An automatic diode lead mounting device

Abstract

This utility model discloses an automatic diode lead wire shaping and mounting device, relating to the field of lead wire shaping technology. It includes a vibratory feeder and a mounting plate connected to the feeder's outlet. The mounting plate has a feeding assembly, a shaping assembly, and a detection assembly arranged sequentially along the material conveying direction. The shaping assembly includes a mounting base fixedly mounted on the mounting plate. The mounting base has a shaping station for accommodating the diode, defined by two opposing limiting blocks. The distance between the two limiting blocks is greater than the width of the diode body. This utility model, by setting up the shaping assembly and using two sets of limiting blocks, ensures that the diode is firmly fixed in a preset position, and that the two sets of limiting blocks will not damage the diode body. A driving cylinder drives a pressing plate downwards, bending the lead wire. Simultaneously, the rubber pressing plate has soft and elastic properties, preventing scratches or damage to the plating on the lead wire surface.

Description

Technical Field

[0001] This utility model relates to the field of lead shaping technology, specifically an automatic diode lead shaping mounting device. Background Technology

[0002] Diodes, as a fundamental and core electronic component, are widely used in the assembly of various printed circuit boards (PCBs) and PLC control modules. Before being installed onto the board, the two leads at their ports often need to be precisely bent and shaped according to the spacing of the holes on the board to meet the insertion requirements.

[0003] An existing patent (authorization announcement number: CN218385129U) discloses an automatic diode lead shaping and diode mounting device. The key technical points of the solution are: the device automatically shapes the diodes, straightening the bent diode leads into straight diode leads, saving labor costs. At the same time, the device automatically sorts the diode types to solve the problem of incorrect placement. The device automatically installs the diodes to fixed positions, and the device precisely controls the installation position to solve the problem of tilting.

[0004] However, the above technical solutions still have certain defects. In the above patent, it is impossible to effectively detect whether the bent diode leads are qualified or broken, and after the shaping is completed, the polarity position of the diode cannot be identified. Therefore, an automatic diode lead shaping installation device is proposed. Utility Model Content

[0005] The purpose of this invention is to provide an automatic diode lead installation device to solve the problems in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] An automatic diode lead wire shaping and mounting device includes a vibratory feeder and a mounting plate connected to the discharge port of the vibratory feeder. The mounting plate is sequentially provided with a feeding component, a shaping component and a detection component along the material conveying direction.

[0008] The shaping assembly includes a mounting base fixedly mounted on a mounting plate. The mounting base has a shaping station for accommodating the diode. The shaping station is defined by two opposing limiting blocks, and the distance between the two limiting blocks is greater than the width of the diode body. A fixing post is provided on one side of the mounting base. A driving cylinder is installed at the top of the fixing post. The output end of the driving cylinder faces the shaping station and is connected to a pressing plate.

[0009] A robotic arm for gripping and transferring diodes is provided on the side of the shaping component;

[0010] The end of the robotic arm's transfer path is equipped with a positioning platform for fixing the PLC board.

[0011] Based on the above technical solutions, this utility model also provides the following optional technical solutions:

[0012] As a further embodiment of this utility model: the feeding assembly includes a mobile platform fixedly mounted on the mounting plate, a first electric push rod, and a second electric push rod; the output end of the first electric push rod is connected to a first push block that can slide on the mobile platform along a first direction; the output end of the second electric push rod is connected to a second push block that can slide on the mobile platform along a second direction perpendicular to the first direction; the mobile platform is provided with a mutually communicating groove for the first push block and the second push block to slide.

[0013] As a further embodiment of this utility model: the detection component includes a mounting shell fixedly mounted on a mounting plate, the mounting shell having a sliding groove, the slider being slidably disposed within the sliding groove, the CCD camera being fixedly mounted on the slider, and the CCD camera being electrically connected to a processor for acquiring and analyzing the bending state of the diode leads.

[0014] As a further embodiment of this utility model: the positioning platform includes a first platform fixedly mounted on a mounting plate, a first screw driven to rotate by a first motor mounted on the first platform, and a second platform that can move along the X direction threadedly connected to the first screw; a second screw driven to rotate by a second motor mounted on the second platform, and an adsorption platform that can move along the Y direction threadedly connected to the second screw.

[0015] As a further improvement of this utility model: the surface of the adsorption platform is provided with vacuum adsorption holes, and a vacuum generator for generating negative pressure is installed inside or at the bottom of the adsorption platform.

