A wafer chip turnover tray suitable for SMT mounting

Abstract

This utility model provides a wafer chip turnover tray suitable for SMT (Surface Mount Technology) assembly, relating to the field of electronic manufacturing technology. The wafer chip turnover tray includes a tray body and a metal carrier plate. The tray body has an external contour adapted to SMT assembly equipment. The metal carrier plate is fixed to the tray body. Multiple slots are formed on the metal carrier plate, each slot accommodating one wafer-level chip. A preset pick-up gap exists between the size of the slot and the size of the wafer-level chip. By combining the tray body adapted to SMT equipment with the metal carrier plate capable of precisely carrying chips, the previously segmented "SMT+COB" process is integrated into a single, efficient SMT automated process. This achieves a direct transition from waffle boxes to the SMT production line, effectively solving production bottlenecks and significantly improving production efficiency and product quality.

Description

Technical Field

[0001] This utility model relates to the field of electronic manufacturing technology, and in particular to a wafer chip turnover tray suitable for SMT mounting. Background Technology

[0002] In the electronics manufacturing industry, particularly in optical communications and the semiconductor sector, wafer-level chips, such as photodetectors (PDs) and lasers (LDs), present significant technical challenges due to their extremely small size (e.g., side length less than 0.5mm), thinness, and susceptibility to damage. Their packaging, transportation, and assembly on production lines have always been technically difficult. Currently, the industry commonly uses a packaging method known as the "waffle pack" to hold these chips. A waffle pack is typically a standard plastic box with a matrix of recesses, with one chip placed in each recess, providing effective protection for the chip during transportation and storage.

[0003] However, existing waffle box packaging methods have significant drawbacks, mainly in their compatibility with high-efficiency surface mount technology (SMT) production lines.

[0004] The dimensions, materials (usually ordinary plastic), and cavity precision of waffle boxes do not meet the standardized requirements of SMT placement machines (such as Fuji NXT and ASM) for feeders or trays. For example, they are inadequate in terms of high-temperature deformation, electrostatic discharge protection levels, and the precise positioning references required for machine vision recognition. This directly results in wafer-level chips packaged in waffle boxes not being able to be automatically mounted on the SMT production line. A segmented process flow must be adopted: First, other conventional components (such as resistors and capacitors) are mounted and reflow soldered on the circuit board on the SMT production line; then, the semi-finished board is transferred to a dedicated flip-chip or die-attach workstation, such as using COB (Chip on Board) equipment, where an operator removes the chips from the waffle box, and the COB equipment performs individual mounting.

[0005] The entire process was divided into two independent stages: "SMT placement" and "COB placement". This increased material transfer, equipment switching and waiting time, creating a production bottleneck and severely restricting overall output efficiency.

[0006] During the transfer between the two processes, the semi-finished substrate and the bare chip are repeatedly exposed to the environment, increasing the risk of contamination, oxidation, or electrostatic discharge (ESD). Simultaneously, the segmented operation makes it difficult to uniformly control process parameters, affecting the yield and reliability of the final product.

[0007] Therefore, a new type of turnover tool is needed to overcome the shortcomings of existing technologies. Utility Model Content

[0008] To overcome the problems existing in related technologies, the purpose of this utility model is to provide a wafer chip turnover tray suitable for SMT mounting. This wafer chip turnover tray adopts a composite structure that combines the tray body with a metal carrier sheet with precision cavity, making it compatible with standard SMT equipment. At the same time, it can provide stable support and precise positioning for tiny wafer chips, thus overcoming the problems of low production efficiency, cumbersome processes, and unstable product quality caused by the fact that wafer chips cannot be directly mounted in SMT automation due to waffle box packaging and the need for segmented processes in the prior art.

[0009] A wafer chip turnover tray suitable for SMT mounting, comprising:

[0010] The tray body has an external profile adapted for processing by SMT placement equipment;

[0011] A metal support plate is fixed to the tray body;

[0012] The metal carrier sheet has multiple cavities, each of which is used to accommodate a wafer-level chip. The size of the cavity and the size of the wafer-level chip it accommodates form a preset pickup gap.

[0013] Furthermore, the metal support sheet is made of steel.

