一种半导体设备
By using a first unidirectional filter and a second unidirectional filter in semiconductor equipment to filter contaminants during the exhaust process, the problem of contaminants being blown onto the wafer during vacuum breaking is solved, thus improving the cleanliness of the equipment and production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- UNITED NOVA TECH - XIANFENG (SHAOXING) CORP
- Filing Date
- 2025-06-13
- Publication Date
- 2026-07-17
AI Technical Summary
When existing semiconductor equipment breaks the vacuum, contaminants sucked into the vacuum line can easily be blown out onto the back of the wafer carried by the equipment, causing wafer contamination.
A combination of a first unidirectional filter and a second unidirectional filter is used to filter contaminants during the extraction and exhaust processes, respectively, to prevent them from being blown onto the wafer.
This effectively prevents contaminants sucked in during vacuuming from being blown back onto the wafer when the vacuum is broken, reducing wafer contamination and improving equipment cleanliness and production efficiency.
Smart Images
Figure CN224521624U_ABST
Abstract
Claims
1. A semiconductor device, characterized by comprising: include: A support platform having a support surface, and a first air passage being provided in the support platform, with the first end of the first air passage located on the support surface; A first one-way filter element, wherein a first end of the first one-way filter element is connected to a second end of the first air passage, the first one-way filter element is configured to allow airflow only from the first end of the first one-way filter element to the second end of the first one-way filter element, and is configured to filter the airflow entering the first one-way filter element; A second one-way filter element, wherein a first end of the second one-way filter element is connected to a second end of the first air passage, the second one-way filter element is configured to allow airflow only from the second end of the second one-way filter element to the first end of the second one-way filter element, and is configured to filter the airflow entering the second one-way filter element; The exhaust device is connected to the second end of the first unidirectional filter and the second end of the second unidirectional filter.
2. The semiconductor device according to claim 1, characterized in that, The first one-way filter element includes a first one-way valve and a first filter connected in series; and / or, The second one-way filter element includes a second one-way valve and a second filter arranged in series.
3. The semiconductor device according to claim 1, characterized in that, The first one-way filter element is a one-way filter valve; and / or, The second one-way filter element is a one-way filter valve.
4. The semiconductor device according to claim 1, characterized in that, The semiconductor device also includes a lifting device that surrounds the support platform circumferentially.
5. The semiconductor device according to claim 4, characterized in that, There is a gap between the lifting device and the circumferential side of the support platform; The support platform also includes a second air passage, the first end of which is located on the circumferential side of the support platform; The semiconductor device further includes a third unidirectional filter and / or a fourth unidirectional filter; The first end of the third one-way filter is connected to the second end of the second air passage, and the second end of the third one-way filter is connected to the exhaust device. The third one-way filter is configured to allow airflow only from the first end of the third one-way filter to the second end of the third one-way filter, and is configured to filter the airflow entering the third one-way filter. The first end of the fourth one-way filter is connected to the second end of the second air passage, and the second end of the fourth one-way filter is connected to the exhaust device. The fourth one-way filter is configured to allow airflow only from the second end of the fourth one-way filter to the first end of the fourth one-way filter, and is configured to filter the airflow entering the fourth one-way filter.
6. The semiconductor device according to claim 5, characterized in that, The third one-way filter element includes a third one-way valve and a third filter connected in series; and / or, The fourth one-way filter element includes a fourth one-way valve and a fourth filter arranged in series.
7. The semiconductor device according to claim 5, characterized in that, The third one-way filter element is a one-way filter valve; and / or, The fourth one-way filter element is a one-way filter valve.
8. The semiconductor device according to claim 1, characterized in that, The bearing surface is provided with at least one of diamond-like coating, nanocrystalline diamond coating, and tetrahedral amorphous carbon coating.
9. The semiconductor device according to claim 1, characterized in that, The semiconductor device also includes an ion fan, which is adjacent to the support platform and has its outlet facing the support surface.
10. The semiconductor device according to claim 9, characterized in that, The outlet of the ion fan is elongated or arc-shaped.