A multi-category, multi-level Clip assembly system

Abstract

A multi-category, multi-level clip assembly system belongs to the field of chip processing technology. Multiple execution stations are arranged on the surface of a worktable, each containing a pick-up unit and a punching unit. The system is characterized by: a conveying unit for transporting chip frames on the worktable surface; multiple execution stations arranged along the direction of the conveying unit; a feeding unit mounted above the conveying unit; and a strip-shaped jumper wire frame wound in a coil within the feeding unit. The feeding unit is located above two adjacent execution stations and respectively connects to the punching units in those two execution stations. In this technical solution, the jumper wire frame with jumpers is wound in a coil within the feeding unit. Furthermore, each feeding unit corresponds to two execution stations, allowing for the arrangement of multiple jumpers at a single station, thus improving work efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, specifically to a multi-category, multi-level Clip assembly system. Background Technology

[0002] In existing chip manufacturing processes, replacing wire bonding with clip packaging can improve production efficiency, reduce manufacturing costs, and solve problems such as cold solder joints and lead neck breakage that occur during wire bonding. Taking the Chinese invention patent application number 202111674902.X, filed on December 31, 2021, entitled "Fully Automatic Transistor CLIP Assembly Line and Method," as an example, the general process in the clip packaging process is as follows: dispensing adhesive onto the chip frame; placing and attaching the chip to the chip frame; dispensing adhesive onto the chip; installing jumpers, where a punching mechanism punches the jumper frame to obtain jumpers, and then a picking mechanism transfers the jumpers to the glued chip. For example, the technical solutions described in Chinese invention patent application number 202411462375.X, application date October 18, 2024, entitled "Copper sheet bonding equipment and assembly method for semiconductor device punching and feeding", and the technical solutions described in Chinese utility model patent application number 202021382135.6, application date July 14, 2020, entitled "Automatic chip skipping installation machine"), and then sent to subsequent processes for further processing.

[0003] However, existing technologies, including the aforementioned solutions, generally suffer from the following drawbacks: In chip jumper layouts, multiple jumpers are typically arranged, and different jumpers are even layered vertically. In existing technologies, the driving device usually only has one set of pickup devices. This approach requires multiple pickup stations for jumper placement and pickup, or multiple round trips using a single pickup device to complete the process. This not only reduces work efficiency and increases the overall chip processing length, but also reduces reliability when the pickup device handles various jumpers. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a multi-category, multi-level Clip assembly system that winds a jumper frame with jumpers in a coil in the feeding unit, and has two execution stations for each feeding unit, so that multiple jumper arrangements can be performed at one station, thereby improving work efficiency.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows: the multi-category, multi-level Clip assembly system includes a workbench, on which multiple execution stations are arranged, and in each execution station are a picking unit and a punching unit. The feature is that: a conveying unit for conveying chip frames is arranged on the surface of the workbench, multiple execution stations are arranged along the arrangement direction of the conveying unit, a feeding unit is erected above the conveying unit, and a strip jumper frame is wound in a coil in the feeding unit. The feeding unit is located above two adjacent execution stations and is respectively connected to the punching unit in the two execution stations.

[0006] Preferably, the feeding unit includes a feeding fixing frame mounted above the conveying unit, and multiple feeding trays are respectively arranged on the sides of the feeding fixing frame before and after the chip frame moves. A jumper frame is wound on each feeding tray. A punching unit is respectively arranged below the feeding fixing frame, corresponding to the feeding trays and receiving the jumper frames.

[0007] Preferably, a pickup unit is provided on the lower side of the front and rear sides of the feeding fixture. The pickup unit is located outside the multiple punching units on the same side. The pickup unit is connected to the multiple punching units on the same side and together they form an execution station.

[0008] Preferably, the conveying unit is a linearly arranged conveying guide rail that passes through all the execution stations. Multiple carrier mechanisms for placing chip frames are provided on the conveying guide rail. The carrier mechanisms reciprocate independently on the surface of the conveying guide rail, and two adjacent carrier mechanisms are connected one after the other. During the reciprocating operation, the carrier mechanism passes through at least one execution station.

[0009] Preferably, the docking point between two adjacent carrier mechanisms is a temporary storage station, and a temporary storage mechanism for grasping and transferring the chip frame is provided at the temporary storage station.

[0010] Preferably, two feeding trays are respectively provided on the front and rear sides of the feeding fixture, and a punching unit is arranged below the two feeding trays on the same side. The picking unit that docks with the two punching units on the same side includes a picking translation module. Two sets of picking components that work alternately are arranged on the picking translation module. Each picking component is provided with an adsorption mechanism that docks with the corresponding punching unit.

[0011] Preferably, the pickup assembly includes a base for connecting to the moving part of the translation module, a vertically arranged lifting module is provided on the end face of the base, an adsorption mechanism is rotatably mounted on the moving part of the lifting module, and a rotary drive mechanism is provided on the surface of the lifting module for connecting to the adsorption mechanism and driving the adsorption mechanism to rotate.

