橡胶垫、真空机械手和晶圆传输系统

By designing a honeycomb-shaped raised unit structure on the rubber pad of the vacuum manipulator, the contact area and friction between the wafer and the rubber pad are increased, solving the slippage problem caused by aging and contaminants in traditional vacuum manipulators, and achieving higher transmission stability and cost-effectiveness.

CN224521594UActive Publication Date: 2026-07-17HANGZHOU FULLSEMI SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HANGZHOU FULLSEMI SEMICON CO LTD
Filing Date
2025-08-05
Publication Date
2026-07-17

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Abstract

本实用新型提供了一种橡胶垫、真空机械手和晶圆传输系统，该橡胶垫包括橡胶垫本体以及设置于橡胶垫本体上的第一凸起单元和第二凸起单元；第二凸起单元的高度大于第一凸起单元的高度，且第二凸起单元位于第一凸起单元的外侧；第一凸起单元配置为与待传输晶圆的表面相接触；第二凸起单元配置为围设于待传输晶圆的外侧。该真空机械手包括片叉和该橡胶垫；该晶圆传输系统包括该真空机械手。本实用新型可以有效增大静摩擦力，避免在晶圆的传输过程中出现滑片现象。
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Claims

1. A rubber mat, characterized in that, It includes a rubber pad body and a first protrusion unit and a second protrusion unit disposed on the rubber pad body; The height of the second protruding unit is greater than the height of the first protruding unit, and the second protruding unit is located outside the first protruding unit; The first protrusion unit is configured to contact the surface of the wafer to be transferred; The second protrusion unit is configured to surround the outer side of the wafer to be transferred.

2. The rubber mat of claim 1, wherein, The first protrusion unit includes a plurality of spaced-apart first protrusion points, and the second protrusion unit includes a plurality of spaced-apart second protrusion points, wherein the height of the second protrusion points is greater than the height of the first protrusion points.

3. The rubber mat of claim 2, wherein, The height of the first protrusion is 400μm to 500μm.

4. The rubber mat of claim 2, wherein, The height of the second protrusion is 1000μm to 1200μm.

5. The rubber mat of claim 2, wherein, The distance between any two adjacent first protrusions is 200μm to 300μm.

6. The rubber mat of claim 2, wherein, The second protrusion point includes a first protrusion and a second protrusion connected together. The first protrusion is connected to the rubber pad body. The height of the first protrusion is equal to the height of the first protrusion point, and the diameter of the second protrusion is smaller than the diameter of the first protrusion.

7. The rubber mat of claim 6, wherein, The distance between the first protrusions of any two adjacent second protrusion points is 200μm to 300μm.

8. The rubber mat of claim 6, wherein, The height of the second protrusion is greater than the height of the first protrusion.

9. A vacuum robot, characterized in that It includes a fork and at least one rubber pad as claimed in any one of claims 1 to 8, the rubber pad being disposed on the working surface of the fork and disposed near the edge of the working surface of the fork.

10. A wafer transport system, comprising: Including the vacuum manipulator as described in claim 9.