一种可组合式硅片退火承托装置
The design of the combined silicon wafer annealing support device solves the problem of silicon wafer damage during the removal and placement process, and achieves efficient use of equipment space and convenient operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN JIAWEIYI TECH CO LTD
- Filing Date
- 2025-07-24
- Publication Date
- 2026-07-17
AI Technical Summary
Existing silicon wafer annealing support devices are prone to damaging silicon wafers during the removal and placement process, and the equipment has low space utilization efficiency.
A modular silicon wafer annealing support device is designed, comprising a top ring cover, a bowl, and a base. The device is connected by a combination of anchoring slots, anchoring hooks, and elastic top posts to achieve custom adjustment and stable protection of the silicon wafer.
It improves the protection of silicon wafers in tempering equipment, reduces the breakage rate, and enhances the space utilization efficiency and ease of operation of the equipment.
Smart Images
Figure CN224521618U_ABST
Abstract
Claims
1. A modular silicon wafer annealing support apparatus comprising a top ring cover (100), a bowl (200) and a base plate (300), characterized in that: The top ring cover (100) is anchored to the upper edge of the bowl (200), the lower end of the bowl (200) is anchored to the outer edge of the base plate (300), and a bearing plate (400) is stacked inside the bowl (200). The inner wall of the bowl (200) is integrally formed with circumferentially distributed limiting bearing protrusions (203). The upper edge of the bowl (200) is provided with a connecting anchoring groove (202). The upper edge of the bowl (200) is fitted with circumferentially distributed medium elastic top posts (204). The connecting anchoring grooves (202) and the medium elastic top posts (204) are arranged alternately. The lower edge of the bowl (200) is integrally formed with a connecting anchoring hook (201). The limiting bearing protrusions (203) cooperate with the bearing plate (400).
2. The modular silicon wafer anneal support apparatus of claim 1, wherein: The top ring cover (100) has a central disc (102) at its center, and the two are integrally formed by connecting beams. The lower surface of the top ring cover (100) is integrally formed with circumferentially distributed upper anchoring hooks (101). The upper anchoring hooks (101) cooperate with the connecting anchoring grooves (202). The intermediate elastic top column (204) cooperates with the top ring cover (100).
3. The modular silicon wafer support of claim 1 wherein: The upper surface of the chassis (300) is provided with a circumferentially distributed combination anchoring slot (301) on the outer ring. The upper surface of the chassis (300) is fitted with a bottom elastic top post (302). The combination anchoring slot (301) and the bottom elastic top post (302) are arranged alternately. The combination anchoring slot (301) cooperates with the connecting anchoring hook (201). The bottom elastic top post (302) cooperates with the lower edge of the bowl (200).
4. The modular silicon wafer support of claim 1 wherein: The outer periphery of the bearing plate (400) is provided with a notch (402), and the upper surface of the bearing plate (400) is integrally formed with a circumferentially distributed operating bearing frame (401). The bearing plate (400) is provided with circumferentially distributed load-reducing holes (403), and the load-reducing holes (403) and the operating bearing frame (401) are arranged alternately.
5. The modular silicon wafer support apparatus of claim 4 wherein: The limiting bearing protrusion (203) is divided into two groups, upper and lower, and both are circumferentially distributed. The limiting bearing protrusion (203) cooperates with the notch groove (402) and its adjacent disk edge.