一种真空传输模组及半导体加工设备

Abstract

一种真空传输模组及半导体加工设备，涉及半导体设备技术领域。该真空传输模组包括壳体和盖板，壳体内具有用于放置晶圆的空腔；壳体的一侧具有开口，盖板盖设于开口上，盖板上具有至少一个沿其板厚方向开设的通孔，通孔内设置有玻璃；盖板内嵌有管道，管道至少部分环设于通孔周缘；盖板的侧壁分别开设有冷却介质入口和冷却介质出口，管道的两端分别与冷却介质入口和冷却介质出口连通；冷却介质经冷却介质入口进入管道中，并与盖板产生热交换后经冷却介质出口流出。

Claims

1. A vacuum transfer module, characterized by The device includes a housing and a cover plate. The housing has a cavity for placing a wafer. One side of the housing has an opening, and the cover plate covers the opening. The cover plate has at least one through hole along its thickness direction, and glass is disposed in the through hole. A pipe is embedded in the cover plate, and the pipe is at least partially arranged around the periphery of the through hole. The side wall of the cover plate has a cooling medium inlet and a cooling medium outlet, and the two ends of the pipe are respectively connected to the cooling medium inlet and the cooling medium outlet. The cooling medium enters the pipe through the cooling medium inlet, exchanges heat with the cover plate, and then flows out through the cooling medium outlet.

2. The vacuum transfer module of claim 1, wherein, The number of through holes is one, and the pipe includes a first body, a second body, and a diversion section; the diversion section is arranged around the periphery of the through hole; one end of the first body is connected to the cooling medium inlet, and the end of the first body away from the cooling medium inlet is connected to the first end of the pipe outside the diversion section; one end of the second body is connected to the cooling medium outlet; and the end of the second body away from the cooling medium outlet is connected to the second end of the pipe outside the diversion section.

3. The vacuum transfer module of claim 1, wherein, The number of through holes is multiple. The pipe includes a first body, a second body, a third body, and multiple branch sections. The number of branch sections corresponds to the number of through holes. Each branch section is arranged around the periphery of the corresponding through hole. Any adjacent branch sections are connected through the third body to form a series branch section. One end of the first body is connected to the cooling medium inlet. The end of the first body away from the cooling medium inlet is connected to the starting branch section of the series branch section. One end of the second body is connected to the cooling medium outlet. The end of the second body away from the cooling medium outlet is connected to the ending branch section of the series branch section.

4. The vacuum transfer module of claim 1, wherein, The inner wall of the pipe is sequentially covered with a waterproof coating and a heat-absorbing coating.

5. The vacuum transfer module of claim 1, wherein, The cooling medium inlet is connected to a cooling medium input pipe, through which the cooling medium flows into the pipeline; a first throttle valve is provided on the cooling medium input pipe, which is used to adjust the flow rate of the cooling medium per unit time.

6. The vacuum transfer module of claim 1, wherein, The cooling medium outlet is connected to a cooling medium output pipe, through which the cooling medium in the pipe is discharged; a thermometer is installed on the cooling medium output pipe to measure the temperature of the cooling medium.

7. The vacuum transfer module of claim 5, wherein, A first flow meter is installed on the cooling medium inlet pipe, and the first flow meter is located between the first throttle valve and the cooling medium inlet; the first flow meter is used to measure the flow rate of the cooling medium in the cooling medium inlet pipe per unit time.

8. The vacuum transfer module of claim 6, wherein, A second flow meter is installed on the cooling medium output pipe; the second flow meter is used to measure the flow rate of the cooling medium in the cooling medium output pipe per unit time.

9. The vacuum transfer module of claim 6, wherein, The cooling medium output pipe is made of polyvinyl chloride.

10. A semiconductor processing apparatus, characterized by comprising: Includes the vacuum transmission module as described in any one of claims 1-9.

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