A semi-automatic wafer cleaning equipment front and rear tank transfer mechanism

Abstract

This utility model relates to a front and rear tank transfer mechanism for a semi-automatic wafer cleaning equipment. The front and rear tank transfer mechanism includes a rotating shaft, which is vertically positioned, with front and rear tanks mounted on its lower end. A driving device drives the rotating shaft to rotate, causing the front and rear tanks to rotate and transfer materials. The driving mechanism includes a motor and a reducer. The motor and reducer share a support frame, on which a driving disc is mounted. The driving disc is located above the reducer, and its shaft is connected to the input end of the reducer via a coupling. The output end of the reducer is connected to the upper end of the rotating shaft. The motor is located on the side of the support frame and is directly connected to the hollow drive disc via a corner bracket. The design is reasonable and the structure is simple. The rotating disc and the corner bracket directly connecting to the hollow drive disc allow the motor to be mounted on the side, freeing up height space and reducing the overall height of the mechanism, thus solving the problem of height limitations in cleanrooms.

Description

Technical Field

[0001] This utility model relates to wafer cleaning, specifically to a semi-automatic wafer cleaning equipment with a front and rear tank transfer mechanism. Background Technology

[0002] The semi-automatic wafer cleaning equipment uses a geared motor to drive the rotating shaft to rotate and move the front and rear tanks. The transmission geared motor design scheme is that the motor and the reducer are distributed vertically, which makes the overall height relatively long. In order to meet the wafer cleaning requirements, space must be left for the overall movement of the mechanism. In the semiconductor industry, the height of cleanrooms is generally limited, which cannot meet the height requirements of the transfer mechanism. Utility Model Content

[0003] In view of the above problems, this utility model proposes a material transfer mechanism between the front and rear tanks of a semi-automatic wafer cleaning equipment.

[0004] The technical solution of this utility model:

[0005] A semi-automatic wafer cleaning equipment includes a front and rear tank transfer mechanism. The front and rear tank transfer mechanism includes a rotating shaft, which is vertically positioned, and a front and rear tank are installed at the lower end of the rotating shaft. A driving device drives the rotating shaft to rotate, and the front and rear tanks rotate accordingly to transfer materials. The driving mechanism includes a motor and a reducer. The motor and reducer share a bracket, and a driving disk is installed on the bracket. The driving disk is located above the reducer, and the shaft of the driving disk is connected to the input end of the reducer through a coupling. The output end of the reducer is connected to the upper end of the rotating shaft. The motor is located on the side of the bracket and is directly connected to the hollow drive disk through an angle bracket.

[0006] Further refining the above technical solution, the front and rear grooves are fixed on the plastic mounting base, and the lower end of the rotating shaft passes through the mounting base and is locked by a nut. The cleaning solution used for the wafer emits strong acid gas, which corrodes the lower end of the rotating shaft (made of stainless steel to ensure strength) and the nut, causing corrosion and loosening. A plastic cover plate is installed at the bottom of the plastic mounting base, covering the lower end of the rotating shaft and the nut. A seal I is provided between the plastic cover plate and the plastic mounting base. The rotating shaft is covered by a plastic shell, the lower end of which connects to the plastic mounting base. A seal II is provided between the plastic shell and the plastic mounting base. This effectively isolates the strong acid gas from contact with the lower end of the rotating shaft and the nut, preventing corrosion.

[0007] A further improvement to the above technical solution is that a seal III is provided between the nut and the plastic mounting base.

[0008] To further refine the above technical solution, a recessed groove is provided at the bottom of the plastic cover mounting base, the lower end of the rotating shaft and the nut are located in the recessed groove, and the plastic cover plate constitutes the seal of the recessed groove.

[0009] To further refine the above technical solution, the lower end of the plastic shell is flanged and connected to the mounting base via a flange.

[0010] Further refining the above technical solution, the contact surface between the lower end of the rotating shaft and the mounting base includes a flat edge.

[0011] The advantages of this utility model are that it has a reasonable design and simple structure. With the help of a rotating disk and a corner device directly connected to the hollow, the motor can be installed on the side, freeing up space in terms of height, thereby reducing the overall height of the mechanism and solving the problem of limited height in cleanrooms. Attached Figure Description

[0012] Figure 1 This is a schematic diagram (partial cross-section) of the material transfer mechanism between the front and rear tanks of a semi-automatic wafer cleaning equipment.

[0013] Figure 2 yes Figure 1 A magnified view of a portion of the image.

[0014] Figure 3 This is a schematic diagram of the rotating shaft structure.

[0015] In the diagram, 1 is the rotating shaft, 2 is the front and rear grooves, 3 is the drive unit, 3-1 is the motor, 3-2 is the reducer, 3-3 is the drive disc, 3-4 is the coupling, 3-5 is the angle device with direct connection to the hollow part, 4 is the bracket, 5 is the plastic mounting base, 6 is the nut, 7 is the plastic cover plate, 8 is the seal I, 9 is the plastic shell, 10 is the seal II, 11 is the seal III, 12 is the settling groove, and 13 is the flat edge. Detailed Implementation

[0016] The present invention will now be described in detail with reference to the embodiments shown in the accompanying drawings.

