A leveling mechanism, a lifting device and a semiconductor device

Abstract

This application discloses a leveling mechanism, a lifting device, and semiconductor equipment, relating to the field of semiconductor processing technology. The leveling mechanism includes a ball cup and a ball head, one of which is used for rotational adjustment relative to the other. One of the ball cup and the ball head is provided with a limiting pin, and the other of the ball cup and the ball head is provided with a limiting hole adapted to the limiting pin. The limiting pin and the limiting hole cooperate to restrict relative rotation between the ball cup and the ball head in a first direction. The above-mentioned leveling mechanism, through the cooperation of the ball cup and the ball head and the design of the limiting pin and the limiting hole, effectively solves the technical problem of traditional leveling mechanisms in balancing leveling freedom and anti-rotation performance, improving the positioning accuracy and process stability of wafer transport in semiconductor manufacturing equipment.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing equipment, and in particular to a leveling mechanism, a lifting device, and semiconductor equipment. Background Technology

[0002] In the field of semiconductor manufacturing equipment, the leveling mechanism is a core functional component for achieving precise wafer positioning, and its performance directly affects the process accuracy of key equipment such as lithography machines, etching equipment, and thin film deposition systems. Currently, the industry generally adopts a ball-and-socket joint structure. This joint structure achieves multi-degree-of-freedom leveling through spherical contact and relies on the mechanical constraint of the locking screw to limit the relative rotation of the ball head and ball bowl in the horizontal direction.

[0003] However, this structure has the following problems in practical applications: First, under the vibration conditions of long-term equipment operation, the locking screws are prone to loosening and failure, resulting in the loss of anti-rotation function; second, even if the screws are intact, there is still a small rotational clearance between the ball head and the ball cup, which is difficult to meet the stringent requirements of advanced processes for sub-micron level positioning accuracy. Therefore, the existing technology has the technical problem of not being able to simultaneously achieve high-precision leveling freedom and reliable anti-rotation performance. Utility Model Content

[0004] This application discloses a leveling mechanism, a lifting device, and a semiconductor device. By using the cooperation between the ball cup and the ball head, as well as the design of the limiting pin and the limiting hole, the problem of relative rotation between the ball cup and the ball head in the first direction in the prior art is effectively solved, so that the leveling mechanism has both high-precision leveling freedom and reliable anti-rotation performance.

[0005] In a first aspect, this application provides a leveling mechanism, including a ball cup and a ball head, one of which is used for rotational adjustment relative to the other. One of the ball cup and the ball head is provided with a limiting pin, and the other of the ball cup and the ball head is provided with a limiting hole adapted to the limiting pin. The limiting pin cooperates with the limiting hole to limit the relative rotation of the ball cup and the ball head in a first direction.

[0006] In this embodiment, the leveling mechanism achieves multi-degree-of-freedom leveling through a precise fit between the ball cup and the ball head. A limiting pin is provided on one of the ball cup and the ball head, while the other is machined with a limiting hole that precisely matches it. Due to the anti-rotation fit between the limiting pin and the limiting hole, the relative rotation of the ball head and the ball cup in the horizontal direction is effectively restricted. This solves the technical problem of traditional leveling mechanisms in balancing leveling freedom and anti-rotation performance, and improves the positioning accuracy and process stability of wafer transfer in semiconductor manufacturing equipment.

[0007] In one possible implementation, a limiting pin is disposed at the bottom of one of the ball cup and the ball head, and a limiting hole is disposed at the bottom of the other of the ball cup and the ball head.

[0008] In this embodiment, the positions of the limiting pin and the limiting hole are optimized to enhance the overall performance of the leveling mechanism. Specifically, the limiting pin is located at the bottom of one of the ball cup and the ball head, while the limiting hole is located at the bottom of the other. This design utilizes the characteristics of the bottom support surface; by placing the limiting pin and the limiting hole at the bottom, stress can be effectively dispersed, thereby improving the structural stability of the entire leveling mechanism. In actual operation, this layout helps ensure the stability of the leveling mechanism under load, reduces structural deformation or damage caused by stress concentration, and thus extends the service life of the leveling mechanism and improves its reliability.

[0009] In one possible implementation, the limiting pin and the limiting hole are symmetrical about the central axis of the ball cup or ball head.

[0010] In this embodiment, the limiting pins and limiting holes are designed with a symmetrical layout, meaning they are symmetrically arranged about the central axis of the ball cup or ball head. This symmetrical design makes the anti-rotation torque more evenly distributed between the ball cup and ball head, effectively avoiding structural deformation or damage caused by stress concentration on one side. This symmetrical layout not only improves the stability and reliability of the leveling mechanism but also reduces the requirements for machining accuracy. In practical applications, this means the leveling mechanism can achieve high-precision leveling under a wider range of machining conditions, while reducing performance degradation caused by machining errors. This design optimizes the overall performance of the leveling mechanism, making it more suitable for high-precision, high-stability applications.

[0011] In one possible implementation, the cross-sectional profile of the limiting pin along the second direction includes at least one straight edge segment.

[0012] In this embodiment, the design of the limiting pin incorporates at least one straight edge segment, a feature that significantly improves the performance of the leveling mechanism. Specifically, the cross-sectional profile of the limiting pin along the second direction includes a straight edge segment, providing a clearly defined anti-rotation contact surface. Compared to traditional pure curved surface mating, the straight edge segment can transmit torque more effectively, thereby improving torque transmission efficiency. This design not only enhances the stability of the leveling mechanism during rotational adjustment but also ensures more precise control in high-precision leveling operations. In this way, the leveling mechanism can better adapt to various complex working conditions and meet the requirements for high-precision and high-stability leveling.

[0013] In one possible implementation, the cross-sectional shape of the limiting pin in the second direction is non-circular.

[0014] In this embodiment, the cross-sectional shape of the limiting pin in the second direction is designed to be non-circular, an innovative design that overcomes the rotational symmetry limitations of traditional cylindrical pins. The non-circular cross-section of the limiting pin enables directional locking within the same space, effectively saving axial installation space. This design not only improves the space utilization efficiency of the leveling mechanism but also enhances its locking capability in a specific direction, ensuring the accuracy and stability of the leveling process. By adopting a non-circular cross-section, the limiting pin can better adapt to complex leveling requirements, providing strong support for high-precision leveling.

[0015] In one possible implementation, the cross-sectional shape of the limiting pin is one of the following: D-shaped, racetrack-shaped, fan-shaped, elliptical, or polygonal.

[0016] In this embodiment, the cross-sectional shape of the limiting pin is designed into various non-traditional circular geometric shapes, specifically including any one of D-shape, racetrack shape, sector shape, ellipse, and polygon. The selection of these shapes is based on different application scenarios and leveling requirements, and each shape has unique technical advantages.

[0017] The D-shaped limiting pin combines the anti-rotation properties of a flat surface with the self-centering properties of a curved surface. The flat part of the D-shape provides a clear anti-rotation contact surface, while the curved part allows for self-centering adjustment within a certain range, thus increasing the flexibility of the leveling operation while maintaining high-precision leveling.

[0018] The racetrack-shaped limit pin achieves bidirectional anti-rotation through its dual-plane design. This design is particularly suitable for leveling tasks requiring precise control in two directions, effectively preventing relative rotation of the ball cup and ball head in two orthogonal directions, thus improving the stability and reliability of leveling.

[0019] The fan-shaped limit pin is suitable for scenarios with limited angle adjustments. Its design allows for fine adjustments within a specific angle range while limiting rotation beyond that range, which is very useful for applications requiring high-precision leveling within a specific angle.

[0020] The polygonal limit pins can be expanded in number to prevent rotation as needed. This flexibility allows the leveling mechanism to adapt to a variety of different leveling requirements, especially in complex multi-directional leveling tasks, where the polygonal design provides more adjustment freedom and higher precision.

[0021] In one possible implementation, the cross-sectional dimension of the limiting hole gradually increases along the second direction, which is perpendicular to the plane containing the first direction.

[0022] In this embodiment, the limiting hole features a unique design where its cross-sectional dimensions gradually increase along the second direction (i.e., the vertical direction perpendicular to the horizontal plane). This design provides necessary physical clearance for subsequent leveling operations. Specifically, during leveling operations such as adjusting the ball joint angle, this gradually expanding shape of the limiting hole effectively prevents rigid interference between the limiting pin and the wall of the limiting hole. This not only ensures that the degree of freedom in the vertical direction remains unaffected but also provides greater flexibility and operational space for fine-tuning of the leveling mechanism during the leveling process. Through this ingenious design, the leveling mechanism can achieve more precise control in complex leveling tasks while maintaining structural stability and reliability.

[0023] In one possible implementation, the limiting pin and the limiting hole have a first gap d1 in a first direction, the first gap d1 being used to provide spatial compensation for the deflection movement between the ball head and the ball cup.

[0024] In this embodiment, a first gap d1 is designed between the limiting pin and the limiting hole in the first direction (i.e., the rotation direction in the horizontal plane), and this gap is a circumferential gap. The key to this design is to provide the necessary space compensation for the deflection movement between the ball head and the ball cup. Specifically, the existence of the first gap d1 allows the ball head to make a small deflection movement within the ball cup without interference caused by the rigid contact between the limiting pin and the limiting hole. This design not only avoids rigid interference that may occur due to angle changes, but also ensures the flexibility and stability of the leveling mechanism during operation. In this way, the leveling mechanism can achieve more precise control in complex leveling tasks while maintaining the stability and reliability of the structure.

[0025] In one possible implementation, the leveling mechanism further includes at least one locking element, one of the ball cup and the ball head is provided with at least one through hole, and the other of the ball cup and the ball head is provided with at least one fixing hole. The at least one locking element, the at least one through hole, and the at least one fixing hole correspond one-to-one. By passing each locking element through the corresponding through hole and coaxially locking it with the corresponding fixing hole, the relative position of the ball cup and the ball head in the second direction is constrained.

[0026] In this embodiment, the leveling mechanism further optimizes its structural design by introducing at least one locking element to enhance its stability and accuracy. Specifically, one of the ball cup and the ball head has at least one through hole, while the other has at least one fixing hole. The locking element, through hole, and fixing hole correspond one-to-one. By passing the locking element through the through hole and locking it coaxially with the fixing hole, the relative position of the ball cup and the ball head in the second direction (i.e., the vertical direction) is constrained.

[0027] The key to this design lies in forming an orthogonal constraint system. The constraint mechanism of the locking element in the second direction and the anti-rotation function of the limiting pin in the first direction (i.e., in the horizontal plane) work together to form a three-dimensional, fully free-degree-of-freedom locking system. This orthogonal constraint system not only improves the parallelism of the bearing surface after leveling but also ensures the stability and reliability of the leveling mechanism under various working conditions. In this way, the leveling mechanism can achieve more precise control in complex leveling tasks while maintaining structural stability and reliability, meeting the requirements of high-precision leveling.

[0028] In one possible implementation, at least one locking element is provided, and the locking elements are evenly distributed around the circumference of the leveling mechanism.

[0029] In this embodiment, the leveling mechanism has multiple locking components, which are evenly distributed circumferentially. This design forms a closed force ring through the even distribution of multiple locking components in the circumferential direction. The function of this closed force ring is to make the ball cup and ball head more evenly stressed, avoiding local deformation caused by single-point locking.

[0030] Specifically, when multiple locking components are evenly distributed, they can share the locking force, thereby reducing structural deformation caused by excessive local stress. This evenly distributed design not only improves the overall stability of the leveling mechanism but also enhances its reliability in high-precision leveling tasks. In this way, the leveling mechanism can maintain the precise position of the ball cup and ball head during complex leveling operations, while reducing errors that may be introduced by uneven locking force, ensuring the parallelism and stability of the bearing surface after leveling.

[0031] In one possible implementation, the locking elements are distributed at least in a third direction and a fourth direction, with the fourth direction perpendicular to the third direction.

[0032] In this embodiment, the distribution of the locking components is further optimized to improve the adjustment performance of the leveling mechanism. Specifically, the locking components are not only evenly distributed in the circumferential direction of the leveling mechanism, but also vertically distributed in the third and fourth directions. The third and fourth directions are both in the horizontal plane and are perpendicular to each other.

[0033] This design allows the locking elements to function in two orthogonal directions, thus enriching the adjustment options. By vertically distributing the locking elements in the third and fourth directions, the leveling mechanism can more flexibly respond to adjustment needs in different directions, optimizing the layout of adjustment directions. This layout not only improves the leveling mechanism's adjustment accuracy in the horizontal plane but also enhances its adaptability to complex working conditions, ensuring the efficiency and accuracy of leveling operations.

