一种具有快速上料功能的晶圆检测设备
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU AXTEK PHOTOELECTRIC TECH CO LTD
- Filing Date
- 2025-06-26
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional wafer inspection relies on cumbersome manual loading, resulting in low inspection efficiency, insufficient positioning accuracy, and a high risk of errors.
A wafer inspection device with rapid feeding function was designed. The feeding mechanism and the rotating mechanism work together to realize automated rapid feeding and precise positioning of wafers. Combined with the unloading component and the reset component, it realizes flexible unloading and lossless transmission, avoiding surface scratches or particulate contamination that may be caused by traditional mechanical clamping or air blowing unloading.
It significantly improves testing efficiency, reduces the risk of contamination caused by human contact, ensures the stability and consistency of wafers, avoids the error and contamination problems of traditional methods, and is suitable for high-volume wafer testing.
Smart Images
Figure CN224521587U_ABST