[0014] Steel possesses high strength, high hardness, and excellent dimensional stability. Compared to softer metals like aluminum, steel carrier plates are less prone to scratches, bending, or deformation during long-term use and handling, ensuring consistent cavity accuracy and tray flatness. This high stability is crucial for SMT placement, ensuring all chips maintain a consistent Z-axis height and preventing misjudgments of nozzle height and placement failures caused by tray deformation. Therefore, using steel extends tray lifespan and further improves the yield rate of automated placement.

[0015] Furthermore, the tray body is made of bakelite material.

[0016] Wafer-level chips are extremely sensitive to static electricity; even a tiny electrostatic discharge can cause permanent damage. Bakelite (phenolic plastic) is an excellent insulating and antistatic material. Using it as the tray body effectively prevents static electricity from accumulating and conducting on the tray, thus providing reliable ESD protection for the chips throughout the transport and placement process. Furthermore, Bakelite has good heat resistance and dimensional stability, able to withstand temperature variations in the SMT production environment without warping, ensuring the flatness of the entire tray and the accuracy of the positioning reference, directly improving the final product yield and reliability.

[0017] Furthermore, the cavity is formed by a laser etching process.

[0018] Laser etching is a non-contact, high-precision micromachining technology. Compared to traditional CNC or stamping processes, laser spot diameter is small and energy is concentrated, enabling the creation of cavities with clear outlines, no burrs, smooth inner walls, and extremely small dimensional tolerances (micrometer level). This high precision is a prerequisite for the SMT equipment's vision system to accurately identify the cavity center and guide the nozzle for pickup. Precise cavity size and position directly translate into higher placement accuracy, avoiding problems such as pick-up failure or placement misalignment caused by excessive chip displacement within the cavity. This is a key technological guarantee for achieving highly reliable automated placement of sub-millimeter-sized chips.

[0019] Furthermore, the multiple cavities are arranged in a matrix.

[0020] All mainstream SMT pick-and-place machines use a row and column matrix coordinate system to define and locate component positions when handling tray feeding. Designing the slots in a matrix arrangement allows operators to easily and quickly program and teach the equipment, eliminating the need for complex coordinate conversions. Simultaneously, the matrix arrangement provides a high-density layout, accommodating as many chips as possible within a limited tray area, reducing the frequency of tray changes during production, thereby improving the equipment's effective operating time and overall production throughput.

[0021] Furthermore, all the cavity is divided into at least two carrier regions, each carrier region including multiple cavities arranged in a matrix, and the cavities in different carrier regions have different geometric dimensions to accommodate wafer-level chips of different shapes and sizes.

[0022] In actual optical module or electronic product assembly, a single circuit board often requires the mounting of multiple wafer-level chips of different specifications. If each chip required a dedicated tray, it would result in a large variety of trays, increasing management and storage costs, and necessitating the replacement of multiple feeders during production changeovers. This solution integrates multiple slot sizes onto a single tray, allowing the simultaneous placement and feeding of various chips required for a single product. This simplifies material preparation and production line setup, reduces equipment footprint, shortens product changeover time, and makes production organization more flexible and cost-effective.

[0023] Furthermore, the bearing area is arranged in a strip shape, parallel to and equidistant from the short side of the metal bearing sheet.

[0024] By arranging different carrier areas in parallel strips along their short sides, a highly structured partitioning is created. This layout allows operators to quickly and accurately place the corresponding chips based on clearly defined areas when manually transferring them from waffle cassettes to trays, significantly reducing the risk of mixing or misplacement. For machines, SMT equipment typically feeds trays along their long sides, while the placement head moves along the short side (width) to pick them up. Arranging different areas along the short side means that after picking up one area (one type of chip), the placement head only needs to make a small linear movement to move to the next area, optimizing the head's movement path and reducing idle travel time.

[0025] Furthermore, the bearing area is divided into three sections, and the planar dimensions of the material cavities in the three bearing areas are 0.45mm in length and 0.45mm in width, 0.52mm in length and 0.48mm in width, and 2.1mm in length and 0.45mm in width, respectively.

[0026] By integrating these three sizes of cavity into a single tray, effective adaptation to complex products that require mounting multiple chips is achieved.

