一种半导体设备取料抓手
By designing a ball-head structure, the nozzle of the semiconductor equipment's material handling gripper can adapt to both flat and curved sheets, solving the problem that existing equipment cannot pick up curved sheets and improving the equipment's applicability and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGDONG CHIPPACKING TECH CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-07-17
AI Technical Summary
The nozzles of existing semiconductor equipment grippers have fixed vertical openings that cannot effectively pick up materials that are bent or deformed upwards, resulting in poor applicability.
The material handling module with a ball head structure, through the design of the first connector, the ball head and the second connector, allows the nozzle to rotate around the center point of the ball head, adapting to flat and curved materials and realizing the angle adjustment of the nozzle.
The applicability of the material handling gripper has been improved, enabling it to effectively pick up flat and curved materials, thus enhancing the flexibility and stability of the equipment.
Smart Images
Figure CN224521625U_ABST
Abstract
Claims
1. A semiconductor device pick-up gripper for picking up a wafer, characterized in that It includes a base and at least one material handling component disposed on the base, the material handling component having at least two material handling modules spaced apart; The material handling module has a first connector, a ball head, a second connector, and a suction nozzle. The first connector is mounted on a base, the second connector is located below the first connector, and the upper end of the second connector is rotatably mounted on the first connector via the ball head. The second connector can rotate in any direction around the center point of the ball head, and the suction nozzle is mounted on the lower end of the second connector.
2. The semiconductor equipment retrieval gripper of claim 1, wherein, The first connector is slidably mounted on the base, and a return spring is provided between the base and the first connector, which ensures that the first connector always has a downward tendency.
3. The semiconductor device retrieval gripper of claim 2, wherein, The material handling module has a mounting base connected to the base. The mounting base is provided with a receiving groove. The first connecting member is movably disposed in the receiving groove. The return spring is a compression spring. The upper end of the compression spring abuts against the inner top wall of the receiving groove, and the lower end of the return spring abuts against the stop block on the first connecting member.
4. The semiconductor equipment retrieval gripper of any of claims 1-3, wherein, The first connector is provided with a first air passage, the ball head is provided with a second air passage, and the second connector is provided with a third air passage. The first air passage, the second air passage, the third air passage, and the nozzle are connected in sequence.
5. The semiconductor device retrieval gripper of claim 4, wherein, The ball head is stationary relative to the first connector. The upper end of the second connector is provided with a receiving cavity adapted to the ball head. The receiving cavity is connected to the third air passage. The ball head is rotatably disposed in the receiving cavity.
6. The semiconductor device retrieval gripper of claim 5, wherein, The lower end of the second airway has a funnel-shaped opening, the cross-section of which gradually increases from top to bottom.
7. The semiconductor device retrieval gripper of claim 4, wherein, The material handling module also has a material gripping hook, which is rotatably mounted on a second connecting member via a rotating shaft. The second connecting member is provided with a driving member that drives the material gripping hook to rotate around the rotating shaft. The driving member has an inner cavity and a piston. The inner cavity is connected to a third air passage. The piston is movably disposed in the inner cavity. One end of the piston extends out of the inner cavity and is connected to the material gripping hook for transmission. When the third air passage is in a negative pressure state, the suction nozzle can adsorb the upper surface of the material sheet, and the material gripping hook can hook the lower surface of the material sheet.
8. The semiconductor device retrieval gripper of claim 7, wherein, The material-grabbing hook has a hook part and a swinging part. The rotating shaft is located at the connection between the hook part and the swinging part. The hook part can hook the lower surface of the material sheet. The swinging part is connected to one end of the piston and drives the hook part to move.
9. The semiconductor device retrieval gripper of claim 8, wherein, The hook has a support rod and an inclined rod. The lower end of the inclined rod is connected to one end of the support rod. The support rod is located below the suction nozzle. The swing part is L-shaped and has a horizontal rod and a vertical rod. The rotating shaft is located at the connection between the horizontal rod and the inclined rod. The vertical rod is connected to one end of the piston. During operation, the support rod abuts against the lower surface of the material sheet.
10. The semiconductor device retrieval gripper of claim 9, wherein, One end of the piston rod is provided with a pin, the axis of the pin is parallel to the axis of the rotating shaft, and the vertical rod is provided with an elongated hole extending vertically, through which the pin is movably inserted.