[0016] As a further improvement of this invention, the end effector of the robotic arm is a pneumatic gripper or vacuum nozzle that can be replaced according to the diode size.

[0017] As a further improvement of this utility model: a strip-shaped groove is provided on the lower surface of the pressing plate, and the shape and size of the groove are adapted to the part of the diode lead to be bent.

[0018] As a further improvement of this utility model, the pressing plate is made of rubber material.

[0019] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0020] 1. This utility model sets up a shaping component, which ensures that the diode is firmly fixed in a preset position by two sets of limiting blocks, and the two sets of limiting blocks will not crush the diode body. The driving cylinder drives the pressing plate to press down, and the pressing plate moves downward to bend the lead wire. At the same time, the rubber pressing plate has the properties of softness and elasticity, and will not scratch or crush the coating on the surface of the lead wire.

[0021] 2. This utility model uses a detection component to capture a high-definition digital image of the bent part of the diode lead using a CCD camera. The captured image data is transmitted to the processor in real time via a cable. The processor identifies the diode body and lead edge in the image and compares the extracted features with preset qualification standards to determine whether the lead is broken and whether the bending angle is 90 degrees. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the feeding assembly of this utility model;

[0024] Figure 3 This is a schematic diagram of the structure of the shaping component of this utility model;

[0025] Figure 4 This is a schematic diagram of the detection component of this utility model;

[0026] Figure 5 This is a schematic diagram of the positioning platform of this utility model.

[0027] Figure label annotations: 1. Vibratory feeder; 2. Mounting plate; 3. Feeding assembly; 4. Shaping assembly; 5. Detection assembly; 6. Robotic arm; 7. Positioning platform;

[0028] 31. First electric actuator; 32. Second electric actuator; 33. First push block; 34. Second push block; 35. Moving platform;

[0029] 41. Mounting base; 42. Limiting block; 43. Fixing column; 44. Drive cylinder; 45. Pressing plate;

[0030] 51. Mounting housing; 52. Processor; 53. CCD camera; 54. Sliding groove; 55. Slider;

[0031] 71. First platform; 72. First motor; 73. First screw; 74. Second platform; 75. Second motor; 76. Second screw; 77. Adsorption platform. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0033] In one embodiment, such as Figures 1-5 As shown, an automatic diode lead wire shaping and mounting device includes a vibratory feeder 1 and a mounting plate 2 connected to the discharge port of the vibratory feeder 1. The mounting plate 2 is provided with a feeding component 3, a shaping component 4 and a detection component 5 in sequence along the material conveying direction. A robotic arm 6 for gripping and transferring the diode is provided on the side of the shaping component 4.

[0034] In this embodiment, the operator pours a large number of scattered diodes into the vibratory feeder 1. The vibratory feeder 1, through its internal spiral track and micro-vibration, utilizes centrifugal force and friction to make the diodes crawl orderly along the track. The diodes emerging from the vibratory feeder 1 are continuous, but processing requires handling them one by one. The feeding assembly 3 receives the diodes from the vibratory feeder 1 and intermittently and precisely moves them to the next station. The shaping assembly 4 bends the ends of the diodes, and the detection assembly 5 inspects the diodes to ensure a high pass rate. Simultaneously, the robotic arm 6 grips the diodes and moves them to the PLC board mounting station.

[0035] In one embodiment, such as Figure 2 As shown, the feeding assembly 3 includes a movable platform 35 fixedly mounted on the mounting plate 2, a first electric push rod 31, and a second electric push rod 32. The output end of the first electric push rod 31 is connected to a first push block 33 that can slide on the movable platform 35 along a first direction. The output end of the second electric push rod 32 is connected to a second push block 34 that can slide on the movable platform 35 along a second direction perpendicular to the first direction. The movable platform 35 is provided with interconnected sliding grooves for the first push block 33 and the second push block 34 to slide. The vibrating plate 1 feeds out diodes one by one in an orderly manner, which fall onto a fixed initial position on the movable platform 35. The first electric push rod 31 is activated, pushing the first push block 33 to move along the X-axis sliding groove, contacting the diode from the side, and pushing it to the X-coordinate of the target position. Then the first push block 33 is retracted. Next, the second electric push rod 32 is activated, pushing the second push block 34 to move along the Y-axis sliding groove, contacting the diode from the side, and pushing it to the Y-coordinate of the target position. Then the second pusher block 34 retracts. At this point, the diode has been corrected by the two pushers and moved precisely to the preset target point (X,Y). This target point is located directly below the pressing plate 45 of the shaping component 4, awaiting processing. The simple movement in two vertical directions avoids the accumulation of errors caused by complex motion chains, ensuring that each diode can be sent to the exact same designated position.