[0034] In one possible implementation, the leveling mechanism is used to connect the mechanism to be leveled, which has a symmetrical structure and a symmetrical axis, with a third direction coinciding with the symmetrical axis.

[0035] In this embodiment, the leveling mechanism is designed to connect a symmetrical mechanism to be leveled, which has an axis of symmetry. The locking elements in the leveling mechanism are distributed in a third direction that coincides with the axis of symmetry of the mechanism to be leveled. This design allows the locking elements to specifically suppress displacement or deformation caused by the load in the third direction (i.e., the main force direction of the mechanism to be leveled), thereby ensuring the stability of the connection between the leveling mechanism and the mechanism to be leveled.

[0036] Simultaneously, the locking element in the fourth direction forms an orthogonal constraint with the third direction. This orthogonal constraint effectively limits the mechanism offset caused by lateral forces or torques, avoiding a decrease in leveling accuracy due to asymmetrical loads. Through this design, the leveling mechanism can not only adapt to the symmetrical structure of the mechanism to be leveled, but also maintain high-precision leveling performance under complex load conditions, ensuring the stability and reliability of the entire system.

[0037] In one possible implementation, each through hole is a countersunk spherical hole;

[0038] The surfaces of each locking component that mate with the countersunk spherical holes are spherical.

[0039] or,

[0040] Each locking component is provided with a spherical washer between itself and the corresponding through hole. The surface of the spherical washer that mates with the countersunk spherical hole is spherical.

[0041] In this embodiment, the through hole in the leveling mechanism is designed as a countersunk spherical hole, which allows for spherical contact between the locking member and the through hole. Specifically, the surface of the locking member that mates with the countersunk spherical hole is spherical. This spherical contact design can effectively convert the preload of the locking member into a pure axial force, thereby eliminating the additional bending moment caused by the preload.

[0042] In addition, there is a design variant in which a spherical washer is placed between the locking element and the through hole, and the surface of the spherical washer that mates with the countersunk spherical hole is also spherical. This design further optimizes the force transmission, ensuring that the preload of the locking element is evenly distributed, while avoiding structural deformation or damage caused by local stress concentration.

[0043] This spherical contact design enables the leveling mechanism to maintain higher stability and reliability during the locking process. The spherical contact not only improves force transmission efficiency but also reduces errors that may be introduced by uneven preload, thus ensuring high precision and stability of the leveling mechanism under various operating conditions. This design is particularly suitable for applications requiring high-precision leveling and stability, such as semiconductor manufacturing equipment.

[0044] In one possible implementation, there is a second gap d2 between the ball head and the ball bowl in a second direction.

[0045] In this embodiment, a second gap d2 is designed between the ball head and the ball cup in the second direction (i.e., the vertical direction). The key to this design is to provide the necessary space allowance for the relative movement between the ball head and the ball cup. Specifically, the existence of the second gap d2 ensures that the ball head and the ball cup can be flexibly adjusted in position during the initial leveling process without jamming due to machining errors or assembly errors.

[0046] This design not only enhances the flexibility of the leveling mechanism during the initial leveling stage but also provides ample space for subsequent fine adjustments. By incorporating a second gap d2 between the ball head and the ball cup, the leveling mechanism can better adapt to various machining and assembly conditions, ensuring high-precision leveling in practical applications. This design optimizes the overall performance of the leveling mechanism, enabling it to exhibit higher reliability and adaptability in complex leveling tasks.

[0047] In one possible implementation, the ball head is a sectional structure, and a second gap d2 is formed between the sectional structure and the ball cup;

[0048] Alternatively, the surface of the ball head is provided with a groove, which forms a second gap d2 between the groove and the inner wall of the ball bowl;

[0049] Or / and, the inner wall of the ball bowl is provided with a groove, which forms a second gap d2 between the groove and the surface of the ball head.

[0050] In this embodiment, to further optimize the relative motion performance between the ball head and the ball cup, various structures are designed to form the second gap d2. Specifically, the following implementation methods are available.

[0051] One implementation involves designing the ball head as a slit structure. This structure, through partial material removal, creates a second gap d2 between the slit structure and the ball cup. This design reduces the contact area between the ball head and the ball cup, thereby reducing frictional resistance and improving the flexibility and response speed of the leveling mechanism during the leveling process.

[0052] One implementation involves creating a groove on the surface of the ball head, forming a second gap d2 between the groove and the inner wall of the ball cup. This design also reduces frictional resistance by decreasing the contact area, while providing the necessary space for relative movement between the ball head and the ball cup, ensuring smooth leveling operations.

[0053] One implementation involves creating a groove on the inner wall of the ball cup, forming a second gap d2 between the groove and the surface of the ball head. This design not only reduces the contact area but also optimizes the relative movement between the ball head and the ball cup through the structural characteristics of the groove, thereby improving the overall performance of the leveling mechanism.

[0054] By incorporating a slit or groove structure between the ball head and the ball cup, the leveling mechanism achieves more efficient leveling operations while reducing wear caused by frictional resistance, thus extending the equipment's service life. This design not only improves the flexibility of the leveling mechanism but also ensures its stability and reliability in high-precision leveling tasks.

[0055] In one possible implementation, the ball head is a sectional structure, and the sectional height of the sectional structure is no greater than 1 / 3 of the depth of the ball bowl.

[0056] In this embodiment, the ball head is designed as a sectional structure, and its sectional height is strictly limited to ensure that it does not exceed 1 / 3 of the ball bowl depth. The key to this design lies in balancing the requirements of adjustment flexibility and structural strength.

[0057] By limiting the cutting height, the ball head can retain more than 70% of its original contact area. This design not only ensures sufficient contact area between the ball head and the ball cup to transfer the necessary load, thus maintaining the strength and stability of the structure, but also provides enough space for the deflection movement of the ball head, enhancing the flexibility of adjustment. This balanced design enables the leveling mechanism to achieve more precise control in high-precision leveling operations, while maintaining the reliability and durability of the structure.

[0058] Furthermore, preserving most of the original contact area helps reduce structural damage caused by localized stress concentration, further improving the service life and reliability of the leveling mechanism. Through this optimized design, the leveling mechanism can exhibit higher performance and adaptability in complex leveling tasks, meeting the requirements for high-precision and high-stability leveling.

[0059] In one possible implementation, the surface roughness of the ball head or ball cup is between Ra1um and Ra2um.

[0060] In this embodiment, the key to this design lies in optimizing the frictional characteristics between the ball head and the ball cup to achieve high-performance operation of the leveling mechanism.

[0061] Specifically, when the surface roughness of the ball head or cup is between Ra1µm and Ra2µm, the coefficient of friction between the ball head and cup can be maintained between 0.15 and 0.35. This range of friction coefficients not only ensures smooth movement between the ball head and cup but also takes into account the wear life of the leveling mechanism. By precisely controlling the surface roughness, the leveling mechanism can achieve more stable performance in high-precision leveling operations, while reducing wear caused by friction and extending the service life of the equipment.

[0062] This design optimizes the overall performance of the leveling mechanism, enabling it to exhibit higher reliability and adaptability in complex leveling tasks, and meeting the requirements for high-precision and high-stability leveling.

[0063] In one possible implementation, the height h1 of the ball head is greater than the depth h2 of the ball bowl.

[0064] In this embodiment, the key to this design lies in optimizing the relative motion between the ball head and the ball bowl to improve the smoothness of the motion.

[0065] Specifically, when the height of the ball head is greater than the depth of the ball cup, the sides of the ball head will not contact the sides of the ball cup. This design avoids friction and jamming caused by contact, thus significantly improving the smoothness of movement between the ball head and the ball cup. In this way, the leveling mechanism can be more flexible and stable when performing high-precision leveling operations, reducing errors and wear caused by friction.

[0066] This design not only improves the performance of the leveling mechanism but also extends its service life, ensuring that it maintains high precision and stability in leveling under complex working conditions.

[0067] In one possible implementation, the contact height between the ball head and the bowl is between 1 / 2 and 3 / 4 of the bowl depth.

[0068] In this embodiment, the key to this design lies in optimizing the contact area between the ball head and the ball cup to improve the load-bearing capacity and structural stability of the leveling mechanism.

[0069] Specifically, by setting the contact height between 1 / 2 and 3 / 4 of the ball cup depth, sufficient contact area is maintained between the ball head and the ball cup. This design not only ensures the stability of the leveling mechanism under load but also effectively prevents localized stress concentration. Localized stress concentration can lead to structural deformation or damage, while by optimizing the contact height, the leveling mechanism can evenly distribute the load, reducing problems caused by stress concentration.

[0070] This design not only improves the load-bearing capacity of the leveling mechanism but also enhances its reliability and durability under complex working conditions. In this way, the leveling mechanism can exhibit higher performance in high-precision leveling tasks while maintaining structural stability and reliability.

[0071] Secondly, this application provides a lifting device, comprising:

[0072] The aforementioned leveling mechanism, bearing mechanism, and lifting mechanism are configured such that the leveling mechanism is located between the bearing mechanism and the lifting mechanism. The leveling mechanism is used to adjust the levelness of the bearing mechanism, and the lifting mechanism is used to control the lifting of the bearing mechanism.

[0073] In this embodiment, this application provides a lifting device, the core components of which include a leveling mechanism, a supporting mechanism, and a lifting mechanism. The leveling mechanism is disposed between the supporting mechanism and the lifting mechanism. This layout not only ensures the independence of the leveling function but also achieves seamless coordination between the leveling action and the lifting action.

[0074] Specifically, the leveling mechanism is responsible for adjusting the horizontality of the load-bearing mechanism, ensuring that it remains stable and level throughout the lifting and lowering process. The load-bearing mechanism can be considered as the leveling mechanism described above, with its symmetrical structure and axis of symmetry matching the design of the leveling mechanism. The lifting mechanism is responsible for controlling the lifting and lowering motion of the load-bearing mechanism, ensuring the stability of the entire device during operation through precise control of the lifting and lowering process.

[0075] The key to this design lies in the coordinated operation of the leveling mechanism and the lifting mechanism, which enables the lifting device to maintain high-precision leveling during lifting operations. By placing the leveling mechanism between the load-bearing mechanism and the lifting mechanism, the lifting device can achieve more efficient operation in complex operating environments while maintaining high-precision and high-stability leveling functionality.

[0076] In terms of technical effectiveness, this layout not only ensures the independence of the leveling function but also achieves seamless coordination with the lifting action, significantly improving the stability of the lifting mechanism during the lifting process. This design is particularly suitable for scenarios requiring high-precision leveling and stable lifting, such as semiconductor manufacturing equipment, effectively reducing errors and vibrations caused by uncoordinated leveling and lifting actions, thereby significantly improving the performance and reliability of the entire lifting device.

[0077] In one possible implementation, the ball cup is integrally formed with one of the supporting mechanism and the lifting mechanism, and the ball head is integrally formed with the other of the supporting mechanism and the lifting mechanism.

[0078] or,

[0079] The ball cup is integrally formed with one of the supporting mechanism and the lifting mechanism, and the ball head is fixedly connected with the other of the supporting mechanism and the lifting mechanism;

[0080] or,

[0081] The ball cup is fixedly connected to one of the supporting mechanism and the lifting mechanism, and the ball head is integrally formed with the other of the supporting mechanism and the lifting mechanism;

[0082] or,

[0083] The ball cup is fixedly connected to one of the supporting mechanism and the lifting mechanism, and the ball head is fixedly connected to the other of the supporting mechanism and the lifting mechanism.

[0084] In this embodiment, the structural design of the lifting device provides multiple connection methods to adapt to different application scenarios and needs. Specifically, the ball cup and ball head can be integrally formed or fixedly connected to one or both components of the bearing mechanism and the lifting mechanism. Specifically, there are several implementation methods.

[0085] One implementation involves integrally molding the ball cup with either the load-bearing mechanism or the lifting mechanism, and integrally molding the ball head with the other: this design reduces assembly steps, improves overall rigidity, and ensures the stability and reliability of the structure.

[0086] One implementation involves integrally molding the ball cup with either the load-bearing mechanism or the lifting mechanism, while the ball head is fixedly connected to the other. This design combines the rigidity of integral molding with the flexibility of fixed connection, facilitating quick repair or replacement when needed.

[0087] One implementation involves a ball cup being fixedly connected to either a support mechanism or a lifting mechanism, while the ball head is integrally formed with the other. This design combines the advantages of both fixed connection and integral forming, providing structural stability and ease of maintenance.