[0012] Preferably, the punching unit includes a punching main frame, and on the surface of the punching main frame along the moving direction of the jumper frame, there are sequentially arranged a drive frame for driving the jumper frame to move and a punching frame for punching the jumper frame to obtain jumpers; a solder box and a solder tin box are also sequentially arranged at the output end of the punching frame.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] In the multi-category, multi-level Clip assembly system described in this application, the jumper frame with jumpers is wound in a coil in the feeding unit. At the same time, there are two execution stations for each feeding unit, and multiple jumper arrangements can be performed at one station, which improves work efficiency.

[0015] In the conveying unit of this application, multiple bearing mechanisms are arranged on the surface of the conveying guide rail. During the reciprocating operation of adjacent bearing mechanisms, the chip is processed and docked for transfer at different execution stations, thereby improving the chip processing efficiency.

[0016] By setting a temporary storage mechanism at the docking point of the two carrier mechanisms, the chip frame can be transferred, thereby further realizing the automatic completion of chip frame transfer and processing.

[0017] Multiple feed trays are set at each execution station, so different jumpers can be obtained at one station. When the chip moves, multiple different jumpers can be arranged at this station, which shortens the length of the entire production line, improves work efficiency, and is more conducive to the arrangement of multiple or / and multiple layers of jumpers for the chip.

[0018] In the punching unit, an encoder is set up. When the encoder rotates, it continuously triggers the photoelectric sensor. By counting the photoelectric sensor, the rotation angle of the encoder is detected, thereby detecting the rotation angle of the two drive gears. Furthermore, the movement distance of the frame on the drive frame surface is detected.

[0019] In the pickup unit, when the rotation detection switch is triggered twice consecutively at the side opening of the rotation detection disk, it indicates that the rotation detection disk has rotated more than 360°, thus avoiding excessive rotation of the adsorption mechanism in the same direction, which could damage the pipeline used to transport the gas. Attached Figure Description

[0020] Figure 1 Isometric drawing of a multi-category, multi-level Clip assembly system.

[0021] Figure 2 for Figure 1 The diagram is shown after omitting the outer cover.

[0022] Figure 3 This view omits the picking unit in the execution station of a multi-category, multi-level Clip assembly system.

[0023] Figure 4 for Figure 3 The front view.

[0024] Figure 5 for Figure 4 Sectional view along the AA direction.

[0025] Figure 6 Left view of the unit for a multi-category, multi-level Clip assembly system.

[0026] Figure 7 This is an isometric view of the pickup component of the pickup unit.

[0027] Figure 8 Left view of the adsorption mechanism of the pickup unit.

[0028] Figure 9 for Figure 8 Sectional view along the BB direction.

[0029] Figure 10 Isometric drawing of the punching unit for a multi-category, multi-level Clip assembly system.

[0030] Figure 11 Left view of the punching unit of a multi-category, multi-level Clip assembly system.

[0031] Figure 12 for Figure 11 Sectional view along the CC direction.

[0032] Figure 13 for Figure 2 The view after the feeding unit, picking unit, and punching unit are omitted.

[0033] Figure 14 This is a front view of the output mechanism in the conveying mechanism of a multi-category, multi-level Clip assembly system.

[0034] Figure 15 for Figure 14 The right view.

[0035] Figure 16 Isometric drawing of the load-bearing mechanism in the conveyor unit of a multi-category, multi-level Clip assembly system.

[0036] Figure 17 Isometric drawing of the temporary storage mechanism in the conveying unit of a multi-category, multi-level Clip assembly system.

[0037] The components include: 1. Workbench; 2. Outer casing; 3. Feeding unit; 4. Conveying unit; 5. Pick-up unit; 6. Punching unit; 7. Feeding tray; 8. Mounting frame; 9. Crossbeam; 10. Jumper frame; 11. Liner tray; 12. Liner; 13. Solder box; 14. Feeding motor; 15. Pick-up translation module; 16. Pick-up assembly; 17. Pick-up support column; 18. Translation limit switch; 19. Valve box; 20. Pick-up back plate; 21. Rotary motor; 22. Coupling; 23. Rotation detection disc; 24. Pick-up lifting frame. 25. Adsorption mechanism; 26. Solder box; 27. Rotating mounting bracket; 28. Rotation detection switch; 29. ​​Lifting and resetting spring; 30. Translation detection plate; 31. Lifting detection plate; 32. Lifting limit switch; 33. Pickup base; 34. Pickup lifting module; 35. Rotating frame; 36. Adsorption lifting cylinder; 37. Air nozzle; 38. Linear bearing; 39. Lifting block; 40. Guide shaft; 41. Adsorption spring; 42. Adsorption block; 43. Suction nozzle; 44. Telescopic air pipe; 45. Collection box; 46. Punching hole 47. Punching frame; 48. Drive top plate; 49. Punching transmission mechanism; 50. Guide frame; 51. Guide plate; 52. Punching bottom plate; 53. Drive gear plate; 54. Punching cylinder; 55. Punching top plate; 56. Punching encoder; 57. Photoelectric sensor; 58. Punching drive motor; 59. Punching plate; 60. Drive bottom plate; 61. Output mechanism; 62. Temporary storage mechanism; 63. Bearing mechanism; 64. Conveyor rail; 65. Output transmission mechanism; 66. Output frame; 67. Output lifting plate; 68. Output 69. Gripper cylinder; 70. Output ranging sensor; 71. Output gripper; 72. Output column; 73. Output crossbeam; 74. Output linear module; 75. Lifting drive motor; 76. Clamping slot; 77. Support base plate; 78. Support top plate; 79. Proximity sensor; 80. Receiving slot; 81. Clamping plate; 82. Clamping cylinder; 83. Temporary storage column; 84. Temporary storage crossbeam; 85. Temporary storage lifting cylinder; 86. Temporary storage lifting frame; 87. Temporary storage ranging sensor; 88. Temporary storage gripper cylinder; 89. Temporary storage gripper. Detailed Implementation

