硅片承载装置和镀膜设备
By using a temperature-sensitive actuator clamping assembly of a silicon wafer carrier to clamp the side of the silicon wafer, the problem of insufficient back-side coverage area during transparent conductive layer deposition is solved, improving current collection and transmission efficiency, and enhancing the power generation efficiency of solar cells and the efficiency of the coating process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- RISEN ENERGY CO LTD
- Filing Date
- 2025-07-28
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, when depositing a transparent conductive layer on a silicon wafer, the area of the transparent conductive layer covering the back is reduced, which limits current collection and transmission in the masked area and affects the power generation efficiency of the solar cell.
A silicon wafer carrier device is used, and a temperature-sensitive actuator drives the clamping component to clamp the side of the silicon wafer, forming a closed-loop clamping surface. This avoids the formation of a mask area on the back side. The clamping surface of the clamping component continuously abuts against the side of the silicon wafer, ensuring that the transparent conductive layers on the front and back sides are separated, thereby increasing the coverage area of the transparent conductive layer on the back side.
It improves the efficiency of current collection and transmission, enhances the power generation efficiency of solar cells, and improves the efficiency and reliability of the coating process through the automatic clamping of the temperature-sensitive actuator.
Smart Images
Figure CN224521573U_ABST