[0027] Furthermore, the metal support piece is rectangular, and the tray body is provided with a mounting groove that matches the shape of the metal support piece, with clearances at the four corners of the mounting groove.

[0028] The purpose of the mounting groove is to provide a precise mounting reference for the metal support plate, ensuring its fixed position relative to the tray body. However, in machining, it is difficult to achieve perfectly sharp right angles for either the support plate or the inner angles of the mounting groove. Corner clearances (e.g., circular or square cuts) ensure that even with machined rounded edges or burrs, the four main locating edges of the support plate can completely and tightly fit against the sidewalls of the mounting groove. This achieves interference-free, high-precision alignment, guarantees the flatness of the support plate's mounting surface, and improves the assembly success rate and final positioning accuracy.

[0029] Furthermore, the tray body and the metal support plate are bonded together with an adhesive.

[0030] Compared to mechanical fastening methods such as screws, using adhesives for surface-to-surface bonding distributes the fixing force evenly across the entire bottom of the carrier sheet. This effectively avoids localized warping or stress deformation of the thin steel sheet caused by point-like mechanical forces, thus maximizing the overall flatness of the carrier sheet. The flatness of the carrier sheet directly affects the consistency of the Z-axis height of all chips, which is one of the key factors in ensuring SMT placement yield. Therefore, bonding is an ideal assembly method that achieves both firm fixation and maintains precise reference, while also being simple and cost-effective.

[0031] The beneficial effects of this utility model are as follows:

[0032] This invention provides a wafer chip turnover tray suitable for SMT (Surface Mount Technology) assembly. This SMT wafer chip turnover tray adopts a composite structure combining a tray body and a metal carrier plate. The tray body has an external contour adapted to SMT equipment. The entire turnover tray can be seamlessly identified and processed by standard conveyor tracks, lifting platforms, and positioning mechanisms on the SMT production line, solving the problem that existing waffle boxes cannot enter the SMT production line. The use of the metal carrier plate utilizes the high rigidity and high precision machining characteristics of metal materials. The cavities opened on the metal carrier plate can provide precise and stable (X,Y) coordinate positioning for wafer chips with sub-millimeter dimensions. The preset pick-up gap ensures that the nozzle of the SMT pick-and-place machine can smoothly descend to the chip surface and pick it up without colliding with the sidewalls of the cavity, greatly improving the success rate and reliability of pick-up. By combining the tray body with the metal carrier plate into a composite structure, the standardized docking capability of SMT equipment is combined with the precise positioning capability of micro chips. The original "SMT+COB" process, which had to be carried out in segments, is integrated into a single, efficient SMT automated process, which fundamentally solves the production bottleneck and significantly improves production efficiency and product quality. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of a wafer chip turnover tray suitable for SMT mounting provided in Embodiment 3 of this application;

[0034] Figure 2 This is a schematic diagram of the tray body provided in Embodiment 2 of this application.

[0035] Figure label:

[0036] 100. Pallet body; 110. Mounting groove; 111. Clearance; 200. Metal bearing plate; 210. Material cavity. Detailed Implementation

[0037] Preferred embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0038] To enable those skilled in the art to better understand the technical solution, purpose, and advantages of this utility model, some of the proprietary terms involved in this solution will be explained below.

[0039] Surface Mount Technology (SMT) is a mainstream electronic assembly technology that uses specialized automated equipment (i.e., pick-and-place machines) to directly mount electronic components onto the surface pads of a printed circuit board (PCB), and then solders them in place using processes such as reflow soldering. It is a core technology for achieving large-scale, high-density, and automated production of electronic products.

[0040] Wafer-level chip (WLS): Also known as a bare die, it refers to a semiconductor chip that is used directly after wafer fabrication without undergoing traditional dicing and packaging processes. Its typical characteristics are extremely small size (usually on the order of millimeters or sub-millimeters), thinness, and no external packaging protection, making it extremely sensitive to static electricity, contamination, and physical damage.

[0041] Waffle Pack: A standard packaging container used in the industry for carrying and transporting bare chips. It is typically a plastic box with a matrix of recessed slots, named for its waffle-like appearance. Each slot holds one chip, primarily providing physical protection, but its materials and precision do not meet the direct loading requirements of SMT equipment.

