一种半导体芯片固化处理装置

By using a linkage design, the chip can be automatically clamped and cured in all directions, which solves the problems of low efficiency and uneven curing caused by manual operation, and improves the quality and efficiency of semiconductor chip curing.

CN224521549UActive Publication Date: 2026-07-17BEIJING HAOHAI YUNXIN TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
BEIJING HAOHAI YUNXIN TECH CO LTD
Filing Date
2025-07-24
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing semiconductor chip curing equipment relies on manual operation for chip clamping, resulting in low efficiency, inaccurate positioning, and uneven curing, making it difficult to meet the demands of high-quality and high-efficiency production.

Method used

Employing a unique linkage design, the chip is automatically clamped and uniformly cured from all directions through the cooperation of drive components, limit components, and linkage components. The drive motor and linkage belt drive the clamping slide to move synchronously, and the return spring achieves fast and stable clamping and fixing. The support plate drives the chip to move up and down to ensure uniform heat distribution.

Benefits of technology

It simplifies the chip clamping process, improves operational efficiency, ensures uniform curing of chips from all directions, and enhances curing quality and efficiency.

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Abstract

本实用新型公开了一种半导体芯片固化处理装置，包括固化炉，所述固化炉的顶端固定有稳固撑板，所述稳固撑板的顶端四角固定有撑驱竖杆，所述撑驱竖杆的顶端一侧壁固定有驱动件，所述驱动件的外壁固定有限位件，所述限位件的一端固定有撑料横板，所述撑料横板的内部形成有空腔，所述空腔内转动有联动件，所述联动件的顶端固定有夹持滑杆。驱动电机启动后，能通过联动转杆、驱动转板、联动皮带等部件带动驱动滑块移动，进而带动连接转环和撑料横板上下移动，在芯片固化过程中，撑料横板带动芯片上下移动，可使芯片全方位、均匀地接受固化炉内的热量和处理条件，增加了芯片的固化效率，提升了半导体芯片固化处理的质量和效果。
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Claims

1. A semiconductor chip curing processing apparatus comprising a curing furnace (1), characterized by, The top of the curing oven (1) is fixed with a stabilizing support plate (2), and the top four corners of the stabilizing support plate (2) are fixed with support rods (3). A driving component is fixed to one side wall of the top of the support rod (3). A limiting component is fixed to the outer wall of the driving component. A material support plate (12) is fixed to one end of the limiting component. A cavity is formed inside the material support plate (12). A linkage component rotates inside the cavity. A clamping slide rod (16) is fixed to the top of the linkage component.

2. The apparatus according to claim 1, wherein The top of the support plate (12) has a groove that can limit the movement of the clamping slide bar (16).

3. The apparatus according to claim 1, wherein The driving component includes a drive motor (4), the drive motor (4) is fixed to one side of the top end of the support rod (3), a linkage rotating rod (5) is fixed to one end of the output shaft of the drive motor (4), a drive rotating plate (6) is fixed to the outer wall of the linkage rotating rod (5), and a linkage belt (7) is wound around the outer wall of the drive rotating plate (6).

4. The apparatus according to claim 1, wherein The limiting component includes a drive slider (8), and a plurality of drive sliders (8) are fixed on one side wall of the linkage belt (7). A groove is formed inside the top of the drive slider (8), and a limiting block (9) rotates in the groove. A connecting ring (10) rotates on the outer surface of the drive slider (8), and a limiting toothed ring (11) is fixed on the inner wall of the connecting ring (10).

5. The apparatus according to claim 4, wherein One end of a spring is fixed to the inner wall of the groove at the top of the drive slider (8), and the other end of the spring is fixed to a limit block (9). The spring's elasticity drives the limit block (9) to reset. A limit block is provided at the other end of the groove at the top of the drive slider (8) away from the spring, which can limit the limit block (9).

6. The apparatus of claim 1, wherein the apparatus further comprises a plurality of semiconductor chip solidification processing units. The linkage includes a rotating gear (13), the inside of the support plate (12) has a rotating gear (13) rotating, the outer wall of the rotating gear (13) is engaged with a linkage rack (14), and one end of the linkage rack (14) is fixed with a sliding crossbar (15).

7. The apparatus according to claim 6, wherein One end of a return spring is fixed to one side wall of the sliding crossbar (15), and the other end of the return spring is fixed to the inner wall of the cavity of the support crossbar (12). The elasticity of the return spring drives the sliding crossbar (15) to return to its original position.