[0038] Figures 1-17 This is the preferred embodiment of the present invention, which is described below in conjunction with the appendix. Figures 1-17 The present invention will be further described below.

[0039] like Figures 1-2As shown, a multi-category, multi-level clip assembly system includes a workbench 1, which is a cabinet. The surface of the workbench 1 is a working surface, and a conveying unit 4 is arranged on the surface of the working surface along its length. Multiple feeding units 3 are mounted directly above the conveying units 4. Two punching units 6 are respectively arranged on both sides of the lower part of the feeding units 3. A picking unit 5 is also arranged on the outer side of each of the two punching units 6 on each side of the feeding units 3. Each picking unit 5 and its corresponding two punching units 6 form an execution station. Both the picking unit 5 and the punching units 6 are arranged on the working surface. In this multi-category, multi-level clip assembly system, there are two feeding units 3. Therefore, the picking unit 5 and the punching units 6 arranged below the two feeding units 3 form four execution stations. The conveying unit 4 passes through the middle of all the execution stations.

[0040] like Figures 3-5 As shown, the feeding unit 3 includes a crossbeam 9, with both ends of the crossbeam 9 fixed to the inner side of the outer cover 2. A mounting bracket 8 is provided at both ends of the lower part of the crossbeam 9. A feeding tray 7 is also provided on the front and rear sides of each mounting bracket 8. The two feeding trays 7 on the same side of the mounting bracket 8 correspond to the two punching units 6 in the execution station below the feeding unit 3.

[0041] The feeding tray 7 is disc-shaped, and each feeding tray 7 is rotatably mounted on the corresponding end face of its corresponding mounting bracket 8 via a pivot at its center. A jumper frame 10 with jumpers is wound in a continuous strip in the slot in the middle of the feeding tray 7. Also wound in the feeding tray 7 at the same time as the jumper frame 10 is a liner 12 of the same length and width as the frame, which serves as a separator.

[0042] A feeding motor 14, corresponding to a feeding tray 7, is provided at the bottom inner side of the mounting frame 8. A liner tray 11, corresponding to a feeding motor 14, is provided at the bottom outer surface of the mounting frame 8. The liner tray 11 is also rotatably mounted on the surface of the mounting frame 8 via its shaft and is located below the side of the corresponding feeding tray 7. The shaft of the liner tray 11 passes through the mounting frame 8 and extends to the inner side of the mounting frame 8, located below the corresponding feeding motor 14. The motor shaft of the feeding motor 14 is connected to the shaft of the liner tray 11 located below it through a known transmission method (such as a synchronous belt mechanism), thereby driving the liner tray 11 to rotate.

[0043] After the jumper frame 10 and the liner 12 attached to it are released from the feed tray 7, the liner 12 is wound around the liner reel 11, and the jumper frame 10 extends downward into the corresponding punching unit 6. As the liner reel 11 rotates, the liner 12 is continuously wound around its surface and collected. During the continuous winding and collection of the liner 12, the jumper frame 10 is also continuously fed into the execution station below it and enters the corresponding punching unit 6.

[0044] like Figure 6 As shown, the pickup unit 5 includes two pickup pillars 17 spaced apart, and a support beam horizontally arranged on the upper surface of the pickup pillars 17 at both ends. A pickup translation module 15 is arranged on the surface of the support beam. A pickup component 16 is arranged on each of the two sliders in the pickup translation module 15. The two pickup components 16 correspond to a punching unit 6 respectively. After the jumper frame 10 released from the feed tray 7 enters the corresponding punching unit 6 and is punched to obtain jumpers, the jumpers are arranged onto the surface of the chip by the pickup components 16 on the corresponding side.