[0088] One implementation involves a ball cup being fixedly connected to either a support mechanism or a lifting mechanism, while the ball head is fixedly connected to the other. This design provides maximum flexibility, facilitates quick replacement and maintenance, and also maintains structural stability.

[0089] In terms of technical benefits, the unibody design reduces assembly steps and improves overall rigidity, which is especially important for applications requiring high precision and stability. The modular connection design facilitates quick replacement and maintenance, improving equipment maintenance efficiency and lifespan. This flexible connection method allows the lifting device to adapt to different working conditions and needs, ensuring efficient and stable operation in various complex application scenarios.

[0090] Thirdly, this application provides a semiconductor device including the aforementioned lifting device.

[0091] The leveling device and the lifting mechanism work together to ensure that the support structure remains horizontal and stable throughout the lifting process. Specifically, the leveling mechanism adjusts the levelness of the support structure, while the lifting mechanism controls its lifting motion. This synergy ensures the stability of the support structure during lifting and prevents wafer shifting or slippage caused by tilting.

[0092] In terms of technical benefits, this design significantly improves the operational stability of semiconductor equipment. By ensuring the substrate remains horizontally stable during lifting and lowering, the risk of wafer damage or process failure due to mechanical vibration or tilting is effectively reduced. This is particularly important for semiconductor manufacturing processes that require high precision and stability, significantly improving production efficiency and product quality. Attached Figure Description

[0093] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0094] Figure 1 This is a structural diagram of the lifting device provided in an embodiment of this application from a first-view perspective;

[0095] Figure 2 for Figure 1 Sectional view along line I-I;

[0096] Figure 3 for Figure 2 Enlarged view of section A in the middle;

[0097] Figure 4 This is a structural diagram of the lifting device provided in an embodiment of this application from a second perspective;

[0098] Figure 5 for Figure 4 Sectional view along line BB;

[0099] Figure 6 A schematic diagram of a semiconductor device provided in an embodiment of this application.

[0100] Explanation of reference numerals in the attached figures:

[0101] 100 - Semiconductor equipment;

[0102] 1- Lifting device;

[0103] 11-Leveling mechanism; 12-Bearing mechanism; 13-Lifting mechanism;

[0104] 111-Ball cup; 112-Ball head; 113-Limit pin; 114-Limit hole; 115-Locking part; 116-Through hole; 117-Fixing hole; 118-Spherical washer; 119-Groove; 121-Fixing ring; 122-Lifting pin;

[0105] 1131 - Straight edge segment;

[0106] d1 - First gap; d2 - Second gap; h1 - Height of the ball head; h2 - Depth of the ball bowl. Detailed Implementation

[0107] The leveling mechanism and related components of this application are mainly used in the field of high-precision semiconductor manufacturing, especially in process modules that require precise control of wafer transport and processing. This mechanism is used to support and adjust the cantilever stage to ensure the stability and accuracy of the wafer during pick-up, drop-off, and transport.

[0108] In the semiconductor manufacturing field, high-precision leveling is crucial for ensuring the stable operation of process modules. The leveling mechanism described in this application can be primarily applied to key components in semiconductor manufacturing equipment, such as wafer stage leveling mechanisms, mask stage support systems, and precision adjustment mechanisms for projection lenses in lithography machines; base leveling devices within process chambers of etching machines; end effectors of wafer transport robotic arms; and sealing and leveling mechanisms for chamber cover plates; as well as substrate heating plates, vacuum robotic arm transport systems, and sealing and leveling devices for process chamber valves in thin film deposition equipment. These devices typically require precise control of the wafer's level and position at the micron or even nanometer scale to ensure process stability and repeatability.

[0109] In semiconductor manufacturing equipment, the cantilever lifting mechanism is a key component for precise wafer transfer. It uses lifting pins to vertically raise and lower the wafer to facilitate robotic arm operations. Specifically, the cantilever lifting mechanism mainly consists of four parts: the cantilever beam body, the precision drive system, the lifting pins, and the leveling mechanism. The cantilever beam body is made of high-strength alloy material to ensure structural rigidity. The precision drive system includes linear guides and servo motors to achieve micron-level lifting control. The lifting pins, composed of multiple ceramic pins, directly contact and lift the wafer. To ensure process reliability, the levelness of the lifting pin end faces must be strictly controlled, and horizontal deflection of the lifting pins must be prevented to avoid wafer slippage during lifting.

[0110] To address this, this utility model proposes a leveling mechanism with positioning function. One end of the leveling mechanism is integrated into the fixed ring of the fixed lifting pin, and the other end is rigidly connected to the cantilever beam body. By setting a ball head and a ball cup on the leveling mechanism and adding a limiting pin assembly in the mating mechanism of the ball head and the ball cup, a three-in-one precision leveling system is formed. This enables the fixed ring to achieve high-precision multi-degree-of-freedom leveling while reducing the deflection of the fixed ring in the horizontal direction. Thus, it has both excellent leveling accuracy and reliable anti-rotation performance, providing important technical support for semiconductor manufacturing processes.

[0111] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0112] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0113] Example 1

[0114] Please refer to Figures 1 to 3 ,in, Figure 1 This is a structural diagram from a first-view perspective of the lifting device provided in an embodiment of this application. Figure 2 for Figure 1 Sectional view along line I-I, Figure 3 for Figure 2 Enlarged view of part A in the middle.

[0115] This application provides a leveling mechanism 11, including: a ball cup 111 and a ball head 112, one of the ball cup 111 and the ball head 112 being used for rotational adjustment relative to the other, one of the ball cup 111 and the ball head 112 being provided with a limiting pin 113, and the other of the ball cup 111 and the ball head 112 being provided with a limiting hole 114 adapted to the limiting pin 113, so as to limit the relative rotation of the ball cup 111 and the ball head 112 in a first direction by the cooperation of the limiting pin 113 and the limiting hole 114.

[0116] It is understandable that the first direction refers to the relative rotation direction of the bowl 111 and the head 112 around their common central axis (rotation axis).

[0117] Specifically, the ball cup 111 has a hemispherical structure with a spherical inner surface to accommodate the ball head 112. The end face of the ball cup 111 is flat, facilitating a fixed connection with the end face of the ball head 112. The dimensions of the ball cup 111 are designed according to the size of the ball head 112, ensuring that the ball head 112 can rotate freely within the ball cup 111. The central axis of the ball cup 111 coincides with the central axis of the ball head 112 to ensure smooth relative movement between the two.

[0118] Specifically, the ball head 112 has a spherical structure with a spherical outer surface that can fit tightly against the inner surface of the ball cup 111. The size of the ball head 112 is slightly smaller than the inner diameter of the ball cup 111 to ensure that the ball head 112 can rotate freely within the ball cup 111. The ball head 112 is connected to other components (such as the aforementioned retaining ring 121), and the leveling between the components connected to the ball head 112 and the ball cup 111 is achieved through the mating relationship between the ball head 112 and the ball cup 111.

[0119] Specifically, one of the ball cup 111 and the ball head 112 is used for rotational adjustment relative to the other. That is, the ball cup 111 and the ball head 112 form a spherical kinematic pair, with relative rotational degrees of freedom around the center of the sphere. The ball cup 111, through the spherical movement of the ball head 112 within the ball cup 111, can achieve multi-directional rotational adjustment, thereby adjusting the position and angle of the component connected to the ball head 112. This rotational adjustment function allows the leveling mechanism to be flexibly adjusted in different working environments to achieve the best leveling effect. In some embodiments, the ball cup 111 remains fixed, while the ball head 112 can rotate (such as the ball head of a steering mechanism). In other embodiments, the ball head 112 can be fixed, while the ball cup 111 can rotate.

[0120] Specifically, one of the ball cup 111 and the ball head 112 is provided with a limiting pin 113, and the other of the ball cup 111 and the ball head 112 is provided with a limiting hole 114 that matches the limiting pin 113. If the ball cup 111 is provided with a limiting pin 113, then the ball head 112 is machined with a limiting hole 114 that matches it. When the ball head 112 rotates relative to the ball cup 111, the limiting pin 113 slides within the limiting hole 114 until it contacts the hole wall, limiting the rotation angle. If the ball head 112 is provided with a limiting pin 113, then the ball cup 111 is machined with a limiting hole 114. When the ball cup 111 rotates relative to the ball head 112, the limiting pin 113 moves within the limiting hole 114, and when it reaches the limiting position, it prevents further rotation.

[0121] Specifically, the size and shape of the limiting hole 114 are adjusted according to the design of the limiting pin 113 to ensure a tight fit between the two while allowing for a certain range of rotational adjustment. In some embodiments, the limiting pin 113 can be a cylindrical pin, which may be a solid structure and can be determined according to the load-bearing requirements. In some embodiments, the limiting hole 114 can be an arc-shaped elongated hole with semi-circular ends (matching the limiting pin 113) and a straight groove in the middle to ensure that the limiting pin 113 can slide smoothly. In some embodiments, the length, i.e., the height, of the limiting pin 113 is not less than the depth of the limiting hole 114. When the ball cup 111 and the ball head 112 are subjected to axial force (such as vibration or impact), the limiting pin 113 can always be fully embedded in the limiting hole 114, avoiding failure of the limiting function due to partial disengagement. At the same time, the full-depth fit between the pin and the hole can suppress radial wobble, ensure a smooth rotational limiting process, and avoid jamming or abnormal noise. In other embodiments, the length of the limiting pin 113 is slightly less than the depth of the limiting hole 114, and the limiting pin 113 does not completely fill the limiting hole 114, reducing the contact area between the limiting pin 113 and the limiting hole 114, thereby reducing the sliding friction resistance during rotation and improving the smoothness of movement. The position and size of the limiting pin 113 are adjusted according to the design of the limiting hole 114 to ensure that the two can fit precisely. The limiting pin 113 is fixed to the ball cup 111 or ball head 112 by welding or threaded connection, or it can be integrally formed with the ball cup 111 or ball head 112 to ensure its firmness and reliability. In some embodiments, the limiting contact position between the limiting pin 113 and the limiting hole 114 needs to be chamfered. When the limiting pin 113 moves to the end of the limiting hole 114, the chamfered structure can achieve progressive contact rather than rigid collision, reducing the instantaneous impact force.

[0122] Specifically, the engagement between the limiting pin 113 and the limiting hole 114 is achieved by inserting the limiting pin 113 into the limiting hole 114. The limiting pin 113 and the limiting hole 114 are tightly engaged, and when the ball head 112 rotates relative to the ball cup 111, the engagement between the limiting pin 113 and the limiting hole 114 restricts the rotation of the ball head 112 in the first direction. This engagement method allows the ball head 112 to rotate freely in other directions while effectively limiting its movement in a specific direction.

[0123] During the assembly of the ball cup 111 and the ball head 112, the limiting pin 113 is inserted into the limiting hole 114. When the ball cup 111 and the ball head 112 rotate relative to each other around the axis, the limiting pin 113 slides along the arc-shaped trajectory of the limiting hole 114 until it contacts the end boundary of the limiting hole 114. At this point, the mechanical interference of the pin-hole structure prevents the two from continuing to rotate relative to each other, thereby achieving the limitation of the rotation angle in the first direction (i.e., the direction of rotation around the axis), while the degrees of freedom in other directions remain unaffected. It is worth noting that it is necessary to ensure that there is a fitting clearance between the limiting pin 113 and the limiting hole 114 to ensure smooth movement.

[0124] In this embodiment, the leveling mechanism 11 achieves multi-degree-of-freedom leveling through the precise fit between the ball cup 111 and the ball head 112. A limiting pin 113 is provided on one of the ball cup 111 and the ball head 112, and a limiting hole 114 is machined on the other to precisely fit with it. Due to the anti-rotation fit between the limiting pin 113 and the limiting hole 114, the relative rotation of the ball head 112 and the ball cup 111 in the horizontal direction is effectively restricted. This solves the technical problem that traditional leveling mechanisms cannot balance leveling freedom and anti-rotation performance, and improves the positioning accuracy and process stability of wafer transfer in semiconductor manufacturing equipment.

[0125] In one possible implementation, a limiting pin 113 is disposed at the bottom of one of the ball cup 111 and the ball head 112, and a limiting hole 114 is disposed at the bottom of the other of the ball cup 111 and the ball head 112.

[0126] In some embodiments, a limiting pin 113 is disposed at the bottom of the ball cup 111. The limiting pin 113 has a cylindrical structure, with one end fixed to the inner surface of the bottom of the ball cup 111 and the other end extending into the internal space of the ball cup 111. The diameter and length of the limiting pin 113 are designed according to the size of the limiting hole 114 to ensure that the two can fit precisely. The limiting pin 113 is fixed to the bottom of the ball cup 111 by means of welding or threaded connection to ensure its firmness and reliability. The axis of the limiting pin 113 is parallel to the central axis of the ball cup 111, and its position is designed so that when the ball head 112 is installed in the ball cup 111, the limiting pin 113 can be accurately inserted into the limiting hole 114 on the ball head 112.

