A manual wafer cutting rotary fixture

Abstract

This application relates to the field of semiconductor equipment technology and discloses a manual wafer dicing rotary fixture, comprising: a support base, an intermediate connector, a movable frustum, and a safety liner; the intermediate connector is disposed between the support base and the movable frustum, and connects the support base and the movable frustum respectively; the safety liner is disposed on the movable frustum and located at the end of the movable frustum facing away from the support base, for supporting the wafer; the intermediate connector includes a connecting shaft, a first bearing, and a second bearing, the inner rings of the first bearing and the second bearing are respectively connected to the two ends of the connecting shaft, and the outer ring of the first bearing is embedded in the end of the support base facing the movable frustum, and the outer ring of the second bearing is embedded in the end of the movable frustum facing the support base. This application improves wafer dicing efficiency and reliability.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically to a manual wafer cutting rotary fixture. Background Technology

[0002] Power semiconductor devices, as one of the core components in power electronic circuits, are widely used in motor drives, automotive electronics, power systems, and other fields. As application scenarios demand increasingly higher performance from power devices, their manufacturing processes are becoming more complex and refined. In the manufacturing process of power semiconductors, BGBM (Back Grinding Model) plays a crucial role. Before Metallization (BGBM) is a critical process that reduces the wafer thickness to approximately 100 μm or even less to lower the on-resistance of the device and enable it to withstand higher voltages. However, the thinned wafer is extremely fragile and easily damaged, and the wafer warps significantly under the stress of thinning. Therefore, a protective film is used to temporarily protect the wafer surface before thinning and to provide stable mechanical support for subsequent processes such as cutting and polishing. After the BGBM process, the protective film on the wafer surface needs to be circumferentially cut. Because the wafer warps after thinning, conventional automatic film cutting equipment is difficult to use. Without the assistance of special fixtures, manual film cutting is the only option, which is difficult to operate, the wafer is easily damaged, the film is prone to deviation during cutting, and the overall production efficiency is low. Utility Model Content

[0003] In view of this, this application provides a manual wafer cutting rotary fixture for improving wafer cutting efficiency and reliability.

[0004] In a first aspect, embodiments of this application disclose a manual wafer cutting rotary fixture, characterized in that it includes: a support base, an intermediate connector, a movable frustum, and a safety liner layer; The intermediate connector is located between the support base and the movable truncated cone, and connects the support base and the movable truncated cone respectively. The safety liner is located on the movable truncated cone and at one end of the movable truncated cone away from the support base, and is used to support the wafer to be cut. The intermediate connecting component includes a connecting shaft, a first bearing, and a second bearing. The inner rings of the first bearing and the second bearing are respectively connected to the two ends of the connecting shaft, and the outer ring of the first bearing is embedded in the end of the support base facing the movable truncated cone. The outer ring of the second bearing is embedded in the end of the movable truncated cone facing the support base, so that the support base and the movable truncated cone can rotate relative to each other.

[0005] In one possible example, the safety liner is a tempered glass layer.

[0006] In one possible example, the movable frustum has a circular groove at one end away from the support base, and the safety padding layer is disposed on the circular groove.

[0007] In one possible example, the safety liner protrudes from one end of the movable frustum away from the support base.

[0008] In one possible example, the diameter of the circular groove is larger than the diameter of the safety liner layer.

[0009] In one possible example, the end of the support base facing away from the movable truncated cone and the side wall of the movable truncated cone are both provided with anti-slip texture.

[0010] In one possible example, the support base has a first mounting groove corresponding to the first bearing, and the movable platform has a second mounting groove corresponding to the second bearing.

[0011] In one possible example, the intermediate connector further includes a plurality of alignment posts integrally connected to the end of the connecting shaft, and the bottom of the first assembly groove and / or the second assembly groove is provided with a plurality of alignment holes, the alignment posts being matched within the alignment holes.

[0012] In one possible example, the support base is configured as a frustum or a cylinder, and the support base, the intermediate connector, the movable frustum, and the safety padding layer are all located on the same axis.

[0013] In one possible example, the supporting base and the movable frustum are respectively an aluminum alloy base and an aluminum alloy frustum.

