlet blows airflow along a second direction to the die bonding station to form two layers of air curtains, which isolate external air from entering. Combined with flow guide grooves and flow guides, the airflow is guided to improve gas protection capability.
It effectively reduces the probability of external air entering the die bonding station, improves product yield, and enhances the reliability and connection accuracy of the substrate.
Smart Images
Figure CN224521544U_ABST
Abstract
Claims
1. A flow channel device, characterized by, include: Base; A cover plate is located on one side of the base in the height direction. The cover plate is connected to the base. A flow channel extending in a first direction is formed between the cover plate and the base. The flow channel is used to transport a substrate in the first direction. The flow channel includes a die bonding station. The cover plate is provided with a die bonding window that extends through the cover plate in the height direction and faces the die bonding station. The first air inlet is connected to the cover plate and is used to blow airflow along the first direction to the die bonding window. The second air inlet is connected to at least one of the base and the cover plate. The second air inlet is used to blow airflow along the second direction to the die bonding station. The first direction, the second direction and the height direction are arranged to intersect each other.
2. The flow channel device of claim 1, wherein The cover plate is also provided with a flow guide groove, and at least one flow guide protrudes from the wall of the flow guide groove. Both the flow guide groove and the flow guide extend along the first direction. The flow guide groove connects the first air blowing port and the die bonding window.
3. The flow channel device of claim 2, wherein The plurality of flow guides are spaced apart along the second direction, and the distance between adjacent flow guides is equal.
4. The flow channel device of claim 2, wherein The orthographic projection of the flow guide in the height direction is teardrop-shaped, and the orthographic projection outline of the flow guide in the height direction includes a rounded edge, which faces the first air inlet.
5. The flow channel device of claim 1, wherein The base is provided with a groove extending along the first direction, and the cover plate and the wall of the groove together enclose the flow channel; The flow channel device further includes a limiting plate, which is located inside the flow channel and connected to at least one of the base and the cover plate. The cover plate, the wall of the groove, and the limiting plate together enclose the die bonding station.
6. The flow channel device of claim 5, wherein The base includes a first bottom surface, the groove includes a second bottom surface facing the first bottom surface, and the limiting plate includes a third bottom surface and a fourth bottom surface disposed opposite each other along the height direction. The third bottom surface faces the second bottom surface and is flush with the second bottom surface, and the distance from the second bottom surface to the first bottom surface is less than the distance from the fourth bottom surface to the first bottom surface.
7. The flow channel device of claim 5, wherein The flow channel further includes a front station and a rear station, which are located on different sides of the die bonding station in the first direction. The width of the front station in the second direction and the width of the rear station in the second direction are both greater than the width of the die bonding station in the second direction.
8. The flow channel device of claim 1, wherein Also includes: The third air inlet is connected to at least one of the base and the cover plate, and the third air inlet is used to blow airflow along the height direction into the flow channel.
9. The flow channel device of claim 1, wherein The base is also provided with: A heating element for heating the substrate within the flow channel; A temperature measuring element is electrically connected to the heating element, and the temperature measuring element is used to monitor the temperature inside the flow channel.
10. The flow channel device of claim 1, wherein The airflow from both the first and second air outlets includes at least one inert gas.