[0127] In some embodiments, a limiting pin 113 is disposed at the bottom of the ball head 112. The limiting pin 113 has a cylindrical structure, with one end fixed to the outer surface of the bottom of the ball head 112 and the other end extending below the ball head 112. The diameter and length of the limiting pin 113 are designed according to the size of the limiting hole 114 on the ball cup 111 to ensure that the two can fit precisely. The limiting pin 113 is fixed to the bottom of the ball head 112 by welding or threaded connection to ensure its firmness and reliability. The axis of the limiting pin 113 is parallel to the central axis of the ball head 112, and its position is designed so that when the ball head 112 is installed in the ball cup 111, the limiting pin 113 can be accurately inserted into the limiting hole 114 on the ball cup 111.

[0128] In some embodiments, a limiting hole 114 is provided at the bottom of the ball cup 111. The limiting hole 114 is a tapered hole located on the inner surface of the bottom of the ball cup 111. The tapered angle of the limiting hole 114 ranges from 5° to 15°, and the bottom is rounded to reduce stress concentration and improve the flexibility of the fit. The center of the limiting hole 114 is aligned with the central axis of the ball cup 111, and its size and shape are adjusted according to the design of the limiting pin 113 to ensure a tight fit between the two. The connection between the limiting hole 114 and the ball cup 111 is formed directly on the inner surface of the bottom of the ball cup 111 through a machining process, without the need for additional connecting parts.

[0129] In some embodiments, a limiting hole 114 is disposed at the bottom of the ball head 112. The limiting hole 114 is a tapered hole disposed on the outer bottom surface of the ball head 112. The tapered angle of the limiting hole 114 ranges from 5° to 15°, and the bottom is rounded to reduce stress concentration and improve the flexibility of the fit. The center position of the limiting hole 114 is aligned with the central axis of the ball head 112, and its size and shape are adjusted according to the design of the limiting pin 113 to ensure that the two can fit tightly. The connection between the limiting hole 114 and the ball head 112 is formed directly on the outer bottom surface of the ball head 112 through a machining process, without the need for additional connecting parts.

[0130] In this embodiment, the positions of the limiting pin 113 and the limiting hole 114 are optimized to enhance the overall performance of the leveling mechanism. Specifically, the limiting pin 113 is located at the bottom of one of the ball cup 111 and the ball head 112, while the limiting hole 114 is located at the bottom of the other. This design utilizes the characteristics of the bottom support surface; by placing the limiting pin 113 and the limiting hole 114 at the bottom, stress can be effectively dispersed, thereby improving the structural stability of the entire leveling mechanism. In actual operation, this layout helps ensure the stability of the leveling mechanism under load, reduces structural deformation or damage caused by stress concentration, and thus extends the service life of the leveling mechanism and improves its reliability.

[0131] In one possible implementation, the limiting pin 113 and the limiting hole 114 are symmetrical about the central axis of the ball cup 111 or the ball head 112.

[0132] It is understandable that the central axis of the ball bowl 111 refers to the straight line passing through the geometric center of the ball bowl 111, which is perpendicular to the bottom plane of the ball bowl 111 and coincides with the center of the inner surface of the ball bowl 111. This central axis is the axis of symmetry of the ball bowl 111, and both the inner and outer surfaces of the ball bowl 111 are symmetrically distributed around this central axis. The central axis of the ball head 112 refers to the straight line passing through the geometric center of the ball head 112, which coincides with the center of the ball head 112. This central axis is the axis of symmetry of the ball head 112, and the outer surface of the ball head 112 is symmetrically distributed around this central axis.

[0133] In some embodiments, a limiting pin 113 is disposed on the ball bowl 111, the central axis of the limiting pin 113 is parallel to the central axis of the ball bowl 111, and the position of the limiting pin 113 is symmetrical about the central axis of the ball bowl 111. This means that if viewed from the central axis of the ball bowl 111 to both sides, the arrangement of the limiting pin 113 at the bottom of the ball bowl 111 is symmetrical. For example, the limiting pin 113 may be located at the bottom of the ball bowl 111, and its mirror position may be symmetrical about the central axis.

[0134] In some embodiments, a limiting pin 113 is disposed on the ball head 112, the central axis of the limiting pin 113 is parallel to the central axis of the ball head 112, and the position of the limiting pin 113 is symmetrical about the central axis of the ball head 112. This means that if viewed from the central axis of the ball head 112 to both sides, the arrangement of the limiting pin 113 at the bottom of the ball head 112 is symmetrical. For example, the limiting pin 113 may be located at the bottom of the ball head 112, and its mirror position may be symmetrical about the central axis.

[0135] In some embodiments, a limiting hole 114 is disposed on the ball bowl 111, the central axis of the limiting hole 114 is parallel to the central axis of the ball bowl 111, and the position of the limiting hole 114 is symmetrical about the central axis of the ball bowl 111. This means that if viewed from the central axis of the ball bowl 111 to both sides, the arrangement of the limiting holes 114 at the bottom of the ball bowl 111 is symmetrical. For example, the limiting hole 114 may be located at the bottom of the ball bowl 111, and its mirror position may be symmetrical about the central axis.

[0136] In some embodiments, a limiting hole 114 is disposed on the ball head 112, the central axis of the limiting hole 114 is parallel to the central axis of the ball head 112, and the position of the limiting hole 114 is symmetrical about the central axis of the ball head 112. This means that if viewed from the central axis of the ball head 112 to both sides, the arrangement of the limiting holes 114 at the bottom of the ball head 112 is symmetrical. For example, the limiting hole 114 may be located at the bottom of the ball head 112, and its mirror position may be symmetrical about the central axis.

[0137] In this embodiment, the limiting pin 113 and the limiting hole 114 are designed with a symmetrical layout, meaning they are symmetrically arranged about the central axis of the ball cup 111 or the ball head 112. This symmetrical design makes the anti-rotation torque more evenly distributed between the ball cup 111 and the ball head 112, effectively avoiding structural deformation or damage caused by stress concentration on one side. This symmetrical layout not only improves the stability and reliability of the leveling mechanism but also reduces the requirements for machining accuracy. In practical applications, this means that the leveling mechanism can achieve high-precision leveling under a wider range of machining conditions, while reducing performance degradation caused by machining errors. This design optimizes the overall performance of the leveling mechanism, making it more suitable for high-precision and high-stability applications.

[0138] In one possible implementation, the cross-sectional profile of the limiting pin 113 along the second direction includes at least one straight edge segment 1131, the second direction being perpendicular to the plane containing the first direction.

[0139] It is understandable that the second direction refers to the direction perpendicular to the plane containing the first direction. For example, if the plane containing the first direction is a horizontal plane, then the second direction is a vertical direction perpendicular to the horizontal plane.

[0140] It is understood that the cross-sectional profile of the limiting pin 113 along the second direction refers to the cross-sectional profile of the limiting pin 113 in a plane perpendicular to the second direction. The cross-sectional profile of the limiting pin 113 includes at least one straight edge segment 1131, which means that the straight edge segment 1131 is located in the plane containing the first direction and can be adapted to the shape of the limiting hole 114, thereby achieving a precise limiting function. In the plane containing the first direction, the limiting function of the limiting pin 113 in the first direction is ensured, while allowing rotational freedom in other directions.

[0141] It is understood that the extension direction of the straight edge segment 1131 is perpendicular to the second direction. Specifically, the straight edge segment 1131 lies in the plane containing the first direction and extends along that plane, or is parallel to the first direction. Since the second direction is perpendicular to the plane containing the first direction, the straight edge segment 1131 is perpendicular to the second direction, and its extension direction is neither parallel to nor coincides with the first direction. This design ensures the limiting function of the limiting pin 113 in the first direction.

[0142] The cross-sectional profile of the limiting pin 113 may include one or more straight edge segments 1131. For example, if the limiting pin 113 is D-shaped, it includes one straight edge segment 1131. For example, if the limiting pin 113 is racetrack-shaped, it includes two straight edge segments 1131, located on either side. For example, if the limiting pin 113 is fan-shaped, it includes one straight edge segment 1131. For example, if the limiting pin 113 is polygonal, depending on the shape of the polygon, it may include multiple straight edge segments 1131, such as a triangle (3 straight edge segments), a rectangle (4 straight edge segments), etc.

[0143] In this embodiment, the design of the limiting pin 113 incorporates at least one straight edge segment 1131, a feature that significantly improves the performance of the leveling mechanism. Specifically, the cross-sectional profile of the limiting pin 113 along the second direction includes the straight edge segment 1131, providing a clearly defined anti-rotation contact surface. Compared to conventional pure curved surface mating, the straight edge segment 1131 can transmit torque more effectively, thereby improving torque transmission efficiency. This design not only enhances the stability of the leveling mechanism during rotational adjustment but also ensures more precise control in high-precision leveling operations. In this way, the leveling mechanism can better adapt to various complex working conditions and meet the requirements for high-precision and high-stability leveling.

[0144] In one possible implementation, the limiting pin 113 has a non-circular cross-sectional shape in the second direction.

[0145] It is understood that the second direction is perpendicular to the plane containing the first direction. If the plane containing the first direction is a horizontal plane, then the second direction is a vertical direction perpendicular to the horizontal plane. This means that when the limiting pin 113 is viewed from the vertical direction (the second direction), its cross-sectional profile is non-circular. The cross-sectional profile of the limiting pin 113 can take at least one of the following non-circular shapes: D-shaped, racetrack-shaped, fan-shaped, and elliptical.

[0146] In some embodiments, the non-circular cross-sectional profile of the limiting pin 113 includes at least one straight edge segment 1131 for fitting the shape of the limiting hole 114, thereby achieving a precise limiting function. The design of the straight edge segment 1131 ensures close contact between the limiting pin 113 and the limiting hole 114, thereby limiting the relative rotation of the ball head 112 and the ball cup 111 in the first direction.

[0147] In some embodiments, to ensure balanced force distribution, the cross-sectional shape of the limiting pin 113 can be designed to be symmetrical about the central axis. For example, the cross-sectional shape of the limiting pin 113 is racetrack-shaped or elliptical. This symmetrical design not only helps simplify the manufacturing process but also ensures a more precise fit between the limiting pin 113 and the limiting hole 114 during use, further improving the performance of the leveling mechanism.

[0148] In this embodiment, the limiting pin 113 has a non-circular cross-sectional shape in the second direction, an innovative design that overcomes the rotational symmetry limitations of traditional cylindrical pins. The non-circular cross-section of the limiting pin 113 enables directional locking within the same space, effectively saving axial installation space. This design not only improves the space utilization efficiency of the leveling mechanism but also enhances its locking capability in a specific direction, ensuring the accuracy and stability of the leveling process. By adopting a non-circular cross-section, the limiting pin 113 can better adapt to complex leveling requirements, providing strong support for high-precision leveling.

[0149] In one possible implementation, the cross-sectional shape of the limiting pin 113 in the second direction is one of D-shape, racetrack shape, fan shape, ellipse, or polygon.

[0150] In some embodiments, the limiting pin 113 has a D-shaped cross-sectional shape in the second direction, which is composed of a semi-circular portion and a straight portion. The semi-circular portion provides a smooth transition area, which helps reduce stress concentration and ensures smooth contact when mating with the limiting hole 114. The straight portion, i.e., the straight edge segment 1131, is one of the key features of the D-shape. It is used to fit tightly with the inner wall of the limiting hole 114, thereby achieving the anti-rotation function. This design not only ensures the limiting function of the limiting pin 113 in the first direction, but also makes the entire structure more balanced under force through the transition of the semi-circular portion, improving the stability and reliability of the leveling mechanism. The symmetrical design of the D-shape further ensures the fitting accuracy between the limiting pin 113 and the limiting hole 114 during actual use, enabling the leveling mechanism to maintain good performance under complex working conditions.

