一种晶圆片高温烘烤治具
By designing a high-temperature wafer baking fixture, utilizing the wafer placement area and air duct formed by the tray and side plates, the problems of poor ventilation and high weight of existing wafer baking kits are solved, achieving efficient and uniform wafer baking and safe transfer.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- KUNSHAN INBORE ELECTRONICS TECH
- Filing Date
- 2025-07-30
- Publication Date
- 2026-07-17
AI Technical Summary
Existing wafer baking trays have poor ventilation and are heavy, resulting in uneven baking and inconvenience in transferring wafers.
Design a high-temperature baking fixture for wafers, including a top plate, a bottom plate, support columns, and a tray. The tray has a first and a second baffle to form a wafer placement area. The support columns have partitions and arc-shaped notches. The side plates and the tray form a vertical air duct. The bottom plate has through holes and pads to ensure that the wafers are placed horizontally and that hot air circulates.
It improves baking quality and efficiency, reduces process time and energy costs, and ensures the stability and safety of wafers during the baking process.
Smart Images
Figure CN224521576U_ABST
Abstract
Claims
1. A wafer high-temperature baking jig comprising a top plate (1) and a bottom plate (2) facing each other, characterized in that, At least three symmetrically arranged support columns (3) are provided between the top plate (1) and the bottom plate (2). Several stacked trays (4) are provided on the support columns (3). The trays (4) have a pair of mirror-symmetrical first baffles (5) and a pair of mirror-symmetrical second baffles (6). Among them, the two first blocking edges (5) are arranged facing each other, the two second blocking edges (6) are arranged laterally and the intersection of the central axes of the two second blocking edges (6) is located between the two first blocking edges (5), the two second blocking edges (6) are located on the common side of the two first blocking edges (5) and the distance between the two second blocking edges (6) is smaller than the distance between the two first blocking edges (5), the two first blocking edges (5) and the two second blocking edges (6) constitute a wafer placement area that matches the wafer.
2. The wafer high temperature baking fixture of claim 1, wherein, The support column (3) is provided with a plurality of spaced arrays of spacers (7) along its length direction. The outer diameter of the spacers (7) is larger than the outer diameter of the support column (3). The edge of the tray (4) is provided with an arc-shaped notch (41). The arc-shaped notch (41) can be locked between adjacent spacers (7).
3. The wafer high temperature baking fixture of claim 2, wherein, The distance between two adjacent partitions (7) is greater than the thickness of the tray (4).
4. The wafer high temperature baking fixture of claim 1, wherein, The side wall of the tray (4) is recessed inward to form a notch (42), which is located on the other side of the two first guard edges (5).
5. The wafer high temperature baking fixture of claim 1, wherein, Both the first stop (5) and the second stop (6) are set as outward inclined surfaces.
6. The wafer high temperature baking fixture of claim 1, wherein, A pair of mirror-symmetrical first side plates (8) and a pair of mirror-symmetrical second side plates (9) are provided between the top plate (1) and the bottom plate (2); the two first side plates (8) are arranged face to face, and the two second side plates (9) are arranged laterally.
7. The wafer high temperature baking fixture of claim 6, wherein, A handle (10) is provided on the outer side of the first side plate (8).
8. The wafer high temperature baking fixture of claim 1 or 6, wherein, The base plate (2) has several through holes (21).
9. The wafer high temperature baking tool of claim 1 or 6, wherein, The bottom end of the base plate (2) is provided with several pads (11), which are distributed in a rotationally symmetrical manner.