一种晶圆裂片后的吹片装置
By using a vertical triangular wafer support frame and an automated nitrogen drying device, the high gas consumption and breakage risk in the wafer drying process are solved, achieving low-cost, high-efficiency, and uniform wafer drying results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JILIN HUAYAO SEMICON CO LTD
- Filing Date
- 2025-08-25
- Publication Date
- 2026-07-17
AI Technical Summary
Existing technologies suffer from high air consumption, high operating costs, incomplete drying, and the risk of wafer breakage during wafer drying, especially for wafers with complex structures.
A vertical triangular wafer support frame was designed, which, combined with a nitrogen nozzle and automated air circuit control, enables non-contact and efficient drying. A closed-loop air circuit is formed by a timer and a solenoid valve to ensure precise control of pressure and time and avoid human error.
It significantly reduces gas consumption and operating costs, improves the uniformity and consistency of drying, reduces the risk of wafer breakage, and enhances production efficiency and wafer surface integrity.
Smart Images
Figure CN224521566U_ABST
Abstract
Claims
1. A wafer post-dicing blower, comprising: include: Gas connection pipe; A nitrogen pressure gauge, one end of which is connected to the gas connection pipe; A timer and a device switch, both of which are mounted on the nitrogen pressure gauge; A vertical triangular wafer support frame, wherein the wafer support frame has an inclined surface; A nitrogen nozzle is fixed above the inclined surface and connected to the nitrogen pressure gauge via a pipeline.
2. The wafer post-break blown device of claim 1, wherein, The wafer support frame is an isosceles triangular structure, and the angle between the inclined plane and the horizontal plane is 25° to 35°.
3. The wafer post-break apparatus of claim 1, wherein, A water collection trough is provided at the lower end of the inclined plane.
4. The wafer post-break apparatus of claim 1, wherein, The nitrogen nozzles are arranged linearly at equal intervals above the inclined plane, and the angle between each nitrogen nozzle and the normal of the inclined plane is 20°.
5. The wafer post-break apparatus of claim 1, wherein, The distance between the nitrogen nozzle and the inclined surface is 8mm to 10mm.
6. The wafer post-break blown device of claim 1, wherein, The timer and the device switch are respectively electrically connected to the solenoid valve located below the nitrogen pressure gauge via wires.