[0042] Chip-on-board (COB) refers to the process of directly attaching bare chips to a circuit board using conductive or non-conductive adhesive, and then achieving electrical connections through techniques such as wire bonding. This process typically requires specialized equipment and is separate from mainstream SMT production lines, representing the inefficient process that this invention aims to replace.

[0043] JEDEC Tray: A tray that conforms to the standardized dimensions, positioning features, and material specifications established by JEDEC (Judges-Edge Solid State Technology Association, a global standards-setting body for the microelectronics industry). SMT equipment is designed to automatically identify and handle JEDEC-compliant trays, making them a universally applicable automated feeding carrier in the industry. The tray body of this invention is designed in accordance with such standards.

[0044] Pick-up gap: In this invention, it specifically refers to the spatial distance between the inner wall of the cavity and the side of the chip it contains. This gap exists to ensure that, even with slight positioning deviations, the edge of the nozzle of the SMT pick-and-place machine will not collide or scratch the side wall of the cavity when it descends to pick up the chip. This provides the necessary process window for successful pick-up and is crucial for achieving high-success-rate automated placement.

[0045] Mark points, also known as reference points or visual recognition points, are high-contrast, standardized geometric shapes pre-defined on trays or circuit boards. By identifying the positions of these mark points, the vision system of SMT equipment can accurately calculate the actual position and rotation angle of the entire tray in the equipment coordinate system, thereby achieving precise compensation and calibration of all material slot positions.

[0046] Electrostatic discharge (ESD) refers to the transfer of charge caused by objects with different electrostatic potentials approaching or coming into direct contact. For sensitive components such as wafer-level chips, even a weak ESD can be enough to break down their delicate internal circuits, causing permanent and irreversible damage. Therefore, ESD protection is crucial throughout the entire process.

[0047] Example 1

[0048] This embodiment provides a wafer chip turnover tray suitable for SMT mounting, which includes,

[0049] The turnover pallet in this embodiment includes a pallet body 100 and a metal support plate 200 fixed on the pallet body 100.

[0050] The tray body 100 serves as the base and frame of the entire tray. Its overall dimensions, such as a length of 323mm and a width of 138mm, are designed to be fully compatible with standard SMT placement equipment (such as Fuji NXT series pick-and-place machines) tray feeders or worktables. Its edges feature positioning slots and markers conforming to JEDEC or other industry standards, enabling the SMT equipment's transport tracks, positioning pins, and vision systems to accurately grasp, transport, and precisely position it. This ensures that the entire turnover tray can seamlessly integrate into existing SMT automated production processes, just like a standard JEDEC Tray.

[0051] The metal carrier plate 200 is a thin sheet component that is securely fixed to the pre-set mounting area on the tray body 100. The core function of the metal carrier plate 200 is to carry the chip, and multiple cavities 210 are formed on the metal carrier plate 200 through precision machining.

[0052] Each cavity 210 is used to accommodate an individual wafer-level chip. Crucially, the planar dimensions of the cavity 210 are designed to have a preset pick-up gap with the size of the wafer-level chip it accommodates. For example, for a square wafer chip with dimensions of 0.4mm x 0.4mm, the corresponding cavity 210 planar dimensions can be designed to be 0.45mm x 0.45mm. Thus, after the chip is placed in the cavity 210, a uniform gap of approximately 0.025mm is formed between its perimeter and the inner wall of the cavity 210. This pick-up gap ensures that when the SMT pick-up nozzle descends to pick up the chip, even with minor alignment errors, the edge of the nozzle will not collide or scratch the sidewall of the cavity 210, thereby improving the success rate and stability of pick-up. This is a prerequisite for achieving high-speed, high-reliability automated placement of microchips.

[0053] By combining the tray body 100 and the metal carrier sheet 200, this embodiment successfully integrates the macroscopic functions of adapting to SMT equipment with the microscopic functions of precisely carrying micro-chips, and can directly replace the waffle box, integrating the wafer chip mounting process into the mainstream SMT production line.

