一种半导体晶圆浸泡清洗的装置

By designing a lifting and rotating mechanism and an immersion tank, combined with ultrasonic and bubbling components, the problems of low pollutant removal rate and difficulty in film removal in immersion cleaning devices are solved, achieving efficient cleaning and convenient maintenance.

CN224521561UActive Publication Date: 2026-07-17SUZHOU DAZUXIN TECHNOLOGY CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUZHOU DAZUXIN TECHNOLOGY CO LTD
Filing Date
2025-08-18
Publication Date
2026-07-17

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Abstract

本实用新型公开了一种半导体晶圆浸泡清洗的装置,包括升降旋转机构和浸泡池,所述升降旋转机构包括立柱、晶圆盒和浸泡盒,所述立柱安装有第二丝杆模组,所述第二丝杆模组驱动升降板升降,所述升降板安装有第一丝杆模组和第二转接板,第二转接板底端安装有第二升降柱,所述第二升降柱底端安装有支撑架,所述第一丝杆模组驱动第一转接板升降,所述第一转接板安装有第一升降柱,所述第一升降柱贯穿第二升降柱;所述浸泡盒两侧与支撑架转动连接,所述浸泡盒两侧均转动安装有旋转板,两个所述旋转板之间安装有转接柱。本实用新型,通过超声波换能器和鼓泡组件,具有超声波震荡功能及吹气鼓泡辅助去胶功能,加速胶膜溶解。
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Claims

1. An apparatus for immersion cleaning of a semiconductor wafer, the apparatus comprising: a wafer support; a wafer cleaning station; a wafer transport system; and a wafer cleaning station controller. The system includes a lifting and rotating mechanism (1) and an immersion tank (2). The lifting and rotating mechanism (1) includes a column (101), a wafer box (114), and an immersion box (115). The column (101) is equipped with a second lead screw module (104), which drives a lifting plate (103) to move up and down. The lifting plate (103) is equipped with a first lead screw module (102) and a second adapter plate (108). A second lifting column (109) is installed at the bottom of the second adapter plate (108), and a support frame (113) is installed at the bottom of the second lifting column (109). The first lead screw module (102) drives a first adapter plate (107) to move up and down. The first adapter plate (107) is equipped with a first lifting column (110). The second lifting column (109) passes through the immersion box (115); the two sides of the immersion box (115) are rotatably connected to the support frame (113), and the two sides of the immersion box (115) are rotatably mounted with rotating plates (112), and the two rotating plates (112) are connected with a connecting column (111), the connecting column (111) passes through the first lifting column (110), and the immersion box (115) is detachably mounted with a wafer box (114); the wafer box (114) is provided with multiple slots (116) at equal intervals, and one end of the wafer box (114) is provided with multiple quick-release plates (118), the immersion box (115) is provided with quick-release holes (119) that cooperate with the quick-release plates (118), and the immersion box (115) is equipped with a hand-tightening screw (117) for locking the wafer box (114).

2. The apparatus for immersion cleaning of a semiconductor wafer according to claim 1, wherein: The upper part of the quick-release hole (119) is larger than the lower part of the quick-release hole (119), and the outer end of the quick-release plate (118) is smaller than the upper part of the quick-release hole (119) and the outer end of the quick-release plate (118) is larger than the lower part of the quick-release hole (119).

3. The apparatus for immersion cleaning of a semiconductor wafer of claim 1, wherein: The top of the lifting plate (103) is equipped with a first limiting plate (105) that limits the first adapter plate (107), and the top of the second adapter plate (108) is equipped with a second limiting plate (106) that limits the first adapter plate (107).

4. The apparatus for immersion cleaning of semiconductor wafers according to claim 1, characterized in that: The soaking tank (2) includes a bottom plate (201), a lower cavity (202) and an upper cavity (203). An ultrasonic transducer (208) is installed at the bottom end of the bottom plate (201). The lower cavity (202) is installed at the top end of the bottom plate (201). The upper cavity (203) is installed at the top end of the lower cavity (202). A lifting door assembly (205) is installed on one side of the upper cavity (203). A suction hood (207) is installed on the outside of the lifting door assembly (205) of the upper cavity (203). The top of the upper cavity (203) and the suction hood (207) are both connected to the air extraction pipe assembly (206). A bubble bubbling assembly (209) is provided at the bottom of the lower cavity (202).

5. The apparatus for immersion cleaning of a semiconductor wafer of claim 4, wherein: The upper cavity (203) is provided with an inlet pipe (210) at the lower part, and the lower cavity (202) is provided with an overflow pipe (211) at the upper part; the upper cavity (203) is provided with an observation window (204) and a quick release door at the side.