一种半导体引线框架和塑封料多功能抓取装置
By designing a multi-functional gripping device for semiconductor lead frames and molding compounds, a robotic arm and gripping components are used to simultaneously grip and stack multiple lead frames one by one, solving the problem of low gripping efficiency in traditional methods and improving production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FUJINSON (NANTONG) TECH LTD
- Filing Date
- 2025-07-16
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional semiconductor devices have various lead frame designs, which makes them inconvenient to grasp and inefficient.
Design a multi-functional gripping device for semiconductor lead frames and molding compounds, including a base plate, an injection molding detection component, a first gripping component, and a second gripping component. The device utilizes a robotic arm to simultaneously grip and stack multiple lead frames one by one, and uses a drive cylinder and limit sensors to precisely position and control the gripping action.
This technology improves the molding and transportation efficiency of semiconductor lead frames, enabling the simultaneous grasping and stacking of multiple lead frames, avoiding the waiting process for placement, and improving overall production efficiency.
Smart Images
Figure CN224521616U_ABST
Abstract
Claims
1. A multifunctional grabbing device for semiconductor lead frame and plastic encapsulation material, characterized in that, The utility model relates to a kind of injection detection assembly and the injection detection assembly is used for the detection of lead frame. The injection detection assembly includes support frame fixedly connected to the seat plate and position detection column in the support frame, the seat plate is provided with through hole corresponding to through groove in the bottom of the pedestal of support frame, the upper end of the position detection column is fixedly connected to the top of the support frame, and the lower end of the position detection column extends out of the lower surface of the seat plate through the through groove and the through hole, and the periphery of the through hole is provided with a plurality of vertical positioning columns.
2. The semiconductor lead frame and plastic encapsulation multifunctional grabbing device according to claim 1, wherein, The bottom of the seat plate is provided with first side frame plate on both sides of the support frame, the middle bottom of the first side frame plate is provided with side plate, and the front and rear sides of the seat plate are provided with a plurality of linearly arranged first limit sensors vertically arranged.
3. The semiconductor lead frame and plastic encapsulation multifunctional grabbing device according to claim 2, wherein, The first grabbing component includes two groups of first shaft rods arranged in parallel and penetrating the first side frame plate, and the first shaft rods on both sides are connected in the middle of the seat plate.
4. The semiconductor lead frame and plastic encapsulation multifunctional grabbing device according to claim 3, wherein, The driving component includes a plurality of first driving cylinders arranged in the middle of the seat plate and first L-shaped connecting rods fixedly connected to the first shaft rods, and the top of the telescopic rod of the first driving cylinder is connected with pressing rod.
5. The semiconductor lead frame and plastic encapsulation multifunctional grabbing device according to claim 4, wherein, The bottom of the moving plate is provided with second side frame plate on both sides, and a plurality of linearly arranged second limit sensors are vertically arranged on the front and rear sides of the moving plate.
6. The semiconductor lead frame and plastic encapsulation multifunctional gripping device according to claim 1, wherein, The second grabbing component includes two groups of second shaft rods arranged in parallel and penetrating the second side frame plate, and the second shaft rods on both sides are connected in the middle of the seat plate.
7. The semiconductor lead frame and plastic encapsulation multifunctional grabbing device according to claim 6, wherein, The second shaft rod is provided with a plurality of second fixed blocks in the second shaft rod, the second fixed block is provided with second transverse rod perpendicular to the second shaft rod and the second limit sensor in the second fixed block, the other end of the second transverse rod is vertically connected with second hook rod, and the outer side of the bottom of the second hook rod is provided with hook part. The second shaft rod is provided with second spring column in the middle bottom of the second shaft rod, and the second spring column is connected by second spring.
8. The semiconductor lead frame and plastic encapsulation multifunctional grabbing device according to claim 7, wherein, The second shaft rod is connected with a second L-shaped connecting rod; a pressing strip is connected to the top of the telescopic rod of the upper end of the second driving cylinder; and the upper end of the second L-shaped connecting rod is provided with a second guide wheel located below the pressing strip.