晶圆预键合装置
The wafer pre-bonding device, which utilizes point contact support and a multi-level alignment mechanism, solves the problems of high risk of wafer scratches and contamination and complex structure in existing technologies, achieving high-precision and high-efficiency wafer bonding.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU RES MATERIALS MICRONANO TECH CO LTD
- Filing Date
- 2025-08-14
- Publication Date
- 2026-07-17
AI Technical Summary
Existing wafer pre-bonding devices suffer from problems such as easy scratching of the wafer, high risk of contamination, complex and inflexible structure in terms of wafer support mechanism design, which affect bonding quality and efficiency.
The upper plate support mechanism supports the upper plate through point contact placement columns, combined with a multi-stage alignment mechanism and tilting mechanism to achieve precise alignment and stable bonding of the upper and lower plates, including synchronous transmission design and motor-driven shaft system.
It significantly reduces the risk of friction and scratches on the wafer surface, improves bonding accuracy and success rate, simplifies the structure, enhances operational stability and flexibility, and ensures the quality and efficiency of wafer pre-bonding.
Smart Images
Figure CN224521560U_ABST
Abstract
Claims
1. A wafer pre-bonding apparatus, comprising: The device includes a frame and a worktable. A working chamber is provided on the worktable, and a lower suction cup for adsorbing the lower film is provided in the working chamber. An upper film support mechanism is provided on the outer periphery of the lower suction cup for supporting the upper film above the lower film or releasing the upper film. An alignment mechanism and a bonding mechanism are also provided on the worktable. The alignment mechanism is used to align the upper film and the lower film. The bonding mechanism is used to press down the upper film after the upper film and the lower film are aligned so that the upper film and the lower film are bonded.
2. The wafer pre-bonding apparatus of claim 1, wherein, The upper support mechanism includes several rotating shafts evenly arranged around the outer periphery of the lower suction cup. The top end of each rotating shaft is connected to one end of the upper plate placement gripper, and the other end of the upper plate placement gripper is provided with a placement post. The lower part of each rotating shaft is provided with a synchronous pulley, and all the synchronous pulleys are connected by a synchronous belt. The bottom end of one of the rotating shafts is connected to a motor through a coupling.
3. The wafer pre-bonding apparatus of claim 2, wherein, An idler wheel that rotates freely is provided between two adjacent rotating shafts, and the idler wheel is engaged with the timing belt for tensioning.
4. The wafer pre-bonding apparatus of claim 1, wherein, The upper surface of the lower suction cup is provided with several retractable positioning posts, which can elastically extend and retract radially.
5. The wafer pre-bonding apparatus of claim 1, wherein, The alignment mechanism includes a base plate, an X-axis fine-tuning platform, a Y-axis fine-tuning platform, an alignment rod, and a cylinder. The Y-axis fine-tuning platform is mounted on the base plate, and the X-axis fine-tuning platform is mounted on the Y-axis fine-tuning platform via an adapter plate. A mounting plate is mounted on the X-axis fine-tuning platform, and the alignment rod and cylinder are mounted on the mounting plate. The alignment rod moves telescopically under the drive of the cylinder.
6. The wafer pre-bonding apparatus according to any one of claims 1 to 5, characterized in that, The lower suction cup is provided with a positioning block, and the upper and lower plates are provided with positioning grooves that match the positioning block; a tilting mechanism is provided below the worktable to tilt and lift the worktable, and the tilting mechanism is located at the relative position of the positioning block.
7. The wafer pre-bonding apparatus of claim 6, wherein, The tilting mechanism includes a cylinder plate, a cylinder, a single-axis connector, and a double-ear support. The cylinder is mounted on the cylinder plate, the output end of the cylinder is provided with a single-axis connector, the top of the single-axis connector is provided with a double-ear support, and the double-ear support is connected to the bottom of the worktable.
8. The wafer pre-bonding apparatus of claim 1, wherein, The bonding mechanism includes a second lifting assembly, a rotary motor module, a connecting rod, and a pressure head. One end of the connecting rod is provided with a downwardly arranged pressure head, and the other end of the connecting rod is connected to the rotary motor module. The rotary motor module and the connecting rod are controlled by the second lifting assembly to perform lifting and lowering movements.
9. The wafer pre-bonding apparatus of claim 1, wherein, The working chamber includes a lower working chamber and an upper working chamber. The lower working chamber has a hollow structure with an open upper end, and the lower suction cup is disposed inside the lower working chamber. The upper working chamber has a hollow structure with an open lower end, and the upper working chamber is vertically and vertically disposed above the lower working chamber via a first lifting assembly.