[0054] The wafer chip turnover tray for SMT assembly provided in this embodiment, by designing the outer contour of the tray body 100 as a standard part recognizable by SMT equipment, enables the entire tray to be seamlessly grasped, transported, and positioned by automated equipment. By creating precision cavity 210s with preset pick-up gaps on the high-rigidity metal carrier sheet 200, the fragile chip, with dimensions only at the sub-millimeter level, not only achieves stable (X,Y) coordinate positioning but also ensures that the SMT nozzle can perform interference-free, high-success-rate (Z-axis) pick-up within the gaps. This solves the pain point of existing waffle boxes requiring segmented "SMT+COB" production due to incompatibility with SMT equipment, ultimately integrating wafer chip assembly into a single, continuous, and efficient SMT automated process, significantly improving production efficiency and shortening product manufacturing cycles.

[0055] Example 2

[0056] This embodiment provides another wafer chip turnover tray suitable for SMT mounting. Based on embodiment 1, it provides more detailed material selection, manufacturing process and assembly structure of the turnover tray, providing a preferred and high-performance implementation.

[0057] In this embodiment, the tray body 100 is preferably made of bakelite material (phenolic laminate) through CNC machining. Bakelite was chosen based on its excellent comprehensive performance: bakelite has excellent anti-static (ESD) properties, which can effectively protect the wafer-level chips, which are extremely sensitive to static electricity, from damage during turnover and mounting; bakelite has good heat resistance and dimensional stability, and is not prone to warping or deformation under temperature fluctuations in the SMT production line (especially in the area near the reflow oven), ensuring the flatness of the entire tray.

[0058] The metal support plate 200 is preferably made of steel (e.g., stainless steel sheet). The high strength and hardness of steel make it resistant to scratches and deformation during repeated use, ensuring the durability of the precision of the cavity 210.

[0059] The cavity 210 is formed on the steel metal carrier sheet 200 through laser etching. Laser etching can achieve micron-level processing precision, creating tiny holes with clear outlines, no burrs, and smooth inner walls, which is difficult to achieve with traditional stamping or CNC milling. This high-precision cavity 210 is the technical guarantee for the SMT equipment vision system to accurately identify the center of the cavity 210, thereby achieving high-precision placement.

[0060] In terms of assembly structure, the pallet body 100 is provided with a mounting groove 110 that matches the shape of the rectangular metal support piece 200. To achieve high-precision alignment, the four inner corners of the mounting groove 110 are provided with clearances 111 (for example, rounded or chamfered with a radius of R). The clearances 111 solve the problem of sharp corner interference in machining, ensuring that the four main straight edges of the metal support piece 200 can fit completely and tightly against the sidewall of the mounting groove 110, thereby achieving interference-free high-precision positioning.

[0061] The tray body 100 and the metal support plate 200 are fixed together by adhesive bonding. High-strength industrial adhesive is used for surface-to-surface bonding. Compared with point connections such as screws, the fixing stress can be evenly distributed, effectively preventing the thin steel plate from warping due to local stress. This maximizes the overall flatness of the metal support plate 200 after installation, which is crucial for ensuring the Z-axis height consistency of all chips on the tray.

[0062] The wafer chip turnover tray for SMT mounting provided in this embodiment uses bakelite as the tray body 100. Its excellent anti-static and heat-resistant stability protects the chips from electrostatic damage and ensures the tray does not warp under temperature changes, directly improving the yield and reliability of the final product. By using steel sheets and laser etching to manufacture the cavity 210, the high strength of the steel and the high precision of the laser ensure that the cavity 210 is dimensionally accurate, burr-free, and durable, providing a prerequisite for accurate identification by the SMT vision system and high-success-rate pick-up by the nozzle. The assembly scheme using mounting slots 110, four corner clearances 111, and adhesive bonding achieves stress-free, high-precision planar fixation of the carrier chip, ensuring high consistency of the Z-axis height of all chips on the tray and avoiding mounting failures.

[0063] Example 3

[0064] This embodiment provides another wafer chip turnover tray suitable for SMT mounting. Based on embodiments 1 and 2, it provides a cavity 210 layout scheme to improve production flexibility and efficiency.

