一种向流蚀刻槽
By improving the layout of the pipes in the wet etching tank and creating a forced convection field, the problem of uneven acid circulation was solved, thus improving the etching rate and etching quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHENGDU TOMI INTELLIGENT SYST TECH CO LTD
- Filing Date
- 2025-08-11
- Publication Date
- 2026-07-17
AI Technical Summary
In existing wet etching equipment, the baffles cause uneven acid circulation, forming low-flow-rate dead zones, which leads to a decrease in etching rate and a deterioration in the consistency of side etching.
By improving the layout of the pipes in the tank, and by using the liquid jet module, negative pressure absorption module and baffle module in synergy, a forced convection field is constructed to ensure that the etching solution flows evenly across the surface of the etched parts, avoiding stagnation or insufficient circulation.
It improves etching rate and etching quality, ensures balanced distribution and efficient circulation of etching solution, and enhances etching effect.
Smart Images
Figure CN224521559U_ABST
Abstract
Claims
1. A flow etching tank, comprising a square tank body, a circulation device connected to the tank body via a pipe, and a baffle module disposed within the tank body for supporting the etched parts, the baffle module comprising a plurality of vertically parallel baffles, characterized in that, A liquid jetting module and a negative pressure absorption module are respectively installed on opposite sides of the tank. The liquid jetting module is connected to the outlet pipe of the circulation device and is located at one end of the partition formed inside the baffle module. The negative pressure absorption module is connected to the inlet pipe of the circulation device and is located at the other end of the partition formed inside the baffle module. Under the drive of the circulation device, the etching solution in the tank forms a forced convection field from one end of the partition to the other end.
2. The flow-through etching cell according to claim 1, characterized in that The circulation device includes a centrifugal pump and a frequency converter. The centrifugal pump is connected to a pipeline to provide circulation power, and the frequency converter is installed on the centrifugal pump to control the start and stop of the centrifugal pump and the flow rate.
3. The flow-through etch tank of claim 1, wherein, The baffle module also includes a support frame and lifting accessories. Multiple baffles are vertically and parallelly placed in the support frame by positioning components. The side of the support frame is hollowed out so that the etching liquid in the tank can smoothly enter and exit the channel formed by multiple baffles. The lifting accessories are set on the support frame.
4. The flow-through etching cell according to any one of claims 1 to 3, characterized in that The liquid jetting module includes an inlet distribution pipe, a flow distribution riser, and nozzles. The inlet distribution pipe has a frame-shaped structure. The pipe at the outlet of the circulation device is connected to the middle of the upper side of the frame-shaped structure. Multiple flow distribution risers are configured and vertically connected to the lower side of the frame-shaped structure, corresponding one-to-one with the partitions. Multiple nozzles are arranged vertically at intervals along each flow distribution riser, and all of them face the corresponding partition.
5. The flow-through etching cell of claim 4, wherein, The nozzles are arranged at equal intervals on the flow distribution riser, and the spray angle is horizontal.
6. The flow-through etching cell of claim 4, wherein, The two sides of the frame structure of the liquid inlet distribution pipe are configured in an L-shape, so that the lower side and the upper side are misaligned.
7. The flow-through etching cell of claim 4, wherein, A buffer is also provided between the liquid inlet distribution pipe and the flow distribution riser.
8. The flow-through etching cell of claim 7, wherein, The buffer is integrated into the liquid inlet distribution pipe with an expanded diameter structure, so that the diameter of the lower side of the frame structure of the liquid inlet distribution pipe is larger than the diameter of the upper side of the frame structure.
9. The flow-through etching cell according to any one of claims 1 to 3, characterized in that The negative pressure absorption module includes an outlet manifold and a negative pressure riser. The outlet manifold has a frame-like structure. The pipe at the inlet of the circulation device is connected to the middle of the upper side of the frame-like structure. Multiple negative pressure risers are configured and vertically connected to the lower side of the frame-like structure, corresponding one-to-one with the partitions. Each negative pressure riser has multiple suction holes vertically spaced, and the suction holes face the corresponding partitions.
10. The flow-through etching cell of claim 9, wherein, The two sides of the frame structure of the liquid outlet manifold are configured in an L-shape, so that the lower side and the upper side are misaligned.