一种芯片气密封装装置
By combining the design of the dispensing tube, the driving component, and the flexible heat insulation component, the problem of dispensing tube blockage during the hermetically sealed chip packaging process is solved, enabling the normal use of the dispensing tube and improving packaging efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Filing Date
- 2025-07-03
- Publication Date
- 2026-07-17
AI Technical Summary
In the existing hermetic chip packaging process, the high temperature of the encapsulation tank causes the residual epoxy resin in the dispensing tube to solidify and clog, affecting the dispensing operation and the service life of the dispensing tube.
The design employs a combination of a dispensing tube, a drive assembly, and an elastic heat insulation assembly. When epoxy resin is injected into the encapsulation tank and heated for curing, the drive assembly drives the dispensing tube away from the injection port. The elastic heat insulation assembly seals the dispensing tube to prevent heat transfer and blockage. The expansion and contraction of the airbag are achieved through the meshing transmission of the first toothed plate, the gear, and the second toothed plate, ensuring the normal use of the dispensing tube.
It effectively prevents clogging of the dispensing tube, extends the service life of the dispensing tube, improves packaging efficiency and ease of operation, and reduces operating costs.
Smart Images
Figure CN224521545U_ABST
Abstract
Claims
1. A chip hermetically sealed packaging device, comprising an operating table (1), a packaging groove (2) disposed on the operating table (1), an electric heating wire disposed in the packaging groove (2), and an injection port (3) disposed on one side of the packaging groove (2); characterized in that The encapsulation device further includes a dispensing tube (4) disposed in the injection port (3) for injecting epoxy resin into the encapsulation groove (2), a drive assembly (6) disposed on the encapsulation groove (2) for moving the dispensing tube (4) closer to or away from the inside of the injection port (3), and an elastic heat insulation assembly (7) disposed in the injection port (3) away from one end of the dispensing tube (4) and connected to the drive assembly (6) for moving with the dispensing tube (4) and sealing or opening the dispensing tube (4).
2. The hermetic chip package apparatus of claim 1, wherein: The encapsulation slot (2) includes a lower cover (21) fixedly installed on the operating table (1) for placing the chip, a fixed cover (22) fixedly installed on the operating table (1) at a position above the lower cover (21), an upper cover (23) located at the bottom of the fixed cover (22) and above the lower cover (21), a connecting seat (24) fixedly installed on the side of the upper cover (23) away from the lower cover (21), a cylinder (25) fixedly installed on the fixed cover (22) for driving the connecting seat (24) to rise and fall, and telescopic rods (26) symmetrically arranged on both sides of the cylinder (25) and fixedly connected at both ends to the connecting seat (24) and the fixed cover (22) respectively. The injection port (3) is opened on one side of the upper cover (23), and the electric heating wire is arranged inside the lower cover (21) and the upper cover (23).
3. The hermetic chip package apparatus of claim 2, wherein: The drive assembly (6) includes a servo electric cylinder (61) fixedly installed on one side of the connecting seat (24) and a connecting plate (62) fixedly sleeved on the outside of the end of the glue injection tube (4) away from the injection port (3). The connecting plate (62) is fixedly connected to the piston rod of the servo electric cylinder (61).
4. The chip hermetically sealed packaging device according to claim 3, characterized in that: The elastic heat insulation component (7) includes an airbag (71) fixedly connected to the side of the injection port (3) away from the inner wall of the injection tube (4) and an inflation component (72) disposed on the upper cover (23) and connected to the connecting plate (62) for inflating or contracting the airbag (71).
5. The hermetic chip package apparatus of claim 4, wherein: The inflation assembly (72) includes a first toothed plate (721) slidably connected to the upper cover (23) and fixedly connected to the connecting plate (62), a gear (722) rotatably connected to the upper cover (23) and meshing with the first toothed plate (721), a second toothed plate (723) slidably connected to the upper cover (23) and meshing with the gear (722) on the side away from the first toothed plate (721), an air cylinder (724) fixedly installed on the connecting seat (24), a piston (725) slidably connected to the air cylinder (724), a push rod (726) passing through the air cylinder (724) and fixedly connected at both ends to the piston (725) and the second toothed plate (723) respectively, and an air inlet pipe (727) fixedly installed in the upper cover (23) and communicating at both ends with the air cylinder (724) and the air bag (71) respectively. The push rod (726) is slidably connected to the air cylinder (724).
6. The hermetic chip package apparatus of claim 2, wherein: The encapsulation device also includes a glue delivery assembly (5) disposed on the fixing cover (22) and connected to the glue injection tube (4) for conveying and storing epoxy resin.
7. The hermetic chip package apparatus of claim 6, wherein: The glue delivery assembly (5) includes a storage tank (51) for storing epoxy resin, which is fixedly installed on the fixed cover (22), a suction pump (53) fixedly installed on the fixed cover (22), a connecting pipe (52) fixedly connected to one end of the suction pump (53) and communicating with the storage tank (51), and a delivery hose (54) fixedly connected to the other end of the suction pump (53) and communicating with the glue injection pipe (4).