[0065] See appendix Figure 1 In this embodiment, the multiple cavities 210 on the metal carrier sheet 200 are not of a single specification, but are divided into at least two carrier regions. The accompanying drawings specifically show three carrier regions. Within each carrier region, cavities 210 of the same specification are arranged in a matrix, but the cavities 210 in different carrier regions have different geometric dimensions to accommodate wafer-level chips of different shapes and sizes.

[0066] This multi-purpose tray design is highly practical. For example, when assembling a complex optical module, it may be necessary to use chips of three different sizes: A, B, and C. Using the tray in this embodiment, these three types of chips can be placed on a single tray for simultaneous supply. The SMT placement machine, according to its program settings, can sequentially or as needed pick up the corresponding chips from different areas for placement.

[0067] Specifically, as shown in the figure, the three carrier areas are arranged in a strip-like form, parallel to each other along the short side (i.e., the width direction) of the metal carrier sheet 200. This layout is clear and intuitive, facilitating accurate placement of materials by the operator when manually transferring chips and effectively preventing material mixing. It also optimizes the movement path of the SMT placement head.

[0068] In this embodiment, the planar dimensions of the material cavities 210 in these three bearing areas are specifically set as follows:

[0069] First carrier area (corresponding to area A in the attached figure): The cavity 210 has a size of 0.45mm long x 0.45mm wide and is used to accommodate, for example, a square chip of 0.4mm x 0.4mm.

[0070] The second carrier area (corresponding to area B in the attached diagram): the cavity 210 has dimensions of 0.52mm in length x 0.48mm in width, and is used to accommodate chips of, for example, 0.45mm x 0.42mm.

[0071] The third carrier area (corresponding to area C in the attached diagram): the cavity 210 has dimensions of 2.1mm in length and 0.45mm in width, and is used to accommodate, for example, a strip-shaped chip of 2.0mm x 0.35mm.

[0072] Of course, the number of carrier areas (which can be two or more) and the specific dimensions of the cavity 210 in each area can be customized according to the type and size of the chips to be mounted in actual production, and are not limited to the specific values ​​given in this embodiment. For example, only two carrier areas can be set, one for square PD chips and the other for elongated LD chips.

[0073] The wafer chip turnover tray for SMT assembly provided in this embodiment divides a metal carrier sheet 200 of a tray into multiple carrier areas 210 of different sizes, allowing multiple wafer chips of different specifications required for assembling a single circuit board to be simultaneously placed and supplied on a single tray. This solves the problem of managing multiple trays and occupying multiple equipment feeding stations when producing complex products in the traditional one-tray-one-material mode. It simplifies the warehousing and production line material preparation process; reduces setup time and equipment space occupation during product changeovers. At the same time, arranging different areas in a strip along the short side makes it less likely to be confused when manually placing materials, and also optimizes the pick-up path of the SMT mounting head, reducing idle travel time. It achieves a high degree of intensive and economical production organization, especially for complex products such as optical modules that require the mounting of multiple bare chips, with particularly significant effects in improving production efficiency and reducing operating costs.

[0074] Example 4

[0075] This embodiment provides another wafer chip turnover tray suitable for SMT mounting. Based on the above embodiment, it provides a turnover tray with a more flexible and modular structure.

[0076] The metal carrier sheet 200 can be one or more. In this embodiment, the metal carrier sheet 200 consists of multiple independent modular carrier sheets. Each modular carrier sheet corresponds to an independent carrier area, meaning that the cavities 210 on each modular carrier sheet are of the same specification and are used to carry the same type of wafer-level chip. The tray body 100 is correspondingly provided with multiple independent mounting slots 110 to accommodate these modular carrier sheets respectively.

[0077] In this embodiment, the modular support piece is detachably mounted on the pallet body 100. This detachable mounting method can be achieved through various structures:

[0078] A preferred implementation is to use mechanical fasteners for connection. For example, several threaded holes are machined into the bottom of each mounting slot 110 of the pallet body 100, and corresponding countersunk holes are formed on each modular support piece. Each modular support piece can be independently and detachably secured to the pallet body 100 using fastening screws (e.g., M1.5 or M2 miniature countersunk screws). When it is necessary to replace or remove a support area, simply unscrew the corresponding screw.