[0045] Combination Figure 7 The pickup assembly 16 includes a pickup base 33, and the slider in the pickup translation module 15 is fixed to the bottom surface of the pickup base 33. A valve box 19 is provided on the surface of the pickup base 33, and a solenoid valve assembly is provided inside the valve box 19. An external air source is connected to the solenoid valve assembly inside the valve box 19 through a pipeline (not shown in the figure) and connected to the pneumatic components of the pickup assembly 16.

[0046] A pickup backplate 20 is vertically fixed to the front end of the pickup base 33. A pickup lifting module 34 is vertically arranged on the surface of the pickup backplate 20. A pickup lifting frame 24 is provided on the front side of the pickup lifting module 34, and the slider of the pickup lifting module 34 is installed on the back of the pickup lifting frame 24. A lifting detection plate 31 is provided on one side of the top of the pickup lifting frame 24, and a lifting limit switch 32 is provided on the upper part of the same side of the pickup backplate 20. A translation detection plate 30 is provided on one side of the bottom of the pickup backplate 20, and two translation limit switches 18 are provided on the front end face of the main frame, each corresponding to one of the two pickup components 16. Both the lifting limit switch 32 and the translation limit switch 18 are implemented using commercially available U-shaped photoelectric sensors. When the lifting detection plate 31 rises to the lifting limit switch 32, it will trigger the lifting limit switch 32 and stop the lifting module 34. Similarly, after the translation detection plate 30 triggers the corresponding translation limit switch 18, the translation module 15 will stop the corresponding pickup component 16 from running.

[0047] Two lifting return springs 29 are installed on the front end face inside the pickup lifting frame 24. A support plate is horizontally set on the top of the pickup back plate 20. The front end of the support plate extends forward to the top of the pickup lifting frame 24. The other end of the two lifting return springs 29 extends upward and is hooked to the support plate.

[0048] A rotating mounting frame 27 is installed on the front surface of the pickup lifting frame 24. A rotary motor 21 is installed on the top of the rotating mounting frame 27. The motor shaft of the rotary motor 21 passes downward through the top surface of the rotating mounting frame 27 and enters the interior of the rotating mounting frame 27. The rotary motor 21 is connected to a rotating shaft inside the rotating mounting frame 27 through a coupling 22. The rotating shaft passes downward through the rotating mounting frame 27 and the pickup lifting frame 24 and is connected to the adsorption mechanism 25 located at the lower part of the pickup lifting frame 24, and drives the adsorption mechanism 25 to rotate.

[0049] A rotation detection disk 23 is horizontally fixed at the bottom of the coupling 22. An opening is provided on one side of the rotation detection disk 23, and a rotation detection switch 28 is provided on one side of the rotating mounting bracket 27. The rotation detection disk 23 is rotatably located within the rotation detection switch 28. The rotation detection switch 28 also uses a U-shaped photoelectric sensor. When the rotation detection switch 28 is triggered twice consecutively at the opening on the side of the rotation detection disk 23, it indicates that the rotation detection disk 23 has rotated more than 360°, preventing excessive rotation of the adsorption mechanism 25 in the same direction, which could damage the pipeline used to transport gas.

[0050] like Figures 8-9 As shown, the adsorption mechanism 25 includes a rotating frame 35, which is a rectangular frame. Two lifting blocks 39 are arranged side by side inside the rotating frame 35. An adsorption lifting cylinder 36 is fixed on the surface of each of the two lifting blocks 39. The adsorption lifting cylinder 36 is a commercially available needle cylinder. The air passage of the adsorption lifting cylinder 36 is connected to the valve box 19 mentioned above.

[0051] The body of the adsorption lifting cylinder 36 is fixed to the surface of the corresponding lifting block 39, and the piston rod of the adsorption lifting cylinder 36 passes through the lifting block 39 and is fixed to the surface of the base plate of the rotating frame 35. When the piston rod of the adsorption lifting cylinder 36 moves, since the bottom of the piston rod is fixed, it drives its body and the lifting block 39 to rise and fall within the rotating frame 35.

[0052] A guide shaft 40 is provided on both the front and rear sides of the adsorption lifting cylinder 36. One end of the guide shaft 40 is fixed to the base plate of the rotating frame 35, and the other end passes vertically through the lifting block 39 and is movably connected to the lifting block 39. A lifting shaft is also provided at both ends of each lifting block 39. The top of the lifting shaft is fixed to the bottom of the lifting block 39, and the lifting shaft extends downward through the base plate of the rotating frame 35 to the lower part of the rotating frame 35. At the lower part of the rotating frame 35, two adsorption blocks 42 are provided, each corresponding to a lifting block 39. The adsorption blocks 42 are fixed to the lifting shafts extending from the corresponding lifting blocks 39. Therefore, when the lifting blocks 39 are lifted and lowered within the rotating frame 35 by the adsorption lifting cylinder 36, the adsorption blocks 42 are simultaneously lifted and lowered at the bottom of the pickup lifting frame 24. An adsorption spring 41 is also fitted outside each lifting shaft, which assists in resetting after lifting. A linear bearing 38 is also provided at the lifting connection of the lifting shaft.