[0014] In summary, compared with the prior art, this application discloses a manual wafer cutting rotary fixture, including a support base, an intermediate connector, a movable truncated cone, and a safety liner. The intermediate connector is located between the support base and the movable truncated cone, and connects the support base and the movable truncated cone respectively. The safety liner is located on the movable truncated cone at the end opposite to the support base, and is used to support the wafer to be cut. The intermediate connector includes a connecting shaft, a first bearing, and a second bearing. The inner rings of the first bearing and the second bearing are respectively connected to the two ends of the connecting shaft, and the outer ring of the first bearing is embedded in the end of the support base facing the movable truncated cone. The outer ring of the second bearing is embedded in the end of the movable truncated cone facing the support base, so that the support base and the movable truncated cone can rotate relative to each other. That is, through the above configuration, the wafer cutting efficiency and reliability are improved. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a three-dimensional structural schematic diagram of the manual wafer cutting rotary fixture used in this application; Figure 2 This is an exploded view of the manual wafer cutting rotary fixture used in this application; Figure 3 This is a cross-sectional view of the first manual wafer cutting rotary fixture for wafers in this application. Figure 4 This is a cross-sectional view of the second type of manual wafer cutting rotary fixture used in this application. Detailed Implementation

[0017] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the claims.

[0018] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.

[0019] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0020] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustrative purposes and has no specific meaning in itself. Therefore, "module," "part," or "unit" may be used interchangeably.

[0021] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the order of description of the following embodiments is not intended to limit the priority of the embodiments.

[0023] Please refer to Figures 1 to 4 The manual wafer cutting rotary fixture of this application includes: a support base 1, an intermediate connector 2, a movable frustum 3, and a safety pad layer 4.

[0024] In the specific implementation process, the intermediate connector 2 is located between the support base 1 and the movable frustum 3, and connects the support base 1 and the movable frustum 3 respectively. The safety pad layer 4 is located on the movable frustum 3 and is located at the end of the movable frustum 3 away from the support base 1. The safety pad layer 4 is used to support the wafer to be cut.

[0025] Specifically, the intermediate connector 2 includes a connecting shaft 21, a first bearing 22, and a second bearing 23. The inner rings of the first bearing 22 and the second bearing 23 are respectively connected to the two ends of the connecting shaft 21, and the outer ring of the first bearing 22 is embedded in the end of the support base 1 facing the movable frustum 3. The outer ring of the second bearing 23 is embedded in the end of the movable frustum 3 facing the support base 1, so that the support base 1 and the movable frustum 3 can rotate relative to each other, which facilitates the adjustment of the wafer angle and position during manual wafer cutting operations.

[0026] Therefore, the manual wafer dicing rotary fixture of this application embodiment uses an intermediate connector 2 between the support base 1 and the movable disc 3. The intermediate connector 2 employs a connecting shaft 21, a first bearing 22, and a second bearing 23 to enable relative rotation between the support base 1 and the movable disc 3. A safety pad 4 is provided on the movable disc 3 to support the wafer. Combined with the rotational design of the bearings, the wafer angle and position can be smoothly adjusted during manual dicing, avoiding dicing deviations caused by wafer warping. The bearing rotational structure reduces the stress impact of direct wafer operation, improving wafer protection during dicing. Users only need to rotate the movable disc 3 to adjust the wafer angle, avoiding frequent wafer movement, improving operational efficiency and dicing alignment accuracy. The fixture achieves position adjustment through rotation, without relying on complex automated equipment, making it particularly suitable for wafer scenarios where warping is severe after thinning and automatic dicing machines cannot be used.

[0027] To enhance the protection of the wafer, the safety liner layer 4 is preferably a tempered glass layer, which has high mechanical strength, high hardness and good surface flatness, which helps to reduce the risk of wafer breakage during operation, facilitates the cutting of the film by the cutting tool and avoids cutting the platform.

[0028] In one possible implementation of this application, a circular groove 31 is provided at one end of the movable truncated cone 3 away from the support base 1, and a safety pad 4 is disposed on the circular groove 31 to stabilize the connection of the safety pad 4.

[0029] Furthermore, the safety pad 4 can be designed to protrude from the end of the movable frustum 3 away from the support base 1, thereby facilitating wafer bonding and positioning. To improve compatibility, the diameter of the circular groove 31 can be larger than the diameter of the safety pad 4, so as to realize the installation of safety pads 4 of different specifications, and also to facilitate the removal, cleaning and replacement of the safety pad 4 at any time.

[0030] In one example, the end of the support base 1 facing away from the movable truncated cone 3 and the side wall of the movable truncated cone 3 are provided with anti-slip textures, thereby increasing friction during manual operation, preventing slippage, and improving safety and operational stability.

[0031] In one possible implementation of this application, for ease of assembly and structural stability, a first assembly groove 11 is provided on the support base 1 at a position corresponding to the first bearing 22, and a second assembly groove 32 is provided on the movable frustum 3 at a position corresponding to the second bearing 23. Thus, the first bearing 22 is embedded in the first assembly groove 11, and the second bearing 23 is embedded in the second assembly groove 32. Thus, the intermediate connecting member 2 stably connects the support base 1 and the movable frustum 3 respectively. With the support base 1 as support, the movable frustum 3 can rotate relative to the support base 1 through the intermediate connecting member 2, thereby facilitating manual circumferential cutting of the wafer protective film and improving the cutting efficiency and reliability.

