一种晶圆清洗装置
By using an inclined support platform and a flushing nozzle design, the problem of sulfuric acid being difficult to clean in grating trenches was solved, achieving efficient wafer cleaning and ensuring the quality and reliability of secondary epitaxy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGXI ZHAO CHI SEMICON CO LTD
- Filing Date
- 2025-07-29
- Publication Date
- 2026-07-17
AI Technical Summary
Before the secondary epitaxy of indium phosphide-based semiconductor laser chips, sulfuric acid tends to adhere to the grating trenches during wet cleaning, making it difficult to clean and affecting the quality of the secondary epitaxy.
Design a wafer cleaning device that uses an inclined support platform and rinsing nozzles, combined with a waste liquid box and a water resistance sensor, to ensure effective outflow of sulfuric acid and improve cleaning efficiency.
It effectively reduces the residue of sulfuric acid in the grating trench, improves cleaning efficiency, ensures the quality of secondary epitaxy, and enhances the reliability of the wafer after cleaning.
Smart Images
Figure CN224521554U_ABST
Abstract
Claims
1. A wafer cleaning apparatus, characterized by comprising: The utility model relates to a kind of wafer cleaning device, including: Housing, the surrounding space inside the housing is obliquely provided with bearing platform, operation window is opened on the housing; Wafer clamp, be arranged on the bearing platform, to fix the wafer to be cleaned in oblique posture; Cover plate, sealingly matched with the operation window, flush spray head is arranged on the cover plate, the flush spray head is arranged to the wafer clamp, and the cover plate is arranged in parallel with the wafer clamp.
2. The wafer cleaning apparatus according to claim 1, wherein Surrounding space in the housing is also provided with waste liquid box, the waste liquid box is arranged at the bottom of the bearing platform, a plurality of collection holes are arranged on the box cover of the waste liquid box, and the bottom of the waste liquid box is provided with drain hole.
3. The wafer cleaning apparatus according to claim 2, wherein Surrounding space in the housing is also provided with partition plate, to separate cleaning space and industrial control space, the bearing platform, the operation window and the waste liquid box are arranged in the cleaning space side, and industrial computer is also arranged in the industrial control space.
4. The wafer cleaning apparatus according to claim 3, wherein The housing includes a working panel arranged obliquely, the working panel is arranged in parallel with the bearing platform, the operation window is arranged on the working panel, and the interactive module of the industrial computer is arranged out by the working panel.
5. The wafer cleaning apparatus according to claim 3, wherein Water resistance sensor is arranged in the waste liquid box, and the water resistance sensor is connected with the industrial computer in communication.
6. The wafer cleaning apparatus of claim 1, wherein Nitrogen spray pipe is also arranged on the housing.
7. The wafer cleaning apparatus of claim 1, wherein Positioning column is also arranged on the bearing platform, and the positioning column is arranged around the wafer clamp.
8. The wafer cleaning apparatus of claim 1, wherein The cover plate is hingedly connected with the housing.