[0053] A through hole is provided in the middle of the base plate of the rotating frame 35. Two telescopic air pipes 44 are arranged in the through hole. The upper part of the two telescopic air pipes 44 passes upward through the corresponding lifting block 39 and is connected to the air nozzle 37 provided on the surface of the lifting block 39. The air nozzle 37 is connected to the valve box 19 mentioned above through a pipeline. The two telescopic air pipes 44 extend through the through hole in the middle of the base plate of the rotating frame 35 to the bottom of the rotating frame 35 and pass through the corresponding adsorption block 42. A suction nozzle 43 is provided at the bottom of the adsorption block 42, and the bottom of the telescopic air pipe 44 is connected to the suction nozzle 43 at the bottom of the corresponding adsorption block 42.

[0054] like Figures 10-12 As shown, the punching unit 6 includes a main frame composed of a punching top plate 55 and a punching bottom plate 52 arranged at intervals. On the surface of the main frame, a guide frame 50, a drive frame, and a punching frame 47 are arranged sequentially along the moving direction of the jumper frame 10. A guide plate 51 is also provided at the end of the guide frame 50. After the jumper frame 10 is released from the feed tray 7, it is guided to the surface of the guide frame 50 by the action of the guide plate 51, and punched on the surface of the punching frame 47 by the drive frame to obtain the jumper wire.

[0055] The drive frame includes a drive base plate 60 that is fixed to the surface of the top plate. A vertical plate is fixed to each end of the drive base plate 60, and a drive top plate 48 is horizontally arranged on the surface of the two vertical plates. The jumper frame 10 passes over the surface of the drive top plate 48. Two drive gear discs 53 are arranged between the drive top plate 48 and the drive base plate 60, and the two drive gear discs 53 are coaxially fixed. Two locking plates are also spaced apart on the surface of the drive top plate 48, forming locking grooves between the two locking plates and the surface of the drive top plate 48. The two drive gear discs 53 are located below the two locking plates. When the jumper frame 10 passes over the surface of the drive top plate 48, it passes between the locking plates and the drive top plate 48, and the teeth at the edges of the two drive gear discs 53 engage in the tooth holes at the edges of the jumper frame 10, causing the jumper frame 10 to move.

[0056] A punching drive motor 58 is arranged on the lower surface of the punching top plate 55. The motor shaft of the punching drive motor 58 extends to the outside of the main frame and is connected to the punching transmission mechanism 49. The punching transmission mechanism 49 extends obliquely upward to the drive frame and is connected to the rotating shaft of the two drive gear disks 53. The punching drive motor 58 and the punching transmission mechanism 49 drive the two drive gear disks 53 to rotate. The punching transmission mechanism 49 is also implemented by a known transmission method (such as a synchronous belt mechanism).

[0057] Inside the drive frame, a punching code disk 56 is also provided, which is coaxially fixed and rotates synchronously with the two drive gear disks 53. A notch is provided at the edge of the punching code disk 56. A punching photoelectric sensor 57 is provided on one side of the punching code disk 56. The punching code disk 56 is clamped between the transmitting end and the receiving end of the punching photoelectric sensor 57. When the punching code disk 56 rotates, it continuously triggers the punching photoelectric sensor 57. By counting the punching photoelectric sensor 57, the rotation angle of the punching code disk 56 is detected, thereby realizing the detection of the rotation angle of the two drive gear disks 53. Furthermore, the movement distance of the jumper frame 10 on the surface of the drive frame is detected.

[0058] A punching cylinder 54 is also provided on the surface of the punching base plate 52. The piston rod of the punching cylinder 54 faces upward directly towards the punching frame 47. A set of punching holes 46 are spaced apart on the surface of the punching frame 47. The punching holes 46 penetrate downward through the punching frame 47. A punching plate 59 is provided in each of the two punching holes 46. The top of the two punching plates 59 is a punch. The bottom of the two punching plates 59 is connected to the top of the piston rod of the punching cylinder 54. When the piston rod of the punching cylinder 54 moves, it drives the two punching plates 59 to move back and forth in the vertical direction. Through the punch at the top, the jumper frame 10 located on the surface of the punching frame 47 is punched, thereby obtaining the jumper wire.

[0059] A collection box 45 is also provided at the output end of the punching frame 47. The waste material obtained from punching gradually falls into the collection box 45 for collection as the jumper frame 10 moves. On the side of the collection box 45, along the moving direction of the jumper frame 10, a solder box 13 and a solder cassette 26 are also arranged in sequence. The solder box 13 and the solder cassette 26 are fixed by the punching top plate 55. Before the pickup unit 5 transfers the jumper to the chip surface through the nozzle 43, it first dips the jumper into the solder box 13 to absorb flux, then dips it into the solder box 26 to absorb solder, and finally places the jumper in the corresponding position on the chip surface. Therefore, the step of applying adhesive before the jumper is placed on the chip is omitted. In addition, heating devices are provided at the solder box 13 and the solder cassette 26 to ensure that the flux in the solder box 13 and the solder in the solder box 26 are in a molten state.