[0017] like Figure 1-3 As shown, a semi-automatic wafer cleaning equipment has a front and rear tank transfer mechanism. The front and rear tank transfer mechanism includes a rotating shaft 1, which is vertically placed. The front and rear tanks 2 are installed at the lower end of the rotating shaft 1. A driving device 3 drives the rotating shaft 1 to rotate, and the front and rear tanks 2 rotate accordingly to transfer materials.

[0018] The drive mechanism 3 includes a motor 3-1 and a reducer 3-2. The motor 3-1 and the reducer 3-2 share a bracket 4. A drive disk 3-3 is mounted on the bracket 4. The drive disk 3-3 is located above the reducer 3-2. The shaft of the drive disk 3-3 is connected to the input end of the reducer 3-2 through a coupling 3-4. The output end of the reducer 3-2 is connected to the upper end of the rotating shaft 1. The motor 3-1 is located on the side of the bracket 4. The motor 3-1 is directly connected to the drive disk 3-3 through a corner joint and a hollow 3-5.

[0019] The front and rear grooves 3 are fixed on the plastic mounting base 5. The lower end of the rotating shaft 1 passes through the plastic mounting base 5 and is locked by the nut 6. A plastic cover plate 7 is installed at the bottom of the plastic mounting base 5, covering the lower end of the rotating shaft 1 and the nut 6. A seal I 8 is provided between the plastic cover plate 7 and the plastic mounting base 5. The rotating shaft 1 is covered by a plastic shell 9, the lower end of which is connected to the plastic mounting base 5. A seal II 10 is provided between the plastic shell 9 and the plastic mounting base 5. A seal III 11 is provided between the nut 6 and the plastic mounting base 5. A recess 12 is provided at the bottom of the plastic mounting base 5. The lower end of the rotating shaft 1 and the nut 6 are located in the recess 12. The plastic cover plate 7 forms the seal of the recess 12. The lower end of the plastic shell 9 is flanged and is connected to the plastic mounting base 5 through a flange. The contact surface between the lower end of the rotating shaft 1 and the mounting base includes a flat edge 13.

[0020] The above embodiments are only for illustrating the technical concept and features of the utility model, and are intended to enable those skilled in the art to understand the content of the utility model and implement it accordingly. They should not be construed as limiting the scope of protection of the utility model. All equivalent changes or modifications made in accordance with the spirit and essence of the utility model should be covered within the scope of protection of the utility model.

Claims

1. A semi-automatic wafer cleaning equipment front and back tank material transfer mechanism, the front and back tank material transfer mechanism comprising a rotating shaft, the rotating shaft being vertically arranged, a front and back tank being installed at the lower end of the rotating shaft; a drive device drives the rotating shaft to rotate, the front and back tank rotates with it, that is, the material is transferred, the drive device comprising a motor and a speed reducer; characterized in that, The motor and the speed reducer are shared by a support, a driving disc is installed on the support, the driving disc is located above the speed reducer, the driving disc shaft is connected with the input end of the speed reducer through a shaft coupling, the output end of the speed reducer is connected with the upper end of the rotating shaft, the motor is located on the side of the support, and the motor is directly connected with the hollow connecting driving disc through a rotating angle device.

2. The front and back tank material transfer mechanism of a semi-automatic wafer cleaning equipment according to claim 1, characterized in that, The front and rear grooves are fixed on a plastic mounting base, the lower end of the rotating shaft passes through the plastic mounting base and is locked through a nut, a plastic cover plate is installed at the bottom of the plastic mounting base, the plastic cover plate covers the lower end of the rotating shaft and the nut, a seal I is arranged between the plastic cover plate and the plastic mounting base, the rotating shaft is sleeved with a plastic shell, the lower end of the plastic shell is connected with the plastic mounting base, and the plastic shell and the plastic mounting base are provided with a seal II.

3. The front and back tank material transfer mechanism of a semi-automatic wafer cleaning equipment according to claim 2, characterized in that, A seal III is arranged between the nut and the plastic mounting base.

4. The front and back tank material transfer mechanism of a semi-automatic wafer cleaning equipment according to claim 2, characterized in that, The bottom of the plastic cover mounting base is provided with a sink, the lower end of the rotating shaft and the nut are located in the sink, and the plastic cover plate constitutes a seal of the sink.

5. The front and back tank material transfer mechanism of a semi-automatic wafer cleaning equipment according to claim 2, characterized in that, The lower end of the plastic shell is flange type and is connected with the mounting base through a flange.

6. The front and back tank material transfer mechanism of a semi-automatic wafer cleaning equipment according to claim 2, characterized in that, The contact surface of the lower end of the rotating shaft and the mounting base comprises a flat edge.

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