[0036] In one embodiment, such as Figure 3As shown, the shaping assembly 4 includes a mounting base 41 fixedly mounted on the mounting plate 2. The mounting base 41 has a shaping station for accommodating the diode. The shaping station is defined by two opposing limiting blocks 42, and the distance between the two limiting blocks 42 is greater than the width of the diode body. A fixing post 43 is provided on one side of the mounting base 41. A driving cylinder 44 is mounted on the top of the fixing post 43. The output end of the driving cylinder 44 faces the shaping station and is connected to a pressing plate 45. A strip groove is formed on the lower surface of the pressing plate 45. The shape and size of the groove are adapted to the part of the diode lead to be bent. The pressing plate 45 is made of rubber material. Two sets of limiting blocks 42 ensure that the diode is firmly fixed in a preset and precise position, and the two sets of limiting blocks 42 will not crush the diode body. The driving cylinder 44 drives the pressing plate 45 to press down. The pressing plate 45 moves downward, and the strip groove on its lower surface just covers the vertical lead of the diode. At the same time, the rubber pressing plate 45 has the properties of softness and elasticity, and will not scratch or crush the plating on the surface of the lead.

[0037] In one embodiment, such as Figure 4 As shown, the detection component 5 includes a mounting shell 51 fixedly mounted on the mounting plate 2. The mounting shell 51 has a sliding groove 54, and a slider 55 is slidably disposed within the sliding groove 54. A CCD camera 53 is fixedly mounted on the slider 55 and electrically connected to the processor 52 for acquiring and analyzing the bending state of the diode leads. When a diode completes bending at the shaping station, it will be positioned below the field of view of the CCD camera 53, which will capture a high-definition digital image of the bent portion of the diode lead. The camera has a built-in illumination system that provides a stable and uniform light source, ensuring clear images, distinct features, and no shadow interference. The captured image data is transmitted to the processor 52 in real time via cable. The processor identifies the diode body and lead edges in the image and precisely compares the extracted features with preset qualification standards to determine whether the lead is broken and whether the bending angle is 90 degrees.

[0038] In one embodiment, such as Figure 1 As shown, the end of the transfer path of the robotic arm 6 is provided with a positioning platform 7 for fixing the PLC board. The end effector of the robotic arm 6 is a pneumatic gripper or vacuum nozzle that can be replaced according to the size of the diode. The gripper fingers close under the drive of the cylinder to clamp the body of the diode from both sides. After reaching the target position, the gripper fingers open to release the diode, which facilitates the installation of the diode and the PLC board.

[0039] In one embodiment, such as Figure 5As shown, the positioning platform 7 includes a first platform 71 fixedly mounted on the mounting plate 2. A first screw 73, driven to rotate by a first motor 72, is mounted on the first platform 71. A second platform 74, movable in the X direction, is threadedly connected to the first screw 73. A second screw 76, driven to rotate by a second motor 75, is mounted on the second platform 74. An adsorption platform 77, movable in the Y direction, is threadedly connected to the second screw 76. The adsorption platform 77 has vacuum adsorption holes on its surface, and a vacuum generator for generating negative pressure is installed inside or at the bottom of the adsorption platform 77. The control system sends a pulse signal to the first motor 72, causing the motor to rotate and drive the first screw 73 to rotate. Since the screw and the second platform 74 are threadedly connected, the second platform 74, along with all its components, moves in the X direction until it reaches the target X coordinate. Then, the control system sends a pulse signal to the second motor 75, causing the motor to rotate and drive the second screw 76 to rotate. The rotation of the screw causes the adsorption platform 77 to move along the Y direction until it reaches the target Y coordinate. By simultaneously controlling two motors, the adsorption platform 77 can move to any point within its range of motion. After placing the PLC board on the surface of the adsorption platform 77, the vacuum generator is activated. It generates negative pressure inside the adsorption platform 77 by evacuating air. This negative pressure works through the vacuum adsorption holes on the surface, acting like countless small suction cups to firmly and evenly adsorb the PLC board onto the platform surface, preventing any slippage or displacement during movement. Vacuum adsorption eliminates the need for any mechanical clamping devices, avoiding physical scratches or crush damage to components and circuits on the PCB board that might be caused by clamps.