[0060] The solder in the solder tray 26 is not solid solder at room temperature, but solder paste. Both the solder paste and flux are paste-like at room temperature. After the nozzle 43 picks up the jumper, it sequentially dips in flux and solder paste, leaving paste-like solder paste and flux adhering to the solder joints of the jumper. After the nozzle 43 places the jumper onto the bonding area of ​​the chip surface, the jumper itself "sticks" to the chip surface due to the adhesiveness of the paste. Because the jumper itself is relatively small, it will also adhere to the bonding area of ​​the chip surface during subsequent movement.

[0061] The purpose of providing heating devices at solder box 13 and solder box 26 is to make it easier for flux and solder paste to maintain a paste-like form at room temperature, and the heating devices at solder box 13 and solder box 26 can be omitted.

[0062] like Figure 13 As shown, the conveying unit 4 includes a conveying guide rail 64, which is implemented using a linear module known in the art. The surface of the worktable 1 is the working surface, and the conveying guide rail 64 is arranged along the length of the working surface. The input end of the conveying guide rail 64 extends to the outside of the working surface for docking with the previous process to transfer the chip frame with the chip mounted to its surface. An output mechanism 61 is provided at the output end of the conveying guide rail 64 for transferring the chip frame that has completed the corresponding process on the working surface to the subsequent process.

[0063] Multiple sliders, numbered 1 to N, are arranged on the surface of the transport guide rail 64. Each slider also has a support mechanism 63 for placing the chip frame. Two adjacent sliders reciprocate on the transport guide rail 64 surface, exchanging chip frames. A temporary storage station is located between two adjacent execution stations, with a temporary storage mechanism 62 at this station. The temporary storage station is the junction of two adjacent sliders, where the temporary storage mechanism 62 assists the support mechanism 63 on the surfaces of the two sliders to transfer the chip frame.

[0064] Specifically, the arrangement of sliders 1 to N is as follows: slider 1 is arranged between the input end of the conveyor rail 64 and the first temporary storage station, and only travels back and forth between the input end of the conveyor rail 64 and the first temporary storage station; slider 2 is arranged between the first temporary storage station and the second temporary storage station, and only travels back and forth between the first temporary storage station and the second temporary storage station; ...; slider N is arranged between the last temporary storage station and the output mechanism 61, and only travels back and forth between the last temporary storage station and the output mechanism 61.

[0065] The carrier mechanism 63, which travels between the input end of the transport guide rail 64 and the first temporary storage station, receives the chip frame from the previous process at the input end of the transport guide rail 64, moves to the first execution station for processing, and after completing the processing at the first execution station, continues to move to the first temporary storage station. At the first temporary storage station, the temporary storage mechanism 62 removes the chip frame from the surface of the carrier mechanism 63. After unloading, the carrier mechanism 63 moves in the opposite direction to the input end of the transport guide rail 64, ready to receive the next chip frame. The carrier mechanism 63, which travels between the first and second temporary storage stations, moves to the first temporary storage station after unloading the chip frame. The temporary storage mechanism 62 at the first temporary storage station transfers the temporarily stored chip frame to its surface and sends it to the second execution station for processing. After processing, it is sent to the second temporary storage station, and so on, until the chip frame, after processing at the final execution station, is sent to the output mechanism 61 for output to the subsequent process.

[0066] like Figures 14-15 As shown, the output mechanism 61 includes two output columns 71 arranged vertically side-by-side on the working surface. An output beam 72 is horizontally arranged at the top of the output columns 71, perpendicular to the arrangement direction of the conveying guide rail 64. An output linear module 73 is also arranged on the surface of the output beam 72. An output frame 66 is fixed to the slider on the surface of the output linear module 73. A horizontal plate on the back of the output frame 66 is fixed to the surface of the slider of the output linear module 73. A vertical plate is vertically fixed to the end face of the output frame 66 facing the conveying unit 4, located outside the output linear module 73.

[0067] A guide rail is vertically fixed to the surface of the vertical plate of the output frame 66, and an output lifting plate 67 is clamped onto the surface of the guide rail. An output transmission mechanism 65 is also provided on one side of the guide rail on the vertical plate surface, and a lifting drive motor 74 is provided on the surface of the horizontal plate. The motor shaft of the lifting drive motor 74 passes through the vertical plate and is connected to the output transmission mechanism 65. The output transmission mechanism 65 is implemented using a synchronous belt mechanism, including two vertically arranged pulleys and a synchronous belt installed between the two pulleys. The motor shaft of the lifting drive motor 74 passes through the vertical plate and is coaxially fixed to one of the pulleys (the drive pulley). The side of the output lifting plate 67 is fixed to the synchronous belt. Therefore, when the lifting drive motor 74 rotates, it can drive the output lifting plate 67 to rise and fall vertically under the guidance of the guide rail through the output transmission mechanism 65.