[0032] Further, refer to Figure 4 The intermediate connector 2 also includes several alignment posts 24 integrally connected to the end of the connecting shaft 21. The bottom of the first assembly groove 11 and / or the second assembly groove 32 is provided with several alignment holes 5. The alignment posts 24 are inserted into the alignment holes 5, thereby realizing precise positioning and stable connection between the fixture components.

[0033] Preferably, a set distance L is maintained between the support base 1 and the movable frustum 3 along the axial direction of the intermediate connector 2, and a set gap H is maintained between the first bearing 22 and the second bearing 23 on the connecting shaft 21. Then L > H. Thus, by ensuring that L is greater than H, the movable frustum 3 and the support base 1 will not interfere or rub during rotation due to insufficient bearing clearance, ensuring smooth rotation. Moreover, the existence of the distance L provides a buffer space for the bearing and the connecting shaft 21, making the force more uniform and reducing the wear and shortened life of the bearing caused by excessive compression. Therefore, the appropriate set distance L can maintain coaxiality and rotational accuracy during wafer rotation and improve the stability of the wafer cutting operation.

[0034] The alignment holes 5 can be arranged in a ring at the bottom of the first assembly groove 11 and / or the second assembly groove 32, and the alignment posts 24 can be arranged in a ring at the end of the connecting shaft 21.

[0035] Preferably, the support base 1 can be configured as a frustum or a cylinder, and the support base 1, the intermediate connector 2, the movable frustum 3 and the safety pad layer 4 are all located on the same axis to ensure the stability and concentricity of the fixture during rotation.

[0036] Furthermore, the support base 1 and the movable truncated cone 3 can be made of aluminum alloy, that is, the support base 1 and the movable truncated cone 3 are aluminum alloy base and aluminum alloy truncated cone respectively, to ensure structural strength and good lightweight and heat dissipation performance.

[0037] The present application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only for the purpose of helping to understand the core ideas of the present application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present application. Therefore, the content of this specification should not be construed as a limitation of the present application.

Claims

1. A manual film cutting rotary jig for a wafer, characterized by, include: Support base, intermediate connector, movable truncated cone and safety padding layer; The intermediate connector is located between the support base and the movable truncated cone, and connects the support base and the movable truncated cone respectively. The safety pad is located on the movable truncated cone and at one end of the movable truncated cone away from the support base, and is used to support the wafer to be cut. The intermediate connecting component includes a connecting shaft, a first bearing, and a second bearing. The inner rings of the first bearing and the second bearing are respectively connected to the two ends of the connecting shaft, and the outer ring of the first bearing is embedded in the end of the support base facing the movable truncated cone. The outer ring of the second bearing is embedded in the end of the movable truncated cone facing the support base, so that the support base and the movable truncated cone can rotate relative to each other.

2. The manual film dicing rotation jig for a wafer according to claim 1, wherein The safety liner is a tempered glass layer.

3. The manual film dicing rotation jig for a wafer according to claim 1, wherein The movable truncated cone has a circular groove at one end away from the support base, and the safety padding layer is disposed on the circular groove.

4. The manual film dicing rotation jig for a wafer according to claim 3, wherein The safety padding layer protrudes from the end of the movable truncated cone opposite the support base.

5. The manual film dicing rotation jig for a wafer according to claim 3, wherein The diameter of the circular groove is larger than the diameter of the safety liner layer.

6. The manual dicing die bonder for a wafer of claim 1, wherein, The end of the support base facing away from the movable truncated cone and the side wall of the movable truncated cone are both provided with anti-slip textures.

7. The manual dicing die bonder for a wafer of claim 1, wherein, The support base is provided with a first assembly groove corresponding to the first bearing, and the movable circular platform is provided with a second assembly groove corresponding to the second bearing.

8. The manual dicing die bonder for a wafer of claim 7, wherein, The intermediate connector also includes a plurality of alignment posts integrally connected to the end of the connecting shaft, and a plurality of alignment holes are provided at the bottom of the first assembly groove and / or the second assembly groove, wherein the alignment posts are matched within the alignment holes.

9. The manual dicing die bonder for a wafer of claim 1, wherein, The support base is configured as a frustum or a cylinder, and the support base, the intermediate connector, the movable frustum, and the safety padding layer are all located on the same axis.

10. The manual dicing die bonder for a wafer as claimed in any one of claims 1 to 9, wherein, The supporting base and the movable truncated cone are respectively an aluminum alloy base and an aluminum alloy truncated cone.

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