一种适用于扇出型封装的高精度晶圆取放及校准机构
By employing a high-precision wafer pick-and-place and calibration mechanism, and utilizing a combination design of a feeder and clamping plate, the problem of difficult chip positioning was solved, enabling precise packaging and rapid cooling, thereby improving packaging efficiency and effectiveness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUAFENG TECH (GUANGDONG HENGQIN GUANGDONG-MACAO DEEP COOP ZONE) CO LTD
- Filing Date
- 2025-08-13
- Publication Date
- 2026-07-17
AI Technical Summary
In the current wafer packaging process, the chip position is difficult to control precisely, requiring identification and adjustment, resulting in low packaging efficiency.
A high-precision wafer pick-and-place and calibration mechanism is adopted. Through the combination design of the feed table and the clamping plate, the chip is accurately positioned and fixed by the lead screw drive. Combined with the feeding platform and the packaging device, precise packaging without the need for readjustment is achieved.
It achieves efficient and precise positioning and fixation of the chip, improves packaging efficiency, and accelerates packaging molding through airflow cooling, thereby improving packaging effect and efficiency.
Smart Images
Figure CN224521597U_ABST
Abstract
Claims
1. A high-precision wafer pick-and-place and calibration mechanism suitable for fan-out packaging, comprising a processing base (1), characterized in that: The upper end of the processing base (1) is provided with a material conveying channel (2), and the material conveying channel (2) is slidably connected to the material conveying platform (3). The upper end of the material conveying platform (3) is fixedly provided with first sliding grooves (4) on both sides. The first sliding grooves (4) on both sides are slidably connected with clamping plates (5). The first sliding grooves (4) are rotatably connected with first lead screws (6). The two ends of the first lead screws (6) have opposite threads. The first lead screws (6) are threadedly sleeved with the clamping plates (5). One end of the material conveying platform (3) is fixedly connected with a first driving device (7). The first driving device (7) is fixedly connected with the first lead screws (6). One side of the processing base (1) is fixedly provided with a sealing device (8).
2. The high-precision wafer pick-and-place and calibration mechanism for fan-out package according to claim 1, wherein: The bottom of the material conveying channel (2) is fixedly provided with a second slide groove (9), and the interior of the second slide groove (9) is rotatably connected with a second lead screw (10). The second lead screw (10) is rotatably connected to the material conveying table (3) by a thread. The side of the processing seat (1) is fixedly connected with a second driving device (11), and the second driving device (11) is fixedly connected to the second lead screw (10) by a shaft.
3. The high-precision wafer pick-and-place and calibration mechanism for fan-out package according to claim 2, wherein: The second drive device (11) and the first drive device (7) have the same structure. The second drive device (11) includes a motor housing (12), a drive motor (14) and a first power supply (15).
4. The high-precision wafer pick-and-place and calibration mechanism for fan-out package according to claim 3, wherein: The motor housing (12) has heat dissipation windows (13) fixedly opened on both sides inside. A drive motor (14) is fixedly connected to one side inside the motor housing (12), and a first power supply (15) is fixedly connected to the other side inside the motor housing (12).
5. The high precision wafer pick and place and calibration mechanism for fan-out package of claim 1, wherein: A fixed bracket (16) is fixedly connected to one side of the processing base (1), and a first fan box (17) is fixedly connected to the upper end of the fixed bracket (16). A first fan (19) is fixedly connected to the lower end of the interior of the first fan box (17), and a cooling air duct (18) is fixedly connected to the air outlet of the first fan box (17).
6. The high-precision wafer pick-and-place and calibration mechanism for fan-out package according to claim 5, wherein: The upper end of the first fan box (17) is inlaid with a cooling plate (20), and the lower end of the cooling plate (20) is fixedly connected to a cooling copper plate (21). The upper surface of the first fan box (17) is covered with a second fan box (24). A second fan (22) is fixedly connected to one side of the interior of the second fan box (24), and a second power supply (23) is fixedly connected to the other side of the interior of the second fan box (24).