[0068] An output gripper cylinder 68 is fixed at the bottom of the output lifting plate 67. A set of output grippers 70 is fixed at the output end of the output gripper cylinder 68. An output ranging sensor 69 is set at each of the two output grippers 70.

[0069] like Figure 17 As shown, the temporary storage mechanism 62 includes a temporary storage column 82 vertically mounted on the working surface. A temporary storage beam 83 is horizontally mounted on the top of the temporary storage column 82, perpendicular to the arrangement direction of the conveying guide rail 64. A temporary storage lifting cylinder 84 is fixed to the end of the temporary storage beam 83, with its piston rod pointing vertically downwards. A temporary storage lifting frame 85 is fixed to the side of the piston rod of the temporary storage lifting cylinder 84, and a temporary storage gripper cylinder 87 is fixed to the bottom of the temporary storage lifting frame 85, facing downwards towards the conveying guide rail 64. A set of temporary storage grippers 88 is fixed relative to the output end of the temporary storage gripper cylinder 87, and a temporary storage distance sensor 86 is mounted at each of the two temporary storage grippers 88.

[0070] like Figure 16 As shown, the supporting mechanism 63 includes a vertically spaced supporting base plate 76 and a supporting top plate 77. The supporting base plate 76 is used to fix the corresponding slider, and the supporting base plate 76 and the supporting top plate 77 are connected as one unit by multiple connecting posts at the four corners. A receiving groove 79 for accommodating the chip frame is formed on the surface of the supporting top plate 77. Clamping grooves 75 are further formed outward at opposite ends of the receiving groove 79, and the bottom of the clamping grooves 75 is lower than the bottom of the receiving groove 79. A groove is also formed in the middle of the receiving groove 79, and a proximity sensor 78 is arranged in the groove, with the proximity sensor 78 entirely located within the groove.

[0071] An opening communicating with the receiving groove 79 is provided at one corner of the supporting top plate 77. A clamping plate 80 is provided at this opening, and a clamping cylinder 81 is fixed on the bottom surface of the supporting top plate 77. The piston rod of the clamping cylinder 81 is connected to the clamping plate 80. When the proximity sensor 78 detects that the chip frame has been placed in, the clamping cylinder 81 is activated, driving the clamping plate 80 to move towards one side of the receiving groove 79, thereby fixing the chip frame in the receiving groove 79.

[0072] The specific working process and working principle are as follows:

[0073] The carrier mechanism 63, which travels between the input end of the conveyor rail 64 and the first temporary storage station, receives the chip frame sent by the previous process at the input end of the conveyor rail 64. Driven by its bottom slider, the carrier mechanism 63 moves to the first execution station for corresponding processing.

[0074] After the chip frame enters the execution station, it is located between the two punching units 6. The jumper frame 10, released from the feed tray 7 into the punching unit 6, is guided to the surface of the guide frame 50 by the guide plate 51, and then enters the drive frame. Inside the drive frame, the punching drive motor 58 rotates, driving the gear plate 53 to rotate while simultaneously moving the jumper frame 10 into the punching frame 47. The punching cylinder 54 continuously punches the jumper frame 10 to obtain the jumper wire.

[0075] Then, the pickup translation module 15 in pickup unit 5 controls the corresponding pickup component 16 to move to directly above the jumper. The pickup lifting module 34 drives the pickup lifting frame 24 to move downward, causing the adsorption mechanism 25 to descend directly above the jumper. High-pressure gas is output to the adsorption lifting cylinder 36 through the solenoid valve group in the valve box 19. The adsorption lifting cylinder 36 drives the adsorption block 42 to move downward and contact the jumper. After contact, the jumper is adsorbed by the suction nozzle 43. The adsorption lifting cylinder 36 moves again, causing the jumper to rise. Before transferring the jumper to the chip surface through the suction nozzle 43, the jumper is first dipped in the solder box 13 to absorb flux, then dipped in the solder box 26 to absorb solder. Finally, the adsorbed jumper is transferred to the chip surface, and then the jumper is transferred to the corresponding bonding position of the chip through the adsorption lifting cylinder 36. Then the suction force at the suction nozzle 43 is released, and the jumper is released. Currently, the pickup component 16 moves away under the combined action of the pickup translation module 15 and the pickup lifting module 34, while another pickup component 16 transfers another jumper wire to the chip surface according to the above actions. Then the chip continues to be transferred to the next process. During the above-mentioned pickup and release of the jumper wire, when rotation is required, the rotary motor 21 drives the adsorption mechanism 25 to rotate, so that the suction nozzle 43 can be aligned with the arrangement direction of the jumper wire.

