一种用于承载晶圆的装置

Abstract

本实用新型提供了一种用于承载晶圆的装置，该装置可以包括：基座，具有多个引导槽，所述多个引导槽从所述基座的中心点沿径向方向延伸；多个支撑件，相应地设置于所述多个引导槽中，用于共同支撑所述晶圆并限定承载半径；多个弧形导轨，构造成当所述基座和所述多个弧形导轨进行相对于彼此绕通过所述中心点的轴线的转动时，引导所述多个支撑件在所述多个引导槽中移动，以调节所述承载半径；驱动器，用于对所述基座和 / 或所述多个弧形导轨进行驱动以产生所述转动。

Claims

1. An apparatus for carrying a wafer, characterized by, include: The base has a plurality of guide grooves that extend radially from the center point of the base. Multiple support members are correspondingly disposed in the multiple guide slots to jointly support the wafer and define the bearing radius; Multiple arc-shaped guide rails are configured to guide the multiple supports to move in the multiple guide grooves to adjust the load-bearing radius when the base and the multiple arc-shaped guide rails rotate relative to each other about an axis passing through the center point; A driver is used to drive the base and / or the plurality of arc-shaped guide rails to generate the rotation.

2. The apparatus for carrying a wafer of claim 1, wherein, The device also includes a planetary gear set for transmitting power from the drive to the base and / or the plurality of arc-shaped guide rails.

3. The apparatus for carrying wafers according to claim 2, wherein, The sun gear of the planetary gear set is directly driven by the driver, and the internal gear ring of the planetary gear set is fixed to the base.

4. The apparatus for carrying a wafer according to any one of claims 1 to 3, characterized in that, Each support has an electrostatic adsorption structure on its top for adsorbing the wafer.

5. The apparatus for carrying a wafer according to any one of claims 1 to 3, wherein, The surface of the guide groove that contacts the support member is coated with a silicon nitride ceramic coating.

6. The apparatus for carrying a wafer according to any one of claims 1 to 3, wherein, The driver is a stepper motor.

7. The apparatus for carrying wafers of claim 1, wherein, The device further includes a closed-loop control system, which includes: A position sensor is configured to measure the position information of the plurality of support members; A controller, electrically connected to the driver and the position sensor, is configured to control the driver based on the position information fed back by the position sensor, so as to bring the plurality of supports to a target position.

8. The apparatus for carrying wafers according to claim 7, wherein, The position sensor is a laser interferometer.

9. The apparatus for carrying a wafer according to claim 7 or 8, characterized by, The device further includes a locking mechanism configured to lock the plurality of supports after the plurality of supports have reached the target position.

10. The apparatus for carrying wafers according to claim 9, wherein, The locking mechanism is a piezoelectric ceramic brake.

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