一种半导体芯片固晶装置
By designing heating and driving components and using hot air to cure the adhesive, the chip misalignment problem was solved, automated adjustment was achieved, and the quality and efficiency of the die bonding device were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING HAOHAI YUNXIN TECH CO LTD
- Filing Date
- 2025-07-24
- Publication Date
- 2026-07-17
AI Technical Summary
Existing die bonding equipment is prone to chip misalignment before the adhesive solidifies, leading to poor contact and difficulties in gold wire bonding, which affects production efficiency and product quality.
The structure employs a combination of heating and auxiliary components. Hot air is delivered by a fan to temporarily cure the adhesive, and a drive component is used to achieve automated adjustment and limiting structure to prevent chip misalignment.
It effectively prevents chip misalignment, improves die bonding quality and efficiency, reduces manual intervention, and enhances production stability and applicability.
Smart Images
Figure CN224521550U_ABST
Abstract
Claims
1. A semiconductor die bonding apparatus comprising a support seat (1), characterized in that, The support base (1) is slidably connected to a support plate (2), and a slider (3) is fixed on the inner side of the support plate (2). The top and bottom ends of the support base (1) are provided with sliding grooves, and the slider (3) is slidably connected inside the sliding grooves. An auxiliary component is provided at the top end of the support plate (2), and a driving component is provided at the bottom end of the support base (1). A limiting plate (9) is provided on the outer wall of the driving component, and the outer wall of the limiting plate (9) is connected to the support base (1). A limiting block (10) is slidably connected inside the limiting plate (9). A connecting rod (11) is fixed on the outer wall of the limiting block (10), and the side of the connecting rod (11) away from the limiting block (10) is connected to the driving component. A heating component is provided at the bottom end of the support base (1).
2. The semiconductor die bonding apparatus of claim 1, wherein: The auxiliary component includes a support rod (4), which is fixed to the top of the support plate (2). A groove block (5) is rotatably connected to the inner side of the support rod (4), and a fixing member (6) is threadedly connected to the groove block (5) and the support rod (4).
3. The semiconductor chip die bonding device according to claim 1, characterized in that, The driving component includes a screw (7), the bottom end of the support base (1) is rotatably connected to the screw (7), the outer wall of the screw (7) is threadedly connected to a threaded block (8), and the side wall of the threaded block (8) is connected to the connecting rod (11). The top end of the threaded block (8) is connected to the support plate (2). A first bevel gear (17) is fixed on one side of the outer wall of the screw (7). A second bevel gear (18) meshes with the outer wall of the first bevel gear (17). The outer wall of the second bevel gear (18) is connected to the output shaft of the motor (16) through a rotating rod. The motor (16) is connected to the bottom end of the support base (1).
4. The semiconductor chip die bonding device according to claim 1, characterized in that, The heating element includes a heater (12), which is fixed at the bottom of the support base (1). A fan (13) is fixed at the air outlet of the heater (12). A connecting pipe (14) is fixed at the air outlet of the fan (13). The side of the connecting pipe (14) away from the fan (13) is connected to the groove block (5). A sleeve (15) is fixed on the outer wall of the connecting pipe (14). The outer wall of the sleeve (15) is connected to the bottom of the threaded block (8).
5. A semiconductor chip die bonding apparatus according to claim 4, characterized in that, The connecting pipe (14) is a spiral flexible tube.
6. The semiconductor chip die bonding apparatus according to claim 1, characterized in that, The limiting plate (9) has a limiting groove inside that matches the limiting block (10).
7. The semiconductor chip die bonding device according to claim 1, characterized in that, The heater (12) is a common electric heater on the market, and the heated air is delivered to the inside of the connecting pipe (14) by the fan (13).