[0076] After the chip frame completes the above actions at the current execution station, it continues to move to the first temporary storage station. At this time, the temporary storage lifting cylinder 84 actuates, sending the temporary storage gripper cylinder 87 to the carrying mechanism 63 via the temporary storage lifting frame 85. The temporary storage grippers 88 on both sides enter the clamping slots 75, and the temporary storage gripper cylinder 87 actuates, clamping the chip frame through the temporary storage grippers 88. After the clamping cylinder 81 actuates to release the chip frame, the piston rod of the temporary storage lifting cylinder 84 rises, removing the chip frame from the surface of the carrying mechanism 63. The unloaded carrying mechanism 63 moves in the opposite direction to the input end of the conveyor rail 64, ready to receive the next delivered chip frame.

[0077] The carrier mechanism 63, which travels between the first and second temporary storage stations, moves to the first temporary storage station after unloading the chip frame. At the first temporary storage station, the temporary storage lifting cylinder 84 in the temporary storage mechanism 62 actuates, sending the temporary storage gripper cylinder 87 to the carrier mechanism 63 via the temporary storage lifting frame 85. The temporary storage grippers 88 on both sides enter the clamping slots 75, transferring the chip frame to the receiving slot 79. The temporary storage gripper cylinder 87 actuates, releasing the chip frame. After the proximity sensor 78 detects the chip frame being placed, the clamping cylinder 81 actuates to fix the chip frame, and the piston rod of the temporary storage lifting cylinder 84 rises. Then, the carrier mechanism 63 sends the chip frame loaded on its surface to the second execution station for processing. After processing, it is sent back to the second temporary storage station, and so on, until the chip frame, after processing at the final execution station, is sent to the output mechanism 61 for output to the subsequent process.

[0078] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.

Claims

1. A multi-product multi-level Clip assembly system, comprising a workbench (1), a plurality of execution stations are arranged on the surface of the workbench (1), a picking unit (5) and a punching unit (6) are arranged in the execution station, characterized in that: A conveying unit (4) for conveying chip frames is provided on the surface of the workbench (1). Multiple execution stations are arranged along the arrangement direction of the conveying unit (4). A feeding unit (3) is erected above the conveying unit (4). A strip jumper frame (10) is wound in the feeding unit (3) in a coil. The feeding unit (3) is located above two adjacent execution stations and is connected to the punching unit (6) in the two execution stations respectively.

2. The multi-class multi-level clip assembly system of claim 1, wherein: The feeding unit (3) includes a feeding fixing frame mounted on the conveying unit (4). Multiple feeding trays (7) are respectively arranged on the sides of the feeding fixing frame before and after the chip frame moves. A jumper frame (10) is wound on each feeding tray (7). A punching unit (6) is respectively arranged below the feeding fixing frame, corresponding to the feeding tray (7) and receiving the jumper frame (10).

3. The multi-category, multi-level Clip assembly system according to claim 2, characterized in that: Pick-up units (5) are also provided on the lower sides of the front and rear sides of the feeding fixture. The pick-up units (5) are located on the outside of multiple punching units (6) on the same side. The pick-up units (5) are connected to multiple punching units (6) on the same side and together form an execution station.

4. The multi-class multi-level clip assembly system of claim 1, wherein: The conveying unit (4) is a linearly arranged conveying guide rail (64). The conveying guide rail (64) passes through all the execution stations. Multiple carrier mechanisms (63) for placing chip frames are provided on the conveying guide rail (64). The carrier mechanisms (63) reciprocate independently on the surface of the conveying guide rail (64), and two adjacent carrier mechanisms (63) are connected one after the other. The carrier mechanism (63) passes through at least one execution station during the reciprocating operation.

5. The multi-class multi-level clip assembly system of claim 4, wherein: The docking point of two adjacent carrier mechanisms (63) is a temporary storage station, and a temporary storage mechanism (62) is set up at the temporary storage station to realize the chip frame grabbing and transfer.

6. The multi-class multi-level clip assembly system of claim 3, wherein: Two feeding trays (7) are respectively provided on the front and rear sides of the feeding fixture. A punching unit (6) is arranged below the two feeding trays (7) on the same side. The picking unit (5) that docks with the two punching units (6) on the same side includes a picking translation module (15). Two sets of picking components (16) that work alternately are arranged on the picking translation module (15). An adsorption mechanism (25) that docks with the corresponding punching unit (6) is provided in each picking component (16).

7. The multi-class multi-level clip assembly system of claim 6, wherein: The pickup assembly (16) includes a base for connecting to the moving part of the translation module, a vertically arranged lifting module is provided on the end face of the base, an adsorption mechanism (25) is rotatably mounted on the moving part of the lifting module, and a rotary drive mechanism is provided on the surface of the lifting module for connecting to the adsorption mechanism (25) and driving the adsorption mechanism (25) to rotate.

8. The multi-class multi-level clip assembly system as claimed in claim 1 or 2 or 3 or 6, wherein: The punching unit (6) includes a punching main frame. Along the moving direction of the jumper frame (10), the surface of the punching main frame is provided with a drive frame for driving the jumper frame (10) to move and a punching frame (47) for punching the jumper frame (10) to obtain jumpers. A solder box (13) and a solder box (26) are also provided at the output end of the punching frame (47).

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