一种硅片自动覆膜机

Abstract

本实用新型涉及硅片覆膜生产技术领域，公开了一种硅片自动覆膜机，包括机架、移料机构、传输机构、覆膜机构和下料机构；机架上设有用于外框放置的外框料架和用于硅片放置的硅片料架；移料机构设于机架上，且分别位于外框料架和硅片料架的外侧，用于外框与硅片的上料和成品的转移；传输机构设于机架上，且分别位于外框上料机构和硅片上料机构外侧，用于外框和硅片上料后的传输；传输机构上设有用于外框和硅片承载的承载组件；覆膜机构设于机架上，且横跨于传输机构上方，用于承载组件上外框与硅片之间的覆膜；下料机构设于机架上，且分别位于外框上料机构和硅片上料机构另一外侧，用于成品的下料。

Claims

1. A silicon wafer automatic film coating machine, characterized by comprising: include: A rack, wherein the rack is provided with an outer frame rack for placing the outer frame and a silicon wafer rack for placing the silicon wafer; A material transfer mechanism is provided on the frame and located on the outside of the outer frame material rack and the silicon wafer material rack, respectively, for loading the outer frame and silicon wafers and transferring finished products; A transmission mechanism is provided on the frame and located outside the outer frame loading mechanism and the silicon wafer loading mechanism, respectively, for transmission after the outer frame and silicon wafer are loaded; the transmission mechanism is provided with a support component for supporting the outer frame and silicon wafer. A coating mechanism is mounted on the frame and spans across the transmission mechanism for coating the outer frame of the carrier assembly with a film between the outer frame and the silicon wafer. The unloading mechanism is located on the frame and on the other side of the outer frame loading mechanism and the silicon wafer loading mechanism, respectively, and is used for unloading finished products.

2. The automatic film laminating machine for silicon wafer according to claim 1, wherein The outer frame material rack includes a first placement rack and a first lifting platform; the first placement rack is mounted on the machine frame; the first lifting platform is located in the center of the first placement rack, and is positioned between the first placement rack and the first placement rack for lifting; positioning components for positioning the outer frame are respectively provided at both ends of the first placement rack. A first upright is provided on one side of the first placement rack, and the first upright is circumferentially arranged with the positioning component; a first lifting cylinder is provided at the top of the first upright, and a first horizontal plate is connected to the output end of the first lifting cylinder; a first translation cylinder is provided at both ends of the first horizontal plate, and an adsorption claw for adsorbing the outer frame is connected to the output of the first translation cylinder; the adsorption claw is provided with multiple sets of first suction cups distributed at equal intervals, and the first suction cups are located above the positioning component.

3. The automatic film laminating machine for silicon wafer according to claim 2, wherein The positioning component includes a second upright frame; the second upright frame is provided with two sets of second and third translation cylinders distributed vertically; the output end of the second translation cylinder is provided with a first positioning plate, the outer side of the first positioning plate is provided with a positioning part corresponding to the outer frame, and the positioning part is provided with an outwardly extending limiting plate; the output end of the third translation cylinder is provided with a second positioning plate, the second positioning plate being located below the first positioning plate; the second positioning plate is provided with multiple sets of outwardly protruding positioning posts, and the first positioning plate is provided with multiple sets of slots corresponding to the positioning posts.

4. The automatic film laminating machine for silicon wafer according to claim 1, wherein The silicon wafer rack includes a silicon wafer transport component and a silicon wafer loading component. The silicon wafer transport component is equipped with multiple sets of silicon wafer hoppers. The silicon wafer transport component includes two sets of linear translation modules mounted vertically on the frame and a second lifting platform. The second lifting platform is located on the same side of the two sets of linear translation modules and is connected end-to-end to the two sets of linear translation modules. The silicon wafer loading component includes a first robotic arm, a flipping seat, and a silicon wafer positioning platform. The first robotic arm is located between the silicon wafer transport component and the transport mechanism. The flipping seat is located at the output end of the first robotic arm and is used for flipping the silicon wafer. The flipping seat has a clamping two-finger cylinder at its end, and the output end of the clamping two-finger cylinder has clamping claws for gripping the silicon wafer. The silicon wafer positioning platform is located on one side of the first robotic arm and is used for center positioning of the silicon wafer.

