一种晶圆浸泡清洗设备

Abstract

本实用新型公开了一种晶圆浸泡清洗设备，包括箱体，所述箱体内还设有清洗池；所述清洗池包括支撑板，所述支撑板的一侧设有第一清洗区，且支撑板的另一侧设有第二清洗区；所述箱体还设有升降件，所述升降件的工作端穿过所述支撑板后与设有的横担连接；所述横担的两端均设有用于存放晶圆的存放架，并通过所述升降件的升降，以令所述存放架进入所述清洗池内或者将所述存放架从所述清洗池内取出。由于在箱体内部设置两个清洗区，并通过升降件带动两个存放架进入到对应的清洗区内，故而使得该设备在实现对晶圆清洗的同时还可以对晶圆进行浸泡，尤其是，利用升降件促使存放架升降，将清洗后的晶圆抬升，在便于晶圆沥水的同时又便于用户取放晶圆。

Claims

1. A wafer immersion cleaning apparatus, characterized by: Includes a housing (1), and a cleaning tank (3) is provided inside the housing (1); the cleaning tank (3) includes a support plate (30), a first cleaning area (31) is provided on one side of the support plate (30), and a second cleaning area (35) is provided on the other side of the support plate (30). The box body (1) is also provided with a lifting component (4), and the working end of the lifting component (4) passes through the support plate (30) and is connected to the provided crossbeam (5); Both ends of the crossarm (5) are provided with storage racks (6) for storing wafers. The storage racks (6) can be moved into the cleaning tank (3) or taken out of the cleaning tank (3) by the lifting member (4).

2. The wafer immersion cleaning apparatus of claim 1, wherein: Heaters (34) are provided in both the first cleaning zone (31) and the second cleaning zone (35); wherein, drain outlets (36) are provided at the bottom of both the first cleaning zone (31) and the second cleaning zone (35), and the drain outlets (36) pass through one end of the box (1) and are connected to the valves (7) provided.

3. The wafer immersion cleaning apparatus of claim 2, wherein: An ultrasonic transducer (32) is also provided on the inner wall surface of the first cleaning zone (31) and the second cleaning zone (35).

4. The wafer immersion cleaning apparatus of claim 3, wherein: Temperature sensors (33) are also provided on the inner wall surfaces of the first cleaning zone (31) and the second cleaning zone (35).

5. The wafer immersion cleaning apparatus of claim 4, wherein: The number of ultrasonic transducers (32) and temperature sensors (33) is two, and the two ultrasonic transducers (32) and the two temperature sensors (33) are arranged vertically in the cleaning tank (3).

6. The wafer immersion cleaning apparatus of any one of claims 1-5, wherein: The storage rack (6) includes a support (60) for lifting the wafer from the bottom of the wafer, and a crossbeam (61) is provided on both sides of the support (60), and a baffle (63) on the crossbeam (61) for shielding the wafer from the side of the wafer.

7. The wafer immersion cleaning apparatus of claim 6, wherein: The bottom of the bracket (60) and the baffle (63) are both provided with support parts (62), and the support parts (62) are evenly distributed with slots (66).

8. The wafer immersion cleaning apparatus of claim 7, wherein: Both ends of the crossbeam (61) are provided with sliding grooves (64), and both ends of the baffle (63) are connected to the sliding grooves (64) by fasteners (65).

9. The wafer immersion cleaning apparatus of claim 8, wherein: The front of the box (1) is also provided with a box door (8), and the box door (8) is also provided with a control panel (9).

10. The wafer immersion cleaning apparatus of claim 9, wherein: The cleaning tank (3) is also equipped with a cover (2).

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