一种采用双中转台同时贴装两颗芯片的封装设备

Abstract

本实用新型公开了一种采用双中转台同时贴装两颗芯片的封装设备，包括上料机构、搬运机构、双头拾取机构、双写锡机构、双整形机构、双装片机构、双中转台机构和加热机构。通过设置上料机构、搬运机构、双写锡机构、加热机构、双整形机构、双头拾取机构、双装片机构和双中转台机构，经一次加热轨道，将两颗不同的芯片一次性组装在同一基岛上完成贴片，有效避免传统封装过程因两次熔炼凝固造成的封装缺陷；引线框架单次进入搬运机构后，全程在同一轨道内完成双写锡、双整形至双装片全流程加工，避免二次定位，保证装片质量稳定性；双中转台将两颗不同的芯片同时运送到拾取工位上，节约了芯片运送周期，提升运送芯片效率，从而提升设备整体生产效率。

Claims

1. A packaging device that simultaneously mounts two chips using dual transfer stations, characterized in that, The assembly includes a feeding mechanism (1), a conveying mechanism (2), a dual-head pickup mechanism (3), a dual soldering mechanism (4), a dual shaping mechanism (5), a dual wafer mounting mechanism (6), a dual transfer station mechanism (7), and a heating mechanism (8). The feeding mechanism (1) is used to feed the lead frame onto the conveying mechanism (2), which can sequentially transport the lead frame to each workstation for processing. The heating mechanism (8), the dual soldering mechanism (4), the dual shaping mechanism (5), and the dual-head pickup mechanism (3) are arranged sequentially along the conveying direction of the conveying mechanism (2). The structure (8) is used to heat the lead frame during the transport process. The dual solder writing mechanism (4) is used to write solder on the heated lead frame. The dual shaping mechanism (5) is used to shape the solder on the lead frame. The dual-head picking mechanism (3) can pick up two chips of different specifications at the same time and place them on the two transfer tables of the dual transfer table mechanism (7). The two transfer tables can transport the chips to the picking station at the same time. The dual die mounting mechanism (6) is used to mount the chips on the two transfer tables of the picking station onto the solder on the lead frame at the same time.

2. The apparatus according to claim 1, wherein The dual transfer station mechanism (7) further includes a first wafer stage (71) and a second wafer stage (72). The two transfer stations include a first transfer station (73) and a second transfer station (74). The first transfer station (73) and the second transfer station (74) are mounted on a linear module (75). The first transfer station (73) can reciprocate between the position of the first wafer stage (71) on the linear module (75) and the picking station. The second transfer station (74) can reciprocate between the position of the second wafer stage (72) on the linear module (75) and the picking station.

3. The apparatus according to claim 2, wherein The dual-head pickup mechanism (3) includes a first pickup mechanism (31) and a second pickup mechanism (32). The first pickup mechanism (31) is located on the side close to the first wafer stage (71), and the second pickup mechanism (32) is located on the side close to the second wafer stage (72). The first pickup mechanism (31) is used to pick up the chip on the first wafer stage (71) and place it on the first transfer station (73). The second pickup mechanism (32) is used to pick up the chip on the second wafer stage (72) and place it on the second transfer station (74).

4. The apparatus according to claim 2, wherein the apparatus is characterized by: It also includes a visual positioning mechanism (9), which is used to position the chip before the dual-head pickup mechanism (3) picks up the chip on the first wafer stage (71) and the second wafer stage (72).

5. The apparatus for packaging two chips simultaneously using a double turntable according to claim 2, wherein, The dual die-mounting mechanism (6) includes a first die-mounting head (61) and a second die-mounting head (62). The first die-mounting head (61) can mount the chip on the first transfer station (73) onto the lead frame, and the second die-mounting head (62) can mount the chip on the second transfer station (74) onto the lead frame.

6. The apparatus for packaging two chips simultaneously using a dual stage according to claim 1, wherein, It also includes a feeding mechanism (10), which is located at the end of the conveying mechanism (2) and can feed the lead frame with the chip attached into the material box.

7. The apparatus according to claim 6, wherein the apparatus is characterized by: The conveying mechanism (2) is a conveying track, the heating mechanism (8) is located on the lower side of the conveying mechanism (2), the area on the conveying mechanism (2) near the feeding mechanism (1) is the heating zone (21), and the area on the conveying mechanism (2) near the unloading mechanism (10) is the non-heating zone (22).

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