[0040] The above embodiment discloses an automatic diode lead wire shaping and mounting device, in which an operator pours a large number of scattered diodes into a vibratory feeder 1. The vibratory feeder 1 transports the diodes through micro-vibration and a specific internal track, and the diodes coming out of the vibratory feeder 1 are sent to the initial position of the feeding assembly 3. A first electric push rod 31 pushes a first push block 33 to precisely position the diode at the X coordinate; then a second electric push rod 32 pushes a second push block 34 to precisely position it at the Y coordinate. Finally, the diode is moved to a precise processing position directly below the shaping assembly 4, and the diode is sent into a shaping station fixed by two limit blocks 42. A drive cylinder 44 moves downward, pushing the rubber pressing plate 45 at its end to press down. The strip groove on the lower surface of the pressing plate 45 serves as a forming mold, precisely bending the diode lead wire into a preset shape. After bending, a CCD camera 53 immediately takes a picture of the diode lead wire and transmits the image to an image processor 52. The processor 52 analyzes the bending angle, shape, etc. through algorithms and compares them with standard values. It instantly makes a qualified / unqualified judgment and sends the result signal to the central controller. The central controller commands the robotic arm 6 to act according to the detection result. The robotic arm 6 moves the qualified diode it has picked up to the hole position and accurately inserts the diode's lead into the corresponding hole on the PCB board.

[0041] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An automatic shaping diode lead mounting device, comprising a vibrating disc (1) and a mounting plate (2) connected with the discharging port of the vibrating disc (1), characterized in that: The mounting plate (2) is provided with a feeding assembly (3), a shaping assembly (4) and a detection assembly (5) in sequence along the material conveying direction; The shaping component (4) includes a mounting base (41) fixedly mounted on the mounting plate (2). The mounting base (41) is provided with a shaping station for accommodating the diode. The shaping station is defined by two opposing limiting blocks (42). The distance between the two limiting blocks (42) is greater than the width of the diode body. A fixing post (43) is provided on one side of the mounting base (41). A driving cylinder (44) is mounted on the top of the fixing post (43). The output end of the driving cylinder (44) faces the shaping station and is connected to a pressing plate (45). The shaping component (4) is provided with a robotic arm (6) on the side for gripping and transferring the diode. The robotic arm (6) has a positioning platform (7) at the end of its transfer path for fixing the PLC board.

2. An automatic trim diode lead mounting apparatus according to claim 1, wherein The feeding assembly (3) includes a mobile platform (35) fixedly mounted on the mounting plate (2), a first electric push rod (31) and a second electric push rod (32); the output end of the first electric push rod (31) is connected to a first push block (33) that can slide on the mobile platform (35) along a first direction; the output end of the second electric push rod (32) is connected to a second push block (34) that can slide on the mobile platform (35) along a second direction perpendicular to the first direction; the mobile platform (35) is provided with interconnected sliding grooves for the first push block (33) and the second push block (34) to slide.

3. An automatic trim diode lead mounting apparatus according to claim 1, wherein The detection component (5) includes a mounting shell (51) fixedly mounted on the mounting plate (2), a sliding groove (54) provided on the mounting shell (51), a slider (55) slidably disposed in the sliding groove (54), a CCD camera (53) fixedly mounted on the slider (55), and the CCD camera (53) electrically connected to the processor (52) for acquiring and analyzing the bending state of the diode leads.

4. The automatic diode lead-shaping mounting device according to claim 1, characterized in that, The positioning platform (7) includes a first platform (71) fixedly installed on the mounting plate (2), a first screw (73) driven to rotate by a first motor (72) is installed on the first platform (71), and a second platform (74) movable in the X direction is threadedly connected to the first screw (73); a second screw (76) driven to rotate by a second motor (75) is installed on the second platform (74), and an adsorption platform (77) movable in the Y direction is threadedly connected to the second screw (76).

5. An automatic trim diode lead mounting apparatus according to claim 4, wherein The surface of the adsorption platform (77) is provided with vacuum adsorption holes, and a vacuum generator for generating negative pressure is installed inside or at the bottom of the adsorption platform (77).

6. An automatic trim diode lead mounting apparatus according to claim 1, wherein The end effector of the robotic arm (6) is a pneumatic gripper or vacuum nozzle that can be replaced according to the diode size.

7. An automatic trim diode lead mounting apparatus according to claim 1, wherein The lower surface of the pressing plate (45) is provided with a strip groove, the shape and size of which are adapted to the part of the diode lead to be bent.

8. An automatic trim diode lead mounting apparatus according to claim 1, wherein The pressing plate (45) is made of rubber material.

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