[0151] In some embodiments, the cross-sectional shape of the limiting pin 113 adopts a racetrack-shaped design, which consists of two parallel straight segments and two semicircular arcs. The two parallel straight segments, namely the straight side segments 1131, are the core feature of the racetrack shape, and they are used to fit tightly with the inner wall of the limiting hole 114, thereby achieving the anti-rotation function. This design provides a large contact area, enhances the limiting effect, and ensures that the relative rotation of the ball head 112 and the ball cup 111 in the first direction is effectively limited. The two semicircular arcs provide a smooth transition area, which helps to reduce stress concentration and allows the limiting pin 113 to achieve smooth contact when it mates with the limiting hole 114. The racetrack-shaped design not only improves the structural strength of the limiting pin 113, but also ensures the fitting accuracy between the limiting pin 113 and the limiting hole 114 during actual use through its symmetrical design, enabling the leveling mechanism to maintain good performance under complex working conditions. This design is particularly suitable for leveling mechanisms that require high limiting accuracy and a large contact area.

[0152] In some embodiments, the cross-sectional shape of the limiting pin 113 is fan-shaped, consisting of two radii and an arc, with a central angle greater than 90°. This fan-shaped design provides a larger contact area in the cross-section of the limiting pin 113 in the second direction, enhancing the limiting effect and effectively restricting the relative rotation of the ball head 112 and the ball cup 111 in the first direction. The straight edge 1131 of the fan shape, located between the two radii, fits tightly against the inner wall of the limiting hole 114, thus achieving anti-rotation. This design not only provides a large contact area but also ensures, through its geometry, the fitting accuracy between the limiting pin 113 and the limiting hole 114 during actual use. The fan-shaped design with a central angle greater than 90° further improves the structural strength of the limiting pin 113 while reducing stress concentration, allowing the leveling mechanism to maintain good performance under complex working conditions. This design is particularly suitable for leveling mechanisms requiring high limiting accuracy and a large contact area, while maintaining structural compactness.

[0153] In some embodiments, the limiting pin 113 has an elliptical cross-sectional shape in the second direction. An ellipse is a flattened circle with two distinct axes: a major axis and a minor axis. The elliptical design is characterized by its major axis being significantly larger than its minor axis. This geometric feature allows the limiting pin 113 to achieve an anti-rotation function when engaging with the limiting hole 114. Specifically, the major axis of the ellipse is aligned with the anti-rotation direction. When the limiting pin 113 is inserted into the limiting hole 114, the ellipse makes close contact with the inner wall of the limiting hole 114, thereby limiting the relative rotation of the ball head 112 and the ball cup 111 in the first direction. The elliptical design not only provides a larger contact area but also ensures, through its geometry, the fitting accuracy between the limiting pin 113 and the limiting hole 114 during actual use. Compared to a circular cross-section, the difference between the major and minor axes of the ellipse gives the limiting pin 113 a stronger limiting capability in the anti-rotation direction. In practical applications, the elliptical major axis provides sufficient friction and contact area, ensuring the leveling mechanism maintains good performance under complex working conditions. This design not only improves the stability and reliability of the leveling mechanism but also achieves precise limiting functions through its unique geometry.

[0154] In some embodiments, the cross-sectional shape of the limiting pin 113 is a polygonal design, which can be a regular hexagon, rectangle, or trapezoid, etc. Each polygonal design has its unique characteristics and advantages. The regular hexagonal design consists of six straight side segments 1131, with an included angle of 60° between each segment. This design provides multiple contact points, enhancing the limiting effect while maintaining structural symmetry and stability. The rectangular design consists of four straight side segments 1131, with an included angle of 90° between each segment. This design provides a larger contact area, enhancing the limiting effect while maintaining structural compactness and symmetry. The trapezoidal design consists of two parallel straight side segments 1131 and two non-parallel straight side segments 1131. This design provides multiple contact points, enhancing the limiting effect, and its geometry ensures the fitting accuracy between the limiting pin 113 and the limiting hole 114 during actual use. Polygonal designs are particularly suitable for leveling mechanisms requiring high limiting accuracy and a large contact area, while maintaining structural compactness and symmetry. By reasonably selecting the shape and size of the polygon, the fitting accuracy and structural strength of the limiting pin 113 and the limiting hole 114 can be further optimized.

[0155] In this embodiment, the cross-sectional shape of the limiting pin 113 is designed to be a variety of non-traditional circular geometric shapes, specifically including any one of D-shape, racetrack shape, sector shape, ellipse, and polygon. The selection of these shapes is based on different application scenarios and leveling requirements, and each shape has unique technical advantages.

[0156] If the limit pin 113 is D-shaped, the D-shape can simultaneously take into account the anti-rotation characteristics of a planar surface and the self-centering characteristics of a curved surface. The planar part of the D-shape provides a clear anti-rotation contact surface, while the curved part allows for self-centering adjustment within a certain range, thereby increasing the flexibility of the leveling operation while maintaining high-precision leveling.

[0157] If the limit pin 113 is racetrack-shaped, the racetrack shape achieves bidirectional anti-rotation function through its double-plane design. This design is particularly suitable for leveling tasks that require precise control in two directions, effectively preventing relative rotation of the ball cup 111 and the ball head 112 in two orthogonal directions, thus improving the stability and reliability of leveling.

[0158] If the limit pin is fan-shaped, it is suitable for scenarios with limited angle adjustment. Its design allows for fine adjustments within a specific angle range while limiting rotation outside that range, which is very useful for applications requiring high-precision leveling within a specific angle.

[0159] The polygonal limit pins 113 can be expanded in number to prevent rotation as needed. This flexibility allows the leveling mechanism to adapt to a variety of different leveling requirements, especially in complex multi-directional leveling tasks, where the polygonal design provides more adjustment freedom and higher precision.

[0160] In one possible implementation, the cross-sectional dimension of the limiting hole 114 gradually increases along the second direction, which is perpendicular to the plane containing the first direction.

[0161] Understandably, the cross-sectional dimensions of the limiting hole 114 gradually increase along the second direction, forming a conical structure. This design allows the cross-sectional area of ​​the limiting hole 114 to continuously increase from one end to the other, thus endowing it with guiding and adjusting functions. Due to the conical feature of the limiting hole 114, the ball head 112 can obtain a certain degree of deflection freedom within the limiting hole 114, enabling it to be flexibly adjusted within a preset angle range. At the same time, the limiting pin 113 cooperates with the conical inner wall of the limiting hole 114, which can both limit the excessive rotation of the ball head 112 and provide a stable constraint force through progressive contact, thereby ensuring the controllability, stability, and long-term reliability of the leveling mechanism.

[0162] Specifically, the tapered structure causes the cross-sectional dimensions of the limiting hole 114 to gradually increase in the vertical direction (second direction). This gradually increasing size design provides the ball head 112 with a certain amount of room to maneuver, allowing it to deflect when needed. This deflection capability is crucial for the leveling mechanism to adapt to different working conditions and load variations in practical applications. For example, in semiconductor manufacturing equipment, wafer transport may experience slight offsets due to uneven load distribution or mechanical vibration. In this case, the tapered limiting hole 114 allows the ball head 112 to deflect within a certain range, thereby adapting to these minor changes and ensuring the normal operation of the leveling mechanism.

[0163] Although the tapered design of the limiting hole 114 allows the ball head 112 to deflect, it simultaneously suppresses rotation through the engagement of the limiting pin 113 with the limiting hole 114. The shape and size of the limiting pin 113 are adapted to the tapered structure of the limiting hole 114, and when the limiting pin 113 is inserted into the limiting hole 114, the tight engagement between the two effectively limits the relative rotation of the ball head 112 and the ball cup 111 in the first direction. This function of suppressing rotation is crucial for the accuracy and stability of the leveling mechanism. For example, in high-precision semiconductor manufacturing equipment, the positioning accuracy requirements for wafer transport are extremely high. Through the engagement of the limiting pin 113 and the limiting hole 114, the leveling mechanism can ensure that the relative rotation in the first direction is effectively limited, thereby improving the positioning accuracy and process stability of wafer transport.

[0164] Furthermore, the tapered design of the limiting hole 114 offers other advantages. For example, the tapered structure reduces stress concentration, improving the structural strength and durability of the limiting hole 114. In practical applications, leveling mechanisms may be subject to various mechanical stresses and loads; the tapered design of the limiting hole 114 better disperses these stresses, thereby extending the service life of the leveling mechanism. Simultaneously, the tapered design also improves the machining and assembly accuracy of the limiting hole 114. Due to the gradual change in size of the tapered structure, dimensional accuracy can be more easily controlled during machining, ensuring the fitting accuracy between the limiting hole 114 and the limiting pin 113. During assembly, the tapered design also provides better guidance, allowing the limiting pin 113 to be inserted more smoothly into the limiting hole 114, improving assembly efficiency and reliability.

[0165] In this embodiment, the limiting hole 114 has a unique design feature: its cross-sectional dimensions gradually increase along the second direction (i.e., the vertical direction perpendicular to the horizontal plane). This design provides the necessary physical clearance for subsequent leveling operations. Specifically, when performing leveling operations such as adjusting the ball joint angle, this gradually expanding shape of the limiting hole 114 effectively avoids rigid interference between the limiting pin 113 and the wall of the limiting hole 114. This not only ensures that the degree of freedom in the vertical direction is not affected, but also provides greater flexibility and operating space for the leveling mechanism to make fine adjustments during the leveling process. Through this ingenious design, the leveling mechanism can achieve more precise control in complex leveling tasks while maintaining the stability and reliability of the structure.

[0166] Please refer to Figure 5 , Figure 5 for Figure 4 Sectional view along line BB.

[0167] In one possible implementation, the limiting pin 113 and the limiting hole 114 have a first gap d1 in a first direction, the first gap d1 being used to provide spatial compensation for the deflection movement between the ball head 112 and the ball cup 111.

[0168] It is understandable that the first clearance d1 refers to the single-sided fitting clearance between the limiting pin 113 and the limiting hole 114 in the first direction (circumferential direction in the horizontal plane), that is, the symmetrical distribution value of the clearance between the outer surface of the limiting pin 113 and the inner wall of the limiting hole 114 on both sides in this direction. Specifically, if the diameter of the limiting pin 113 is D and the width of the limiting hole 114 in the first direction is W, then the single-sided clearance d1 is calculated as d1=(WD) / 2, representing the maximum allowable single-sided offset of the limiting pin 113 when rotating circumferentially. The design of this clearance directly affects the motion freedom and constraint accuracy of the leveling mechanism. A smaller first clearance can improve the alignment accuracy but may limit flexibility, while a larger first clearance allows for a larger deflection range but may reduce stability. By reasonably controlling d1, it can be ensured that the limiting pin 113 can deflect smoothly within the limiting hole 114 while effectively suppressing excessive rotation, thereby balancing the adjustment capability and rigidity requirements of the mechanism.

[0169] Specifically, the first gap d1 needs to allow the ball head 112 to deflect at a certain angle relative to the ball cup 111. When the ball head 112 deflects, the movement trajectory of the limiting pin 113 within the limiting hole 114 will be affected by the first gap d1. Specifically, the maximum displacement ΔL can be calculated using the following formula: For example, when the first gap d1 is 0.02mm, the deflection angle... At a radius of 3°, the maximum displacement ΔL is approximately 0.001 mm. This design allows the ball head 112 to deflect freely within a certain range without being restricted by the tight contact between the limiting pin 113 and the limiting hole 114, thus providing the necessary space compensation for the relative movement between the ball head 112 and the ball cup 111.

[0170] Specifically, the design of the first gap d1 also needs to have a stress buffering function. In the initial contact stage, the contact stress between the limiting pin 113 and the limiting hole 114 is mainly line contact stress. As the ball head 112 deflects, when the maximum deflection angle is reached, the contact stress gradually disperses and transforms into surface contact stress. This stress dispersion mechanism can effectively reduce local stress concentration, thereby improving the structural strength and durability of the leveling mechanism. By rationally designing the size of the first gap d1, effective stress buffering can be achieved while ensuring the motion compensation function, ensuring the stability and reliability of the leveling mechanism under complex working conditions.

[0171] In this embodiment, a first gap d1 is designed between the limiting pin 113 and the limiting hole 114 in the first direction (i.e., the rotation direction in the horizontal plane), and this gap is a circumferential gap. The key to this design is to provide the necessary space compensation for the deflection movement between the ball head 112 and the ball cup 111. Specifically, the presence of the first gap d1 allows the ball head 112 to make a small deflection movement within the ball cup 111 without interference caused by the rigid contact between the limiting pin 113 and the limiting hole 114. This design not only avoids rigid interference that may occur due to angle changes, but also ensures the flexibility and stability of the leveling mechanism during operation. In this way, the leveling mechanism can achieve more precise control in complex leveling tasks while maintaining the stability and reliability of the structure.

