一种晶片翻转单元
By designing a wafer flipping unit with flipping components and a flipping axis, the problem of damage during wafer flipping was solved, achieving a low-damage flipping effect and improving the wafer production yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG QIUSHI SEMICON EQUIP CO LTD
- Filing Date
- 2025-06-25
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, the adsorption method during wafer flipping can easily damage the wafer, affecting the yield rate of the production line.
Design a wafer flipping unit that uses a flipping component and a flipping shaft structure. By switching the receiving position of the flipping component in different states, the wafer can be flipped 180 degrees, avoiding direct adsorption operation.
This enables low-damage wafer flipping, improving wafer production yield.
Smart Images
Figure CN224521588U_ABST
Abstract
Claims
1. A wafer flip unit, comprising: include: First transmission mechanism (31); Second transmission mechanism (33); as well as A flipping mechanism (32) is located between the first conveying mechanism (31) and the second conveying mechanism (33), and the flipping mechanism (32) includes: A flipper (321) is provided with a receiving position (3211) with an opening (32111), which can accommodate a wafer (S) through the opening (32111); the receiving position (3211) has two states. In the first state, the opening (32111) faces the first conveying mechanism (31); in the second state, the opening (32111) faces the second conveying mechanism (33) in a flipped posture. A flip shaft (322) is connected to the flip member (321), and the receiving position (3211) is switched between a first state and a second state via the flip shaft (322).
2. The wafer flip unit of claim 1, wherein, The flipping component (321) is provided with a plurality of receiving positions (3211), and the plurality of receiving positions (3211) are radially distributed around the flipping shaft (322) as the center.
3. The wafer flip unit of claim 1, wherein, Two or more flip members (321) are provided along the axial direction of the flip axis (322), and the flip members (321) are arranged in two or more flip groups. The receiving positions (3211) in each flip group are aligned along the axial direction of the flip members (321) so as to carry a wafer (S) through two or more flip members (321).
4. The wafer flip unit of claim 3, wherein, One or more alternating regions (323) are left between the flipping members (321) constituting the flipping group, or an alternating region (323) is left on the outer side of a group of the flipping groups along the axial direction of the flipping shaft (322); the output end of the first transmission mechanism (31) and the input end of the second transmission mechanism (33) extend into the alternating region (323).
5. The wafer flip unit of claim 4, wherein, The structure of at least one of the first transmission mechanism (31) and the second transmission mechanism (33) includes: The conveying assembly (311) includes a conveying base (3111), a conveying wheel (3112) located on the conveying base (3111), and a conveyor belt (3113) located on the conveying wheel (3112); A transmission shaft (312) is connected to and linked with the transmission wheel (3112); The transfer components (311) are arranged in two or more sets side by side to carry a wafer (S) through the two or more sets of transfer components (311), and the two or more sets of transfer components (311) extend into one or more alternating regions (323) of a flip group.
6. The wafer flip unit of claim 3, wherein, The flipping component (321) is a sheet or plate, and the width of the receiving position (3211) along the axial direction of the flipping shaft (322) is between 2mm and 40mm.
7. The wafer flip unit of claim 1, wherein The two opposite inner surfaces of the accommodating site (3211) carrying the wafer (S) are called accommodating surfaces (3212), and the surfaces of the accommodating surfaces (3212) are concave-convex or textured.
8. The wafer flip unit of claim 7, wherein, The surface of the accommodating surface (3212) is provided with a groove (3213), or the side of the surface of the accommodating surface (3212) is provided with a chamfered portion (3214).
9. The wafer flip unit of claim 1, wherein, The turnover unit (300) further comprises: A turnover water spraying mechanism (34) faces the turnover part (321).
10. The wafer flip unit of claim 1, wherein, The turnover unit (300) further comprises: A position sensor (35) is arranged relative to the first conveying mechanism (31) and / or the second conveying mechanism (33), and the detection area of the position sensor (35) is located on the conveying path of the wafer (S); Wherein, the sensor output part (351) and the sensor receiving part of the position sensor (35) are diagonally arranged.