[0079] Another feasible approach is to use magnetic adsorption for fixation. For example, several small, strong magnets (such as neodymium iron boron magnets) can be pre-embedded in the bottom of the mounting groove 110 of the tray body 100, using magnetic force to firmly attach the modular steel support plate to the predetermined position. This method allows for faster tool-free assembly and disassembly.

[0080] This detachable modular design allows production lines to freely combine different modular carrier plates, much like building blocks, to meet the needs of different products. For example, if product A requires chips 1 and 2, then the corresponding carrier plates 1 and 2 are installed; if product B requires chips 1 and 3, then carrier plate 2 can be replaced with 3. This allows a single pallet body 100 to serve multiple different products, maximizing asset utilization. When a material cavity 210 in a carrier area wears out or is accidentally damaged due to long-term use, the entire pallet does not need to be scrapped; only the damaged small modular carrier plate needs to be replaced, greatly reducing maintenance costs and spare parts inventory. For the introduction of new products, if a new chip model is required, there is no need to redesign and manufacture a completely new large pallet. Only a small modular carrier plate corresponding to the size of the new chip needs to be developed and integrated into the existing pallet body 100, significantly shortening the development cycle and reducing costs.

[0081] The wafer chip turnover tray for SMT mounting provided in this embodiment uses multiple independent, removable, and replaceable modular carrier pieces. This allows users to freely combine the required chip carrier modules on the same tray body 100 according to the bill of materials of different products. When a cavity 210 in a carrier area is worn or damaged, only the damaged modular carrier piece needs to be replaced, without scrapping the entire tray, thereby greatly reducing maintenance costs and spare parts inventory. When introducing new products that require new chip models, only a new small carrier module needs to be designed and manufactured, without redesigning and verifying the entire large tray, effectively accelerating the time to market.

[0082] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this application. Any specific values ​​in all examples shown and discussed herein should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0083] Furthermore, it should be noted that the use of terms such as "first" and "second" is merely for ease of distinction, and unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application.

[0084] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer chip turnover tray suitable for SMT mounting, characterized in that, include: The tray body (100) has an external profile adapted for processing by SMT placement equipment; A metal support plate (200) is fixed to the tray body (100); The metal carrier sheet (200) has a plurality of cavity (210) formed thereon, each cavity (210) is used to accommodate a wafer-level chip, and the size of the cavity (210) and the size of the wafer-level chip are arranged to form a preset pickup gap.

2. The wafer chip turnover tray suitable for SMT mounting according to claim 1, characterized in that: The metal support plate (200) is made of steel.

3. The wafer chip turnover tray suitable for SMT mounting according to claim 1, characterized in that: The tray body (100) is made of bakelite material.

4. The wafer chip turnover tray suitable for SMT mounting according to claim 1, characterized in that: The cavity (210) is formed by laser etching.

5. The wafer chip turnover tray suitable for SMT mounting according to claim 1, characterized in that: The multiple material cavities (210) are arranged in a matrix.

6. The wafer chip turnover tray suitable for SMT mounting according to claim 1, characterized in that: All of the cavity (210) are divided into at least two carrier regions, each carrier region including a plurality of cavities (210) arranged in a matrix, and the cavities (210) in different carrier regions have different geometric dimensions to accommodate wafer-level chips of different shapes and sizes respectively.

7. The wafer chip turnover tray suitable for SMT mounting according to claim 6, characterized in that: The bearing area is arranged in a strip shape parallel to and equidistant from the short side of the metal bearing sheet (200).

8. The wafer chip turnover tray suitable for SMT mounting according to claim 7, characterized in that: The bearing area is divided into three sections, and the planar dimensions of the material cavity (210) in the three bearing areas are 0.45 mm in length and 0.45 mm in width, 0.52 mm in length and 0.48 mm in width, and 2.1 mm in length and 0.45 mm in width, respectively.

9. The wafer chip turnover tray suitable for SMT mounting according to claim 1, characterized in that: The metal support plate (200) is rectangular, and the tray body (100) is provided with a mounting groove (110) that matches the shape of the metal support plate (200). The four corners of the mounting groove (110) are provided with clearance (111).

10. The wafer chip turnover tray suitable for SMT mounting according to claim 1, characterized in that: The tray body (100) and the metal support plate (200) are bonded together with an adhesive.

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