[0172] In one possible implementation, the leveling mechanism 11 further includes at least one locking element 115. One of the ball cup 111 and the ball head 112 is provided with at least one through hole 116, and the other of the ball cup 111 and the ball head 112 is provided with at least one fixing hole 117. The at least one locking element 115, the at least one through hole 116, and the at least one fixing hole 117 correspond one-to-one. By passing each locking element 115 through the corresponding through hole 116 and coaxially locking it with the corresponding fixing hole 117, the relative position of the ball cup 111 and the ball head 112 in the second direction is constrained.

[0173] Specifically, the through hole 116 is an opening structure provided on the ball cup 111 or ball head 112 to accommodate the locking member 115, thereby achieving relative positional constraint between the ball cup 111 and the ball head 112. The through hole 116 can be cylindrical with a smooth inner wall to ensure that the locking member 115 can be smoothly inserted and fixed. Its shape is designed to match the outer diameter of the locking member 115, while leaving a certain fitting clearance to facilitate assembly and adjustment. The position of the through hole 116 depends on the relative movement requirements of the ball cup 111 and the ball head 112, as well as the locking requirements. Typically, the through hole 116 is distributed on the outer surface of the ball cup 111 or ball head 112 and corresponds to the position of the fixing hole 117, ensuring that the locking member 115 can accurately pass through the through hole 116 and be coaxially locked with the fixing hole 117. The size of the through hole 116 is determined by its inner diameter and depth. The inner diameter is slightly larger than the outer diameter of the locking member 115 to ensure an appropriate fitting clearance between them; the depth is determined according to the length of the locking member 115 and the fixing requirements, and is generally sufficient to accommodate the main body of the locking member 115. The number and distribution of the through holes 116 depend on the design requirements of the leveling mechanism 11. In one possible implementation, one or more through holes 116 can be provided to meet different locking requirements. Multiple through holes 116 can be evenly distributed or non-uniformly distributed according to specific mechanical requirements to achieve optimal locking effect and structural stability.

[0174] Specifically, the fixing hole 117 is an opening structure provided on the ball cup 111 or ball head 112, used to mate with the locking member 115 to achieve relative positional constraint between the ball cup 111 and the ball head 112. The fixing hole 117 can be cylindrical with threads machined on its inner wall to mate with the threaded portion of the locking member 115, achieving a locking function. The threaded design ensures that the locking member 115 can be firmly fixed in the fixing hole 117, thereby achieving stable constraint. The position of the fixing hole 117 depends on the relative movement requirements of the ball cup 111 and the ball head 112, as well as the locking requirements. Typically, the fixing holes 117 are distributed on the outer surface of the ball cup 111 or ball head 112, and correspond to the position of the through hole 116, to ensure that the locking member 115 can accurately pass through the through hole 116 and be coaxially locked with the fixing hole 117. The size of the fixing hole 117 is determined by its inner diameter and depth. The inner diameter is slightly larger than the outer diameter of the locking element 115 to ensure an appropriate fit clearance between them; the depth is determined based on the length of the locking element 115 and the fixing requirements, and is generally sufficient to accommodate the main body of the locking element 115. The thread specifications (such as pitch, thread diameter, etc.) are determined according to the design of the locking element 115. The number and distribution of the fixing holes 117 depend on the design requirements of the leveling mechanism 11. In one possible implementation, one or more fixing holes 117 can be provided to meet different locking requirements. Multiple fixing holes 117 can be evenly distributed or non-uniformly distributed according to specific mechanical requirements to achieve optimal locking effect and structural stability.

[0175] Specifically, the locking element 115 is a key component used to constrain the relative position of the ball bowl 111 and the ball head 112 in a second direction.

[0176] The locking element 115 is typically cylindrical with threads machined on its outer surface. It engages with the threaded portion of the fixing hole 117 to achieve a locking function. The threaded design ensures that the locking element 115 can be securely fixed within the fixing hole 117, thereby achieving stable constraint.

[0177] The position of the locking element 115 is determined according to the relative movement requirements of the ball cup 111 and the ball head 112, as well as the locking requirements. Typically, the position of the locking element 115 corresponds to the positions of the through hole 116 and the fixing hole 117 to ensure that it can accurately pass through the through hole 116 and be coaxially locked with the fixing hole 117.

[0178] The size of the locking element 115 is determined by its outer diameter and length. The outer diameter is slightly smaller than the inner diameter of the through hole 116 and the fixing hole 117 to ensure a proper fit clearance between them; the length is determined based on the depth of the through hole 116 and the fixing hole 117, as well as the fixing requirements, and is usually sufficient to penetrate the through hole 116 and be fixed in the fixing hole 117. The thread specifications (such as pitch, thread diameter, etc.) are determined according to the design of the fixing hole 117.

[0179] The number and distribution of locking elements 115 depend on the design requirements of the leveling mechanism 11. In one possible implementation, one or more locking elements 115 can be provided to meet different locking requirements. Multiple locking elements 115 can be evenly distributed or non-uniformly distributed according to specific mechanical requirements to achieve optimal locking effect and structural stability.

[0180] The connection between the through hole 116 and the ball cup 111 or ball head 112 is formed directly on the outer surface of the ball cup 111 or ball head 112 through a machining process. The through hole 116, together with the locking member 115 and the fixing hole 117, constitute the locking system of the leveling mechanism 11. By having the locking member 115 pass through the through hole 116 and be coaxially locked with the fixing hole 117, the relative position constraint of the ball cup 111 and ball head 112 in the second direction is achieved.

[0181] In the leveling mechanism 11, the locking element 115, through hole 116, and fixing hole 117 are designed to correspond to each other. Each locking element 115 corresponds to one through hole 116 and one fixing hole 117. This one-to-one correspondence design ensures that the locking element 115 can accurately pass through the corresponding through hole 116 and be coaxially locked with the corresponding fixing hole 117, thereby achieving relative positional constraint between the ball cup 111 and the ball head 112 in the second direction. This design not only improves the accuracy and reliability of locking but also simplifies the assembly process and reduces the possibility of assembly errors. During assembly, firstly, the locking element 115 is inserted into the corresponding through hole 116. Since the inner diameter of the through hole 116 is slightly larger than the outer diameter of the locking element 115, the locking element 115 can be inserted smoothly. Then, the locking element 115 is further inserted into the fixing hole 117 until the threaded portion of the locking element 115 is tightly engaged with the threaded portion of the fixing hole 117. During the locking process, the locking element 115 is fixed in the fixing hole 117 through the threaded connection. This fixing method ensures a secure connection between the locking element 115 and the fixing hole 117, thereby constraining the relative position of the ball cup 111 and the ball head 112 in the second direction. Through this locking mechanism, the relative position of the ball cup 111 and the ball head 112 in the second direction is fixed, thus ensuring the stability of the leveling mechanism 11 during use. This design not only improves the accuracy and reliability of the leveling mechanism 11, but also enhances its structural strength and durability through a reasonable gap design and stress dispersion mechanism.

[0182] In this embodiment, the leveling mechanism 11 further optimizes its structural design by introducing at least one locking element 115 to enhance the stability and accuracy of the leveling mechanism. Specifically, one of the ball cup 111 and the ball head 112 is provided with at least one through hole 116, while the other is provided with at least one fixing hole 117. The locking element 115, the through hole 116, and the fixing hole 117 correspond one-to-one. By passing the locking element 115 through the through hole 116 and coaxially locking it with the fixing hole 117, the relative position of the ball cup 111 and the ball head 112 in the second direction (i.e., the vertical direction) is constrained.

[0183] The key to this design lies in forming an orthogonal constraint system. The constraint mechanism of the locking element 115 in the second direction and the anti-rotation function of the limiting pin 113 in the first direction (i.e., in the horizontal plane) work together to form a three-dimensional, fully free-degree-of-freedom locking system. This orthogonal constraint system not only improves the parallelism of the bearing surface after leveling but also ensures the stability and reliability of the leveling mechanism under various working conditions. In this way, the leveling mechanism can achieve more precise control in complex leveling tasks while maintaining the stability and reliability of the structure, meeting the requirements of high-precision leveling.

[0184] In some cases, such as Figure 3 As shown, the ball head 112 is provided with at least one through hole 116, while the ball cup 111 is provided with at least one fixing hole 117.

[0185] In one possible implementation, there are at least a plurality of locking elements 115, and each locking element 115 is evenly distributed around the leveling mechanism 11.

[0186] In this embodiment, the leveling mechanism 11 has multiple locking elements 115, which are evenly distributed around the circumference of the leveling mechanism 11. This design forms a closed force ring through the even distribution of multiple locking elements 115 around the circumference. The function of this closed force ring is to make the ball cup 111 and the ball head 112 more evenly stressed, avoiding local deformation caused by single-point locking.

[0187] Specifically, when multiple locking elements 115 are evenly distributed, they can share the locking force, thereby reducing structural deformation caused by excessive local stress. This evenly distributed design not only improves the overall stability of the leveling mechanism 11 but also enhances its reliability in high-precision leveling tasks. In this way, the leveling mechanism 11 can maintain the precise position of the ball cup 111 and the ball head 112 during complex leveling operations, while reducing errors that may be introduced due to uneven locking force, ensuring the parallelism and stability of the bearing surface after leveling.

[0188] Please refer to Figure 4 , Figure 4This is a structural diagram of the lifting device provided in an embodiment of this application from a second perspective.

[0189] In one possible implementation, each locking member 115 is distributed at least in a third direction and a fourth direction, the fourth direction being perpendicular to the third direction.

[0190] In this embodiment, the distribution of each locking member 115 is further optimized to improve the adjustment performance of the leveling mechanism 11. Specifically, the locking members 115 are not only evenly distributed in the circumferential direction of the leveling mechanism 11, but also vertically distributed in the third and fourth directions. The third and fourth directions are both in the horizontal plane and are perpendicular to each other.

[0191] This design allows the locking element 115 to function in two orthogonal directions, thus enriching the adjustment options. By vertically distributing the locking elements 115 in the third and fourth directions, the leveling mechanism 11 can more flexibly respond to adjustment needs in different directions, optimizing the layout of adjustment directions. This layout not only improves the adjustment accuracy of the leveling mechanism 11 in the horizontal plane but also enhances its adaptability under complex working conditions, ensuring the efficiency and accuracy of the leveling operation.

[0192] In one possible implementation, the leveling mechanism 11 is used to connect the mechanism to be leveled, which has a symmetrical structure and a symmetrical axis, with a third direction coinciding with the symmetrical axis.

[0193] In this embodiment, the leveling mechanism 11 is designed to connect a leveling mechanism with a symmetrical structure (such as...). Figure 1 The leveling mechanism 11 has a symmetrical axis. The locking elements 115 in the leveling mechanism 11 are distributed in the third direction and coincide with the symmetrical axis of the leveling mechanism. This design allows the locking elements 115 to specifically suppress displacement or deformation caused by the load in the third direction (i.e., the main force direction of the leveling mechanism), thereby ensuring the stability of the connection between the leveling mechanism 11 and the leveling mechanism.

[0194] Meanwhile, the locking element 115 in the fourth direction forms an orthogonal constraint with the third direction. This orthogonal constraint effectively limits the mechanism offset caused by lateral forces or torques, avoiding a decrease in leveling accuracy due to asymmetrical loads. Through this design, the leveling mechanism 11 can not only adapt to the symmetrical structure of the mechanism to be leveled, but also maintain high-precision leveling performance under complex load conditions, ensuring the stability and reliability of the entire system.

[0195] The leveling mechanism can be a bearing mechanism 12, and the structure of the bearing mechanism 12 can be a fixed ring 121.

[0196] In some cases, such as Figure 4As shown, there are four locking elements 115. Two locking elements 115 are distributed in the third direction, and two locking elements 115 are distributed in the fourth direction. The line connecting the two locking elements 115 in the third direction is perpendicular to the line connecting the two locking elements 115 in the fourth direction.

[0197] In one possible implementation, each through hole 116 is a countersunk spherical hole, and the surface of each locking member 115 that engages with the countersunk spherical hole is a spherical surface; or, a spherical gasket 118 is provided between each locking member 115 and the corresponding through hole 116, and the surface of the spherical gasket 118 that engages with the countersunk spherical hole is a spherical surface.