5. The automatic film laminating machine for silicon wafer according to claim 1, wherein The material transfer mechanism includes a second robotic arm and a mounting base; the second robotic arm is located between the outer frame material rack and the transmission mechanism; the mounting base is located on the output end of the second robotic arm; the four corners of the mounting base are respectively connected to second suction cups for adsorbing the outer frame; the mounting base is provided with a second lifting cylinder, and the output end of the second lifting cylinder is provided with an adsorption plate for adsorbing silicon wafers; a vision module for visual positioning of silicon wafers is provided between the second robotic arm and the transmission mechanism.

6. The automatic silicon wafer coating machine according to claim 1, characterized in that, The bearing assembly includes a first bearing platform and a second bearing platform movably mounted on the transmission mechanism; a first transmission drive component is provided between the first bearing platform and the transmission mechanism; and a bearing lifting drive module for adjusting the height of the second bearing platform is provided between the second bearing platform and the transmission mechanism. A second transmission drive component is provided between the load lifting drive module and the transmission mechanism to allow the second load platform to translate. The first and second support platforms are equipped with lifting cylinders at the top center for lifting finished products; the output end of the lifting cylinder is connected to the lifting platform; during film coating, the upper surface of the lifting platform is flush with the upper surfaces of the first and second support platforms respectively.

7. The automatic film coating machine for silicon wafer according to claim 1, wherein The laminating mechanism includes a laminating frame spanning the middle and above the conveying mechanism; the laminating frame is provided with film feeding rollers and waste film take-up rollers distributed on the left and right sides; a release film take-up roller is provided below the film feeding rollers; a film pressing roller for applying film and a tensioning component for tightening film are provided between the film feeding rollers and the waste film take-up rollers; the film pressing rollers and the tensioning component are respectively movably connected to the laminating frame; a film cutting lifting module is provided at the top of the middle part of the laminating frame; A film-cutting rotating platform is movably connected to the film-cutting lifting module; a film-cutting component is connected to the output end of the film-cutting rotating platform; and a cutter is provided at both ends of the film-cutting component.

8. The automatic film laminating machine for silicon wafer according to claim 7, wherein The tensioning component includes a tensioning plate movably mounted on the film-coating frame; the tensioning plate has two sets of symmetrically distributed tensioning jaws; a tensioning motor is provided between the two sets of tensioning jaws on the tensioning plate, and the output end of the tensioning motor has two sets of opposing connecting rods; one end of each connecting rod is connected to the tensioning motor, and the other end is connected to the output end of the tensioning motor; the tensioning plate has two sets of symmetrically distributed guide structures, and the two sets of guide structures are located on both sides of the tensioning jaws; The tensioning gripper includes a first gripping part and a second gripping part; the bottom end of the first gripping part is provided with a horizontally extending pressing part; a gripping cylinder is provided between the second gripping part and the first gripping part, the second gripping part is located above the pressing part, and the gripping cylinder drives the second gripping part to move closer to or away from the pressing part.

9. The automatic film laminating machine for silicon wafer according to claim 1, wherein The feeding mechanism includes a basket feeding platform, a feeding platform, and a flipping component for flipping finished products. The feeding platform is located on one side of the frame, and feeding lifting modules are respectively provided on the side wall of the feeding platform. Multiple sets of support platforms for placing baskets are movably provided on the feeding lifting modules. The flipping component is located on the side of the feeding platform near the transfer mechanism. The basket feeding platform is located on the side of the flipping component away from the frame, and a feeding translation module for transferring baskets to the support platforms is provided on the basket feeding platform.

10. The automatic film laminating machine for silicon wafer according to claim 9, wherein The flipping component includes a flipping table and a feeding plate; the flipping table is mounted on the frame, and a flipping lifting module is provided between the flipping table and the frame; a flipping rotary table is provided on the flipping table, and a rotating shaft is connected to the output end of the flipping rotary table; a flipping disk is provided on the rotating shaft, and multiple sets of equally spaced third suction cups are provided on the flipping disk; a first feeding translation module is provided between the feeding plate and the frame; a second feeding translation module is movably connected to the first feeding translation module, and the first feeding translation module and the second feeding translation module are arranged perpendicularly; the feeding plate is connected to the output end of the second feeding translation module and is located below the rotary table.

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