一种封装框架料片的移转机构

By designing inclined clamping rods and threaded groove structures, the problem of mis-clamping when the robotic gripper picks up thin sheet frame material was solved, achieving accurate single-layer clamping and improving clamping stability.

CN224521592UActive Publication Date: 2026-07-17SHANDONG JINGDAO MICROELECTRONICS

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHANDONG JINGDAO MICROELECTRONICS
Filing Date
2025-07-28
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing robotic grippers tend to grip two layers when picking up thin sheet frame materials, posing a risk of gripping the wrong layer.

Method used

It adopts an inclined clamping rod and threaded groove structure to clamp the frame pieces at an angle, avoiding clamping multiple layers.

Benefits of technology

This effectively avoids the risk of clamping the wrong layer, ensuring that only a single layer of material is clamped each time, thus improving the accuracy and stability of clamping.

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Abstract

本实用新型提供一种封装框架料片的移转机构,涉及半导体封装设备领域,包括基板、连接于基板的安装座和夹持部,安装座与基板滑动连接,安装座连接有驱动其在基板上移动的夹持开合驱动件,夹持部包括连接座和夹持件,所述连接座与基板固定,连接座内部设置有用于容纳夹持件的容纳槽,夹持件包括载块和夹持杆件,载块位于所述容纳槽内并通过转轴与连接座转动连接,载块与连接座之间还连接有弹簧件,所述夹持杆件位于连接座下侧并与载块固定连接,夹持杆件与竖直方向呈预设夹角,夹持杆件的周面上设置有用于夹持框架料片外缘的螺纹槽;本实用新型能够在实施夹取操作时进行斜向夹取,保证每次仅夹取单层料片,有效避免了夹错层的风险。
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Claims

1. A transfer mechanism for a packaging frame sheet, comprising a substrate (1), a mounting base (11) connected to the substrate (1), and a set of clamping parts (2), wherein the mounting base (11) is slidably connected to the substrate (1), and the mounting base (11) is connected to a clamping opening and closing drive member (21) for driving it to move on the substrate (1), characterized in that, The clamping part (2) includes a connecting seat (3) and a clamping member (4). The connecting seat (3) is fixed on the outside of the mounting seat (11). The connecting seat (3) has a receiving groove (5) for accommodating the clamping member (4). The clamping member (4) includes a carrier block (41) and a clamping rod (42). The carrier block (41) is located in the receiving groove (5) and is rotatably connected to the connecting seat (3) through a rotating shaft (43). A spring member (6) is also connected between the carrier block (41) and the connecting seat (3). The clamping rod (42) is located on the lower side of the connecting seat (3) and is fixedly connected to the carrier block (41). The clamping rod (42) forms a preset angle with the vertical direction. A threaded groove (420) for clamping the outer edge of the frame sheet is provided on the circumferential surface of the clamping rod (42).

2. The transfer mechanism for encapsulation frame web according to claim 1, wherein, The spring (6) is in a compressed state and is connected between the carrier (41) and the connecting seat (3) to drive the carrier (41) to rotate around the pivot (43) so that the ends of the group of clamping rods (42) tend to move closer to each other.

3. The transfer mechanism for encapsulation frame web according to claim 1, wherein, The lower part of the connecting seat (3) is provided with a threaded hole that is compatible with the clamping rod (42), and the clamping rod (42) and the connecting seat (3) are connected by threads.

4. The transfer mechanism for encapsulation frame web according to claim 3, wherein, The lower part of the connecting seat (3) is provided with an installation slope (31), a threaded hole is provided on the installation slope (31), and the clamping rod (42) is vertically connected to the installation slope (31).

5. The transfer mechanism for encapsulation frame web according to claim 1, wherein, A fixing baffle (7) is also provided on the outside of the clamping part (2). The fixing baffle (7) covers the outer side of the multiple clamping parts (2) and is fixed to the clamping parts (2) by bolts.

6. The transfer mechanism for encapsulation frame web according to claim 1, wherein, Multiple vacuum suction cups (8) are also fixedly connected to the lower side of the substrate (1).

7. The transfer mechanism for encapsulation frame web according to claim 6, wherein, The upper side of the substrate (1) is connected to a vacuum tube (9) that communicates with the vacuum chuck (8).