[0198] A countersunk spherical hole is a special structure provided on the ball cup 111 or ball head 112 to accommodate the locking member 115 or the spherical washer 118, thereby achieving relative positional constraint between the ball cup 111 and the ball head 112. The countersunk spherical hole typically consists of two parts: a cylindrical through-hole portion and a spherical countersunk portion. The through-hole portion accommodates the main body of the locking member 115, while the countersunk portion accommodates the head of the locking member 115 or the spherical washer 118 or other types of washer, ensuring its surface is flush with the outer surface of the ball cup 111 or ball head 112. The position of the countersunk spherical hole depends on the relative movement requirements of the ball cup 111 and ball head 112 and the locking requirements. Typically, the countersunk spherical holes are distributed on the outer surface of the ball cup 111 or ball head 112 and correspond to the position of the fixing hole 117, ensuring that the locking member 115 can accurately pass through the countersunk spherical hole and be coaxially locked with the fixing hole 117. The size of the countersunk spherical hole is determined by the inner diameter of its through-hole portion and the spherical radius of the countersunk portion. The inner diameter of the through-hole portion is slightly larger than the outer diameter of the locking member 115 to ensure an appropriate fitting clearance between them; the spherical radius of the countersunk portion is determined according to the size of the head of the locking member 115 or the spherical washer 118, and is usually sufficient to accommodate the head of the locking member 115 or the spherical washer 118. The number and distribution of the countersunk spherical holes depend on the design requirements of the leveling mechanism 11. In one possible implementation, one or more countersunk spherical holes can be provided to meet different locking requirements. Multiple countersunk spherical holes can be evenly distributed or non-uniformly distributed according to specific mechanical requirements to achieve optimal locking effect and structural stability. The connection between the countersunk spherical hole and the ball cup 111 or the ball head 112 is formed directly on the outer surface of the ball cup 111 or the ball head 112 through a machining process. Together with the locking element 115 and the fixing hole 117, it forms the locking system of the leveling mechanism 11. The locking element 115 passes through the countersunk spherical hole and is coaxially locked with the fixing hole 117, thereby achieving relative position constraint of the ball cup 111 and the ball head 112 in the second direction.

[0199] A spherical washer 118 is a component used to provide cushioning and adjustment between the locking member 115 and the countersunk spherical bore. The spherical washer 118 is typically a thin sheet structure with one flat side and one spherical side. The spherical portion is designed to fit tightly with the spherical portion of the countersunk spherical bore, ensuring that the head of the locking member 115 is flush with the outer surface of the ball cup 111 or ball head 112. The position of the spherical washer 118 depends on the position of the countersunk spherical bore. Typically, the spherical washer 118 is placed between the locking member 115 and the countersunk spherical bore, ensuring that the head of the locking member 115 is flush with the outer surface of the ball cup 111 or ball head 112. The size of the spherical washer 118 is determined by the diameter of its flat portion and the radius of its spherical portion. The diameter of the flat portion is slightly larger than the diameter of the head of the locking member 115 to ensure an appropriate fit clearance; the radius of the spherical portion matches the radius of the countersunk spherical bore to ensure a tight fit.

[0200] The number and distribution of the spherical shims 118 depend on the design requirements of the leveling mechanism 11. In one possible implementation, one or more spherical shims 118 can be provided to meet different locking requirements. Multiple spherical shims 118 can be evenly distributed or non-uniformly distributed according to specific mechanical requirements to achieve optimal locking effect and structural stability. The spherical shims 118 are typically made of metal materials (such as stainless steel, aluminum alloy, etc.) or engineering plastics; the specific material selection depends on the working environment and mechanical performance requirements of the leveling mechanism 11. The spherical shims 118, placed between the locking member 115 and the countersunk spherical hole, together with the locking member 115 and the countersunk spherical hole, constitute the locking system of the leveling mechanism 11. The relative position constraint of the ball cup 111 and the ball head 112 in the second direction is achieved by the locking member 115 passing through the countersunk spherical hole and coaxially locking with the fixing hole 117.

[0201] In the leveling mechanism 11, a spherical washer 118 may be provided between the locking member 115 and the corresponding through hole 116. The main purpose of this design is to provide cushioning and adjustment functions, ensuring that the head of the locking member 115 is flush with the outer surface of the ball cup 111 or the ball head 112. Specifically, the spherical washer 118 is placed between the locking member 115 and the countersunk spherical hole, and its spherical part fits tightly with the spherical part of the countersunk spherical hole, ensuring that the head of the locking member 115 is flush with the outer surface of the ball cup 111 or the ball head 112. This design not only improves the accuracy and reliability of locking, but also reduces stress concentration through the cushioning function, thereby improving the structural strength and durability of the leveling mechanism 11.

[0202] In the leveling mechanism 11, the surface of the locking member 115 that mates with the countersunk spherical hole is spherical. The main purpose of this design is to provide better contact and fit, ensuring that the head of the locking member 115 is flush with the outer surface of the ball cup 111 or the ball head 112. Specifically, the head of the locking member 115 is designed to be spherical, and its spherical portion fits tightly with the spherical portion of the countersunk spherical hole, ensuring that the head of the locking member 115 is flush with the outer surface of the ball cup 111 or the ball head 112. This design not only improves the accuracy and reliability of locking, but also reduces stress concentration through a buffering function, thereby improving the structural strength and durability of the leveling mechanism 11.

[0203] In the leveling mechanism 11, the surface of the spherical washer 118 that mates with the countersunk spherical hole is spherical. The main purpose of this design is to provide better contact and fit, ensuring that the head of the locking member 115 is flush with the outer surface of the ball cup 111 or the ball head 112. Specifically, the spherical portion of the spherical washer 118 fits tightly with the spherical portion of the countersunk spherical hole, ensuring that the head of the locking member 115 is flush with the outer surface of the ball cup 111 or the ball head 112. This design not only improves the accuracy and reliability of locking, but also reduces stress concentration through a buffering function, thereby improving the structural strength and durability of the leveling mechanism 11.

[0204] Through this spherical contact design, the leveling mechanism 11 maintains higher stability and reliability during the locking process. The spherical contact not only improves force transmission efficiency but also reduces errors that may be introduced by uneven preload, thus ensuring high precision and stability of the leveling mechanism under various operating conditions. This design is particularly suitable for applications requiring high-precision leveling and stability, such as semiconductor manufacturing equipment.

[0205] In one possible implementation, a second gap d2 exists between the ball head 112 and the ball bowl 111 in a second direction.

[0206] It is understood that the second gap d2 refers to the fitting gap between the ball head 112 and the ball cup 111 in the second direction (perpendicular to the leveling plane). The main purpose of this gap design is to provide a certain degree of freedom for the relative movement between the ball head 112 and the ball cup 111 in the vertical direction, while ensuring the stability and reliability of both. The size of the second gap d2 is usually determined according to the specific design requirements and working environment of the leveling mechanism 11. Generally, the size of the second gap d2 ranges from 0.01mm to 0.1mm. For example, for high-precision semiconductor manufacturing equipment, the second gap d2 can be designed to be 0.02mm to ensure that there is sufficient degree of freedom between the ball head 112 and the ball cup 111 to adapt to small load changes while performing high-precision leveling. The design of the second gap d2 has motion compensation and stress buffering functions. Regarding the motion compensation function, it allows the ball head 112 to make small up-and-down movements within the ball cup 111 along the second direction, thereby adapting to different working conditions and load changes. This design can reduce stress concentration caused by uneven load or mechanical vibration, and improve the stability and reliability of the leveling mechanism 11. Regarding the stress buffering function, by providing a certain degree of freedom, the second gap d2 can effectively disperse stress, reducing local stress concentration caused by load changes or mechanical vibrations, thereby extending the service life of the leveling mechanism 11. Through a reasonable design of the second gap d2, the leveling mechanism 11 can provide necessary motion compensation and stress buffering in the vertical direction, thereby improving its stability and reliability under complex working conditions. This design not only ensures the high-precision leveling function of the leveling mechanism 11, but also improves its structural strength and durability through a reasonable gap design and stress dispersion mechanism.

[0207] In this embodiment, a second gap d2 is designed between the ball head 112 and the ball cup 111 in the second direction (i.e., the vertical direction). The key to this design is to provide the necessary space allowance for the relative movement between the ball head 112 and the ball cup 111. Specifically, the existence of the second gap d2 ensures that the ball head 112 and the ball cup 111 can be flexibly adjusted in position during the initial leveling process, without jamming due to machining errors or assembly errors.

[0208] This design not only improves the flexibility of the leveling mechanism 11 in the initial leveling stage but also provides sufficient space for subsequent fine adjustments. By setting a second gap d2 between the ball head 112 and the ball cup 111, the leveling mechanism 11 can better adapt to various processing and assembly conditions, ensuring high-precision leveling in practical applications. This design optimizes the overall performance of the leveling mechanism 11, making it exhibit higher reliability and adaptability in complex leveling tasks.

[0209] In one possible implementation, the ball head 112 is a cut-out structure, and a second gap d2 is formed between the cut-out structure and the ball cup 111.

[0210] Alternatively, the surface of the ball head 112 is provided with a groove 119, which forms a second gap d2 with the inner wall of the ball cup 111;

[0211] Or / and, the inner wall of the ball cup 111 is provided with a groove 119, which forms a second gap d2 between the groove 119 and the surface of the ball head 112.

[0212] In this embodiment, in order to further optimize the relative motion performance between the ball head 112 and the ball cup 111, various structures are designed to form the second gap d2. Specifically, there are the following implementation methods.

[0213] In one embodiment, the ball head 112 is designed as a sectional structure, which, through partial material removal, creates a second gap d2 between the sectional structure and the ball cup 111. This design reduces the contact area between the ball head 112 and the ball cup 111, thereby reducing frictional resistance and improving the flexibility and response speed of the leveling mechanism 11 during the leveling process.

[0214] One implementation involves providing a groove 119 on the surface of the ball head 112, which forms a second gap d2 with the inner wall of the ball cup 111. This design also reduces frictional resistance by decreasing the contact area, while providing the necessary space for relative movement between the ball head 112 and the ball cup 111, ensuring smooth leveling operations.

[0215] One implementation involves providing a groove 119 on the inner wall of the ball cup 111, which forms a second gap d2 with the surface of the ball head 112. This design not only reduces the contact area but also optimizes the relative movement between the ball head 112 and the ball cup 111 through the structural characteristics of the groove 119, thereby improving the overall performance of the leveling mechanism 11.

[0216] By incorporating a slit or groove structure between the ball head 112 and the ball cup 111, the leveling mechanism 11 achieves more efficient leveling operations while reducing wear caused by frictional resistance and extending the service life of the equipment. This design not only improves the flexibility of the leveling mechanism 11 but also ensures its stability and reliability in high-precision leveling tasks.

[0217] In one possible implementation, the ball head 112 is a sectional structure, and the sectional height of the sectional structure is not greater than 1 / 3 of the depth of the ball bowl 111.

[0218] In this embodiment, the ball head 112 is designed as a sectional structure, and its sectional height is strictly limited to ensure that it does not exceed 1 / 3 of the depth of the ball bowl 111. The key to this design is to balance the requirements of adjustment flexibility and structural strength.

[0219] By limiting the cutting height, the ball head 112 can retain more than 70% of its original contact area. This design not only ensures sufficient contact area between the ball head 112 and the ball cup 111 to transfer the necessary load, thereby maintaining the strength and stability of the structure, but also provides sufficient space for the deflection movement of the ball head 112, enhancing the flexibility of adjustment. This balanced design enables the leveling mechanism 11 to achieve more precise control in high-precision leveling operations, while maintaining the reliability and durability of the structure.

[0220] Furthermore, retaining most of the original contact area helps reduce structural damage caused by localized stress concentration, further improving the service life and reliability of the leveling mechanism 11. Through this optimized design, the leveling mechanism 11 can exhibit higher performance and adaptability in complex leveling tasks, meeting the requirements for high-precision and high-stability leveling.

[0221] In one possible implementation, the surface roughness of the ball head 112 or the ball cup 111 is between Ra1um and Ra2um.

[0222] In this embodiment, the key to this design is to optimize the frictional characteristics between the ball head 112 and the ball cup 111 in order to achieve high-performance operation of the leveling mechanism 11.

[0223] Specifically, when the surface roughness of the ball head 112 or the ball cup 111 is between Ra1µm and Ra2µm, the coefficient of friction between the ball head 112 and the ball cup 111 can be maintained between 0.15 and 0.35. This range of coefficients of friction not only ensures the smoothness of movement between the ball head 112 and the ball cup 111, but also takes into account the wear life of the leveling mechanism 11. By precisely controlling the surface roughness, the leveling mechanism 11 can achieve more stable performance in high-precision leveling operations, while reducing wear caused by friction and extending the service life of the equipment.

[0224] This design optimizes the overall performance of the leveling mechanism 11, enabling it to exhibit higher reliability and adaptability in complex leveling tasks, and meeting the requirements for high-precision and high-stability leveling.

[0225] In one possible implementation, the height h1 of the ball head 112 is greater than the depth h2 of the ball bowl 111.

[0226] In this embodiment, the key to this design is to optimize the relative motion between the ball head 112 and the ball bowl 111 to improve the smoothness of the motion.

[0227] Specifically, when the height of the ball head 112 is greater than the depth of the ball cup 111, the sides of the ball head 112 will not contact the sides of the ball cup 111. This design avoids friction and jamming caused by contact, thereby significantly improving the smoothness of movement between the ball head 112 and the ball cup 111. In this way, the leveling mechanism 11 can be more flexible and stable when performing high-precision leveling operations, reducing errors and wear caused by friction.

[0228] This design not only improves the performance of the leveling mechanism 11, but also extends its service life, ensuring that the leveling function can maintain high precision and high stability under complex working conditions.

[0229] In one possible implementation, the contact height between the ball head 112 and the ball cup 111 is between 1 / 2 and 3 / 4 of the depth of the ball cup 111.

[0230] The contact height between the ball head 112 and the ball bowl 111 refers to the vertical height of the contact portion between the ball head 112 and the ball bowl 111. This height is measured from the bottom of the ball bowl 111 and extends upwards to the highest point of contact between the ball head 112 and the ball bowl 111. Specifically, the contact height refers to the vertical distance of the contact area of ​​the ball head 112 within the ball bowl 111, and this distance is within the depth range of the ball bowl 111.

[0231] In this embodiment, the key to this design is to optimize the contact area between the ball head 112 and the ball cup 111 in order to improve the load-bearing capacity and structural stability of the leveling mechanism 11.

[0232] Understandably, when the contact height is less than half the depth, the reduced contact area leads to increased local pressure, while exceeding three-quarters of the depth restricts axial rotation angle. Therefore, by setting the contact height between half and three-quarters of the depth of the ball cup 111, sufficient contact area can be maintained between the ball head 112 and the ball cup 111. This design not only ensures the stability of the leveling mechanism 11 under load but also effectively prevents local stress concentration. Local stress concentration can lead to structural deformation or damage, but by optimizing the contact height, the leveling mechanism 11 can evenly distribute the load, reducing problems caused by stress concentration.

[0233] This design not only improves the load-bearing capacity of the leveling mechanism 11, but also enhances its reliability and durability under complex working conditions. In this way, the leveling mechanism 11 can exhibit higher performance in high-precision leveling tasks while maintaining structural stability and reliability.

[0234] Example 2

[0235] Secondly, this application provides a lifting device 1, including the above-mentioned leveling mechanism 11, bearing mechanism 12 and lifting mechanism 13. The leveling mechanism 11 is disposed between the bearing mechanism 12 and the lifting mechanism 13. The leveling mechanism 11 is used to adjust the levelness of the bearing mechanism 12, and the lifting mechanism 13 is used to control the lifting of the bearing mechanism 12.

[0236] In this embodiment, this application provides a lifting device 1, the core components of which include a leveling mechanism 11, a supporting mechanism 12, and a lifting mechanism 13. The leveling mechanism 11 is disposed between the supporting mechanism 12 and the lifting mechanism 13. This layout not only ensures the independence of the leveling function, but also achieves seamless coordination between the leveling action and the lifting action.

[0237] Specifically, the leveling mechanism 11 is responsible for adjusting the levelness of the bearing mechanism 12, ensuring that the bearing mechanism 12 remains stable and level during the lifting and lowering process. The bearing mechanism 12 can be regarded as the leveling mechanism described above (e.g., Figure 4 The fixed ring 121 and lifting pin 122 in the middle have a symmetrical structure and axis of symmetry that match the design of the leveling mechanism 11. The lifting mechanism 13 is responsible for controlling the lifting action of the bearing mechanism 12, and by precisely controlling the lifting process, it ensures the stability of the entire device during operation.

[0238] The key to this design lies in the coordinated operation of the leveling mechanism 11 and the lifting mechanism 13, enabling the lifting device 1 to maintain high-precision leveling during lifting operations. By placing the leveling mechanism 11 between the load-bearing mechanism 12 and the lifting mechanism 13, the lifting device 1 can operate more efficiently in complex environments while maintaining high-precision and high-stability leveling functions. This arrangement not only ensures the independence of the leveling function but also achieves seamless coordination with the lifting action, significantly improving the stability of the lifting mechanism 13 during the lifting process. This design is particularly suitable for scenarios requiring high-precision leveling and stable lifting, such as semiconductor manufacturing equipment, effectively reducing errors and vibrations caused by uncoordinated leveling and lifting actions, thereby significantly improving the performance and reliability of the entire lifting device 1.

[0239] In one possible implementation, the ball cup 111 is integrally formed with one of the supporting mechanism 12 and the lifting mechanism 13, and the ball head 112 is integrally formed with the other of the supporting mechanism 12 and the lifting mechanism 13; or, the ball cup 111 is integrally formed with one of the supporting mechanism 12 and the lifting mechanism 13, and the ball head 112 is fixedly connected to the other of the supporting mechanism 12 and the lifting mechanism 13; or, the ball cup 111 is fixedly connected with one of the supporting mechanism 12 and the lifting mechanism 13, and the ball head 112 is integrally formed with the other of the supporting mechanism 12 and the lifting mechanism 13; or, the ball cup 111 is fixedly connected with one of the supporting mechanism 12 and the lifting mechanism 13, and the ball head 112 is fixedly connected to the other of the supporting mechanism 12 and the lifting mechanism 13.

[0240] In this embodiment, the structural design of the lifting device 1 provides multiple connection methods to adapt to different application scenarios and needs. Specifically, the ball cup 111 and the ball head 112 can be integrally formed or fixedly connected to one or both of the supporting mechanism 12 and the lifting mechanism 13. Specifically, there are the following implementation methods.

[0241] One implementation is that the ball cup 111 is integrally formed with one of the supporting mechanism 12 or the lifting mechanism 13, and the ball head 112 is integrally formed with the other: this design reduces assembly steps, improves overall rigidity, and ensures the stability and reliability of the structure.

[0242] One implementation is that the ball cup 111 is integrally formed with one of the supporting mechanism 12 or the lifting mechanism 13, and the ball head 112 is fixedly connected to the other: this design combines the rigidity advantage of integral forming with the flexibility of fixed connection, which facilitates quick repair or replacement when needed.

[0243] One implementation is that the ball cup 111 is fixedly connected to either the support mechanism 12 or the lifting mechanism 13, and the ball head 112 is integrally formed with the other: this design also combines the advantages of fixed connection and integral forming, providing structural stability and ease of maintenance.

[0244] One implementation is that the ball cup 111 is fixedly connected to either the support mechanism 12 or the lifting mechanism 13, and the ball head 112 is fixedly connected to the other: this design provides maximum flexibility, facilitates quick replacement and maintenance, and also maintains structural stability.

[0245] The unibody design reduces assembly steps and increases overall rigidity, which is especially important for applications requiring high precision and stability. The modular connection design facilitates quick replacement and maintenance, improving equipment maintenance efficiency and lifespan. This flexible connection method allows the lifting device 1 to adapt to different working conditions and needs, ensuring efficient and stable operation in various complex application scenarios.

[0246] In some cases, such as Figure 3 As shown, the ball cup 111 is integrally formed with the lifting mechanism 13, and the ball head 112 is integrally formed with the bearing mechanism 12.

[0247] Example 3

[0248] Please refer to Figure 6 , Figure 6 A schematic diagram of a semiconductor device provided in an embodiment of this application.

[0249] Thirdly, this application provides a semiconductor device 100, including the lifting device 1 described in the above embodiments. When the semiconductor device 100 is a physical deposition device or a chemical deposition device, the lifting device 1 is disposed within the reaction chamber of the semiconductor device 100. When a wafer in the reaction chamber needs to be removed from the semiconductor device 100, the lifting device 1 lifts the wafer for removal by other equipment. When the semiconductor device 100 is a wafer transfer device, the lifting device 1 is connected to a robotic arm in the semiconductor device 100 to achieve vertical position adjustment of the wafer between different workstations or equipment.

[0250] The key to this design lies in the coordinated action of the leveling device and the lifting mechanism, ensuring that the support mechanism 12 remains horizontally stable throughout the lifting process. Specifically, the leveling mechanism 11 adjusts the levelness of the support mechanism 12, while the lifting mechanism 13 controls its lifting motion. This coordinated action ensures the stability of the support mechanism 12 during lifting, preventing wafer shifting or slippage due to tilting, and significantly improving the operational stability of the semiconductor equipment 100. By ensuring the horizontal stability of the support mechanism 12 during lifting, the risk of wafer damage or process failure due to mechanical vibration or tilting can be effectively reduced. This is particularly important for semiconductor manufacturing processes that require high precision and stability, significantly improving production efficiency and product quality.

[0251] The above-described preferred embodiments have further detailed the purpose, technical solution, and advantages of this utility model. It should be understood that the above description is only a preferred embodiment of this utility model and is not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

[0252] It should be noted that many of the components mentioned in this application are general standard parts or components known to those skilled in the art, and their structure and principle can be learned by those skilled in the art through technical manuals or through conventional experimental methods.

[0253] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0254] The leveling mechanism, lifting device, and semiconductor equipment provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A levelling mechanism characterised in that, include: A ball cup and a ball head, one of which is rotatably adjustable relative to the other, one of which is provided with a limiting pin, and the other of which is provided with a limiting hole adapted to the limiting pin. The limiting pin and the limiting hole cooperate to restrict relative rotation of the ball cup and the ball head in a first direction.

2. Levelling mechanism according to claim 1, characterized in that The limiting pin is disposed at the bottom of one of the ball cup and the ball head, and the limiting hole is disposed at the bottom of the other of the ball cup and the ball head.

3. Levelling mechanism according to claim 1 or 2, characterized in that The limiting pin and the limiting hole are symmetrical about the central axis of the ball cup or the ball head.

4. Levelling mechanism according to any one of claims 1 to 3, characterized in that The cross-sectional profile of the limiting pin along the second direction includes at least one straight edge segment.

5. Levelling mechanism according to any one of claims 1 to 4, characterized in that The cross-sectional shape of the limiting pin in the second direction is non-circular.

6. Levelling mechanism according to any one of claims 1 to 5, characterized in that The cross-sectional dimension of the limiting hole gradually increases along the second direction, which is perpendicular to the plane containing the first direction.

7. Levelling mechanism according to any of claims 1 to 6, characterized in that The limiting pin and the limiting hole have a first gap d1 in the first direction, and the first gap d1 is used to provide spatial compensation for the deflection movement between the ball head and the ball cup.

8. Levelling mechanism according to any one of claims 1 to 7, characterized in that The leveling mechanism further includes at least one locking element. One of the ball cup and the ball head is provided with at least one through hole, and the other of the ball cup and the ball head is provided with at least one fixing hole. The at least one locking element, the at least one through hole, and the at least one fixing hole correspond one-to-one. By passing each of the locking elements through the corresponding through hole and coaxially locking them with the corresponding fixing hole, the relative position of the ball cup and the ball head in the second direction is constrained.

9. Levelling mechanism according to claim 8, characterized in that The at least one locking element is a plurality of elements, and each locking element is distributed at least in a third direction and a fourth direction, wherein the fourth direction is perpendicular to the third direction.

10. Levelling mechanism according to claim 9, characterized in that The leveling mechanism is used to connect the mechanism to be leveled. The mechanism to be leveled has a symmetrical structure and a symmetrical axis. The third direction coincides with the symmetrical axis.

11. Levelling mechanism according to any of claims 1 to 10, characterized in that There is a second gap d2 between the ball head and the ball cup in the second direction.

12. The leveling mechanism of claim 11, wherein, The ball head is a sectional structure, and the sectional structure forms the second gap d2 between the ball cup; Alternatively, the surface of the ball head is provided with a groove, and the groove and the inner wall of the ball bowl form a second gap d2; Or / and, the inner wall of the ball cup is provided with a groove, which forms a second gap d2 between the groove and the surface of the ball head.

13. Levelling mechanism according to any of claims 1 to 12, characterized in that The contact height between the ball head and the bowl is between 1 / 2 and 3 / 4 of the depth of the bowl.

14. A lifting device, characterized in that include: The leveling mechanism, the bearing mechanism, and the lifting mechanism as described in any one of claims 1 to 13, wherein the leveling mechanism is disposed between the bearing mechanism and the lifting mechanism, the leveling mechanism is used to adjust the levelness of the bearing mechanism, and the lifting mechanism is used to control the lifting of the bearing mechanism.

15. A semiconductor device, characterized by comprising: include